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Home
» Authors
Authors
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Richard Mumford, Microwave Journal International Editor, Connects with HUBER+SUHNER; Radiall; and Rosenberger
:
: Frank Cavallaro, CEO, A2 Global
2
2(Pi)-LABS GmbH Bochum, Germany
29(Pi)-LABS GmbH Bochum, Germany
2J Antenna
3
3D Glass Solutions
3D Smith Chart Tools S.R.L.
3GPP
3H Communication Systems, Irvine, Calif.
4
4G Americas
4RF Communications
5
5G Americas
7
7 layers
7Layers
A
A Mediavilla, A. Tazon, J.A. Pereda, M. Lazaro, C. Pantaleon, I. Santamaria
A. Bessemoulin, W. Marsetz, Y. Baeyens, R. Osorio, H. Massler, A. Hulsmann and M. Schlechtweg
A. Edwards, C. Park, S. Singhal, Q. Martin, K.J. Linthicum and I.C. Kizilyalli, Nitronex Corp.
A. Goñi, J. del Pino, O. Medina, S.L. Khemchandani and A. Hernández, Universidad de Las Palmas de Gran Canaria
A. Hedden, Combat Capabilities Development Command, Army Research Laboratory, Adelphi, Md.
A. Kotyukov, A. Nikonov, A. Zaslavskiy and Yu. Ivanov, Morion Inc., St. Petersburg, Russia
A. Kotyukov, Y. Ivanov and A. Nikonov, Morion Inc., Russia
A. Lázaro, M.C. Maya and L. Pradell
A. LeFevre, Thales Communications & Security SA; F. Magne, Bluwan Ltd.
A. Liero, O. Bengtsson and W. Heinrich, Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik
A. Nešić, I. Radnovicć, Z. Mićić and S. Jovanović, IMTEL Institute, Belgrade, Serbia
A. Petosa and A. Ittipiboon, Communications Research Centre Canada
A. Shoory, A. Smorgonskiy, and F. Vega, Swiss Federal Institute of Technology, Lausanne
A. Wolf and S. Garrison, Kansas City National Security Campus, Kansas City, Mo.
A. Zamanifekri and Roberto Gaddi, Cavendish Kinetics BV, The Netherlands
A.E. Ashtiani, T. Gokdemir, G. Passiopoulos, A.A. Rezazadeh, S. Nam and I.D. Robertson
A.H. Feingold, R.L. Wahlers, P. Amstutz, C. Huang, S.J. Stein and J. Mazzochette
A.M. Peláez-Pérez, J.I. Alonso and P. Almorox-González, Universidad Politécnica de Madrid, Madrid, Spain; J. González-Martín, Indra Sistemas S.A., Tor
A.P. Venguer, J.L. Medina, R.A. Chávez, A. Velázquez and A. Zamudio, CICESE Research Center; G.N. Il’in, Special Astrophysics Observatory
A.P.S. (Paul) Khanna, Phase Matrix Inc.
A.P.S. Khanna, NI Microwave Components, Santa Clara, Calif.
A.S. Virdee and B.S. Virdee
A.T. Mobashsher, M.T. Islam and N. Misran, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia
A.T. Wall
A.T. Wall Co.
A*STAR Institute of Microelectronics
A1 Microwave Ltd.
AABroadband
AAI Test & Training
Aaronia AG, Strickscheid, Germany
Abaco Systems
Abby Monaco, CID. Product and Marketing Mgr. at Intercept Technology Inc
Abdelnasser A. Eldek, Jackson State University
Abdelnasser A. Eldek, Jackson State University, Jackson, MS
Abderraouf Methlouthi Olivier Rouaud and Lionel Boillereaux
Abdullah Eroglu, Purdue University, Fort Wayne, IN
Abhay Samant, Hiller Measurements
Abhay Samant, Tanim Taher and Ian Wong, National Instruments, Austin, Texas
Abhishek Kapoor, Analog Devices Inc. Norwood, Mass.
Abhishek Tiwari, Babak Memarzadeh, Honglei Chen and George Mencoff, MathWorks
Abhishek Tiwari, product marketing and Vijayendra Kumar, product marketing
Abhishek Tiwari, Sara James and Landan Rubenstein, MathWorks
Abhishek Tiwari, Shashank Kulkarni, and Sourabh Joshi, MathWorks
ABI Research
ABI Research
Abigail Eisenklam Qorvo, Inc. and Vanderbilt University, Charles Trantanella Qorvo, Inc.
Abilis Systems
Abinash Sinha, Reiner Stuhlfauth and Fernando Schmitt, Rohde & Schwarz, Munich, Germany
ABIresearch®
Abolfazl Azari
Abracon Corp.
ACB
Accel Instruments, Irvine, Calif.
Accel-RF
Accel-RF Instruments Corp., San Diego, Calif.
Acceleware
Accellera
ACCO Semiconductor, Inc.,
Accumet Engineering Inc.
Ace Antenna Co.
AceAxis
Acentury, Richmond Hill, Ontario
ACG Research
Active Spectrum
Adam Baddeley
Adaura Technologies, Roseville, Calif.
Adel Barakat, Ahmed Allam and Adel B. Abdel-Rahman, Egypt-Japan University of Science and Technology
Adel Kouki, Fakher Sboui and Lassaad Latrach, University of Tunis El Manar, Tunis, Tunisia
ADI
Adrian O’Connor, CEO, Benetel
Adrian Sutinjo and Edwin Tung, Murandi Communications Ltd.
Advanced Linear Devices Inc.
Advanced Microwave Technologies Inc., ADVANTECH
Advanced Switch Technology
Advanced Test Equipment Rental
Advantage Electronic Product Development
Advantech Wireless
Advantech, Advanced Microwave Technologies Inc.
Advantest America Measuring Solutions Inc, Edison, NJ
Advantest Corp.
AEM Inc.
Aeris Communications
Aeroflex
Aeroflex / Metelics, Londonderry, NH
Aeroflex / Weinschel, Frederick, MD
Aeroflex and Centro de Tecnología de las Comunicaciones
Aeroflex Comstron
Aeroflex Holding Corp.
Aeroflex Inc.
Aeroflex Limited
Aeroflex Ltd.
F. Rodriguez-Morales, S. Gogineni, F. Ahmed, C. Carabajal, A. Paden, C. Leuschen, J. Paden and J. Li, University of Kansas, Lawrence, Kan.; W. Fields, Cobham/ Aeroflex Metelics, Sunnyvale, Calif.; J. Vaughan, Los Alamos National Laboratory, Albuquerque, New Mexico
Aeroflex Test Solutions
Aeroflex Test Solutions, Instruments Division
Aeroflex-KDI Integrated Products
Aeroflex-Metelics
Aeroflex/7 layers
Aeroflex/Inmet
Aeroflex/Inmet, Ann Arbor, MI
Aeroflex/Metelics
Aeroflex/Weinschel Inc.
AeroVironment Inc.
Aethercomm
Aethercomm Imc.
Aethercomm Inc., Carlsbad, CA
Aethercomm Inc., San Marcos, CA
Aethercomm, Inc.
AFP
Afshin S. Daryoush, Kai Wei, Tianchi Sun and Li Zhang, Drexel University, Philadelphia, Pa., USA
Afshin S. Daryoush, Tianchi Sun and Nicholas Bromhead, Drexel University
Afshin S. Daryoush, Tianchi Sun, Kai Wei and Francis T. Pantano, Drexel University, Philadelphia, Pa.
Afshin S. Daryoush(1), Ajay Poddar(2), Tianchi Sun(1), and Ulrich L. Rohde(2), Drexel University(1); Synergy Microwave(2)
AFT Microwave GmbH
Agfa
Agile Microwave Technology Inc.
Agilent
Agilent EEsof
Agilent EEsof EDA
Agilent EEsof EDA Santa Rosa, CA
Agilent EEsof EDA, Santa Clara, CA
Agilent Technologies
Agilent Technologies Inc. and NXP Semiconductors
Agilent Technologies Inc., Santa Clara, CA
Agilent Technologies Inc., Santa Clara, CA
Agilent Technologies Inc., Santa Clara, CA
Agilent Technologies Inc., Santa Clara, CA
Agilent Technologies/Lime Microsystems
Agilent Technoologies
Agilent White Paper
AHAM
Ahmed Toaha Mobashsher1,2 and Rabah W. Aldhaheri1, King Abdulaziz University1, Jeddah, Saudi Arabia The University of Queensland2, Brisbane, Australia
Ahmet Sertbas, Istanbul University
David Aichele, Akoustis Technologies
AIM UK
Aimeric Bisognin, University Nice-Sophia Antipolis and ST Microelectronics
Air Force Research Laboratory SBIR
Airbiquity Inc.
Airbus Defence and Space
Airbus Group
Airbus Military
Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave Corp., Paterson, N.J.
Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave Corporation, USA
Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave, N.J., U.S.
Ajay K. Poddar, Synergy Microwave Corporation, Paterson, N.J., U.S.
Ajay K. Poddar, Synergy Microwave, Paterson, N.J.
Ajit Pai, FCC Chairman
Akash Systems Inc., San Francisco, Calif.
Aki Nakatani and Lawrence Williams, Ansoft Corp.
Akoustis
Alain Michel
Alain Michel, Ansoft LLC
Alain Michel, Erwan Lecomte, ANSYS
Alan J. Fenn, MIT Lincoln Laboratory
Alan Jenkins, Tyco Electronics, M/A-COM Products
Alan Lindner, StratEdge Corp.
Alan Noll
Alan Salari, Quaxys LLC, Vienna, Va.
Alan Thompson and Martin Thompson, Eureco Technologies Ltd., Ryde, Isle of Wight, U.K.
Alan Victor and Walter Nagy, Nitronex Corp., Durham, NC
Alastair Upton and Ian Gresham, Anokiwave, Billerica, MA
Alastair Upton and Victor Steel RFMD Inc. Greensboro, NC
Albert J. Klappenberger and William B. Lurie
Albert Jerng, RFIC 2012 General Chairman
Alberto Asensio, José Luis Serrano, Javier Gismero and Alvaro Blanco Universidad Politécnica de Madrid, Department of Signals Systems and Radiocommuni
Alberto Asensio, Jose Luis Serrano, Javier Gismero and Alvaro Blanco, Universidad Politecnica de Madrid
Albrecht Telecommunications GmbH, Hunenberg, Switzerland
Alcatel
Alcatel Alenia Space
Alcatel Lucent
Alcatel Telecom Radio, Space & Defense Division
Alcatel-Lucent
Alcatel-Lucent and EADS (DS)
Alcatel-Lucent/Indra
Alejandro Buritica, National Instruments, Austin, Texas
Alereon Inc.
Alessandro Scannavini, Lars J. Foged, Meryam Abou El Anouar, Nicolas Gross, John Estrada
Alex Blenkinsop, Saint-Gobain, Merrimack, N.H.
Alex D. Lapidus
Alex D. Lapidus and Chris Rossiter, L3 Communications Narda Microwave-West
Alex D. Lapidus; L3 Communications Narda-West; Folsom, CA
Alex Lapidus, L-3 Communications, Narda Microwave-West
Alexander Chenakin Phase Matrix Inc. San Jose, CA
Alexander Chenakin, Micro Lambda Wireless Inc., Fremont, Calif.
Alexander Chenakin, Phase Matrix Inc., San Jose, CA
Alexander Chenakin, Phase Matrix/National Instruments
Alexander Chenakin, Suresh Ojha and Sadashiv Phadnis, Anritsu Company, Morgan Hill, Calif.
Alexander Chenakin, Vice President, Phase Matrix Signal Sources
Alexander E. Braun
Alexander Yarovoy
Alexandra Foley, COMSOL Inc., Burlington, MA
Alexandre Manchec, Yann Clavet, Eric Rius, Abbas Elmostrah, Elliptika
Alexis Allegra and Michael Spinali, RADX Technologies, San Diego, Calif.; David Carey, Wilkes University, Wilkes-Barre, Pa.
Alfonso J. Zozaya, Eduard Bertran, Alberti and Jordi Berenguer-Sau
Alfred Grayzel, Planar Monolithics Industries Inc.
Ali A. Rezazadeh, EuMIC 2011 Conference Chair
Ali Abuelma’atti
Ali Darwish
Ali M.T. Abuelma'atti and Ian Thayne, University of Glasgow, Glasgow, Scotland; Muhammad Taher Abuelma'atti, King Fahd University of Petroleum and Min
Ali Zamanian
Alice Ford-Hutchinson, Product Manager, Acceleware Corp.
ALifecom
Aline Friedrich and Bernd Geck, Leibniz Universitat Hannover; Malte Fengler, LPKF Laser & Electronics AG
Allan R. Scott
Allen Chien
Allen Henley, Agilent Technologies Inc.
Allen Katz
Alliance for Wireless Power (A4WP)
Alpha Industries
Alpha Industries Inc.
Alpha Micro Wireless
Alpine Investors
Alta Devices
Altair
Altair Development S.A. (Pty) Ltd.
Altair Engineering Inc., Troy, Mich.
Altair Semiconductor
Altair/FEKO, Troy, Mi.
Altaria Services
Altice
Altis Semiconductor
Altium Ltd.
Altum RF
Alvarion Technologies
Amalfi Semiconductor Inc.
Amanda MacArthur, Mequoda.com
Amarpal (Paul) Khanna, National Instruments, Santa Clara, Calif.
AMCAD
AMCAD Engineering
AMCAD Engineering, Limoges, France
Amcom Communications
Ameer Taimour Khan, Muhammad Ali Riaz, Humayun Shahid and Yasar Amin, University of Engineering and Technology, Taxila, Pakistan
AMERGINT Technologies, Colorado Springs, Colo., Abaco Systems, Huntsville, Ala.
America II Electronics Inc.
American Microwave Corp.
American Standard Circuits
American Technical Ceramics
AMETEK
AMETEK Inc.
AMETEK NSI-MI Technologies
Amina Otmani, Naima Benmostefa and Bouchra Rahali, University of Tlemcen, Algeria
Amir Effendy Muhammad-Afifi and Widad Ismail, Universiti Sains, Pulau Pinang, Malaysia; Jit Singh Mandeep, Universiti Kebangsaan, Darul Ehsan, Malaysi
Amirhossein Ghaderi and Saeed Roshani, Islamic Azad University
Amit Bahl, Sierra Circuits, Sunnyvale, Calif.
Amit Gulhane, Assistant Manager, and Tejaswi Singh, Analyst, A&D Group at MarketsandMarkets
Amit Rawal, Monash University, Clayton, Victoria, Australia
Amitava Ghosh, Nokia Bell Labs, Arlington Heights, Ill.
Amitava Ghosh, Rapeepat Ratasuk and Anil M. Rao, Nokia Bell Labs, Naperville, Ill.
AML Communications
AML Communications Inc.
AMO/SUSS MicroTec
Amolak Singh Badesha; Agilent Technologies, EEsof, Santa Rosa, CA
Amp’ed RF Inc.
Amphenol Connex
Amphenol Industrial Global Operations
Amphenol Invotec Ltd.
Amphenol RF, Danbury, Conn.
Amphenol RF, Danbury, CT
Ampleon and RFMW
Ampleon, Nijmegen, Netherlands
Amplical Corp., Whippany, N.J.
Amplidyne Inc.
Amplifier Research
Amplifier Solutions Corp.
Amplifier Technology
AmpliTech and PMI
AmpliTech Inc.
ams AG
ANADIGICS
ANADIGICS Inc.
Analod Devices
Analog Devices
Analog Devices
Analog Devices
Analog Devices Inc.
Analog Devices Inc., Norwood, Mass.
Analog Devices Inc., Norwood, Mass.
Analog Devices Inc., Norwood, Mass.
Analog Devices, Inc., Wilmington, Mass.
Analog Devices, Norwood, Mass.
Analogic Corporation
Analysys Mason
AnaPico
AnaPico AG
AnaPico AG, Glattbrugg, Switzerland
AnaPico AG, Zurich, Switzerland
AnaPico AG, Zurich, Switzerland
AnaPico Inc., Zurich, Switzerland
Anapico Ltd.
AnaPico Ltd., Glattbrugg, Switzerland, BNC, San Rafael, Calif.
AnaPico Ltd., Zurich, Switzerland
AnaPico Ltd., Zurich, Switzerland; Berkeley Nucleonics, San Rafael, Calif.
AnaPico of Switzerland
Anaren
Anaren Inc., East Syracuse, NY
Anaren Inc., Syracuse, N.Y.
Anaren Microwave Inc.
Anaren Microwave Inc., E. Syracuse, NY
Anaren, Syracuse, NY
Anatech Electronics
Anatoli Stein and Lauri Viitas (measurements performed by Vasily Morozov, Software by Alexey Egorov and Alexander Bolotov)
Ancortek Inc., Fairfax, Va.
Song Chengtian, Beijing Institute of Technology, Beijing, China Zhang Xiangjun, Zhou Li and Ma Xiaoping China University of Mining and Technology, Xuzhou, China
and University of Wisconsin-Madison(2)
Kristen Anderson
Anderson Power Products®
Andrea Arias-Purdue and Petra Rowell, Teledyne Technologies, Thousand Oaks, Calif.
Andreas Barchanski, CST AG, Germany, Jens Krämer, Pietro Luzzi, Festo AG, Germany
Andreas Gronefeld, Ingenieurbüro Gronefeld, Germany
Andreas Roessler and Sandra Merkel, Rohde & Schwarz, Munich, Germany
Andreas Roessler, Rohde & Schwarz, Munich, Germany
Andreas Rossler and Meik Kottkamp, Rohde & Schwarz, Munich, Germany
Andrei Grebennikov
Andrei Grebennikov, Alcatel-Lucent, Dublin, Ireland
Andrei Grebennikov, M/A-COM Eurotec Operations
Andrei Grebennikov, M/A-COM Eurotec Operations, Cork, Ireland
Andrei Müller, Dan C. Dascalu, IMT-Bucharest; Pablo Soto, Vicente E. Boria, University Politécnica de Valencia
Andrej Rumiantsev and Jean-Pierre Teyssier, 2018 Spring ARFTG Technical Program Committee Co-Chairs
Andrej Rumiantsev, Toe Naing Swe, MPI Corp., Hsinchu, Taiwan; Andreas Henkel, Rohde & Schwarz, Munich, Germany
Andrej Rumiantzev and Kooho Jung, MPI Corp., Hsinchu, Taiwan
Andrew
Andrew Corp.
Andrew Edwards, Bernard Geller and Isik C. Kizilyalli, Nitronex Corp.
Andrew Gibson, General Chairman of EuMW 2016; Ivar Bazzy, President, Horizon House Publications
Andrew Gorevoy, Micran, Tomsk, Russia
Andrew Laundrie, Eravant, formerly Sage Millimeter Inc., Torrance, Calif.
Andrew Laundrie, Eravant, Torrance, Calif.
Andrew Laundrie, Eravant, Torrance, Calif.
Andrew Solutions
Andrew Solutions Inc.
Andrew Ware
Andrew®
Andrew®
Andrey V. Grebennikov
Andria Elliott, Corporate Content Manager at National Instruments
Andrzej Sawicki, Ericsson AB
Andy Botka, Agilent Technologies Inc.
Andy Singer
Andy Singer, Radio Waves Inc.
Aniket Roy, Stratview Research, Detroit, Mich.
Anil Kollipara, Spirent Communications
Anite plc
Anite, part of Keysight Technologies
Anoison
Anoison
Anokiwave
Anokiwave (now Qorvo)
Anokiwave Inc., San Diego, Calif.
Anouk Hubrechsen and Teun van den Biggelaar, ANTENNEX B.V., Eindhoven, The Netherlands
Anritsu Co.
Anritsu Co., Morgan Hill, CA
Anritsu Co., Morgan Hill, Calif.
Anritsu Company
Anritsu Corp. and SATIMO
Anritsu Corp., Morgan Hill, Calif.
Anritsu Corp./Emite
Anritsu Corporation
Anritsu White Paper
Anritsu Wiltron Co.
Anritsu, Morgan Hill, Calif.
Anritsu, Morgan Hill, Calif.
Anritsu/Verios
Ansoft
Ansoft Corp.
Ansoft Corp., Pittsburgh, PA
Ansoft Corporation
Ansoft, Pittsburgh, PA
ANSYS
ANSYS Inc.
ANSYS Inc., Pittsburgh, Pa.
ANSYS, Canonsburg, Pa.
Ansys, Inc., Canonsburg, Pa.
Antenova
Antenova Ltd.
Anthony Beasley and Walter Brisken, National Radio Astronomy Observatory, Charlottesville, Va.
Anthony Collins, Harpinder Matharu and Ehab Mohsen, Xilinx Inc., San Jose, Calif.
Anthony Sweeney, Endwave Corp., San Jose, CA
Antoine Bonnabel and Cédric Malaquin, Yole Développement (Yole), Lyon, France
Antoine Rabany
Antonio Ciccomancini Scogna, CST of America, Framingham, MA; Jianmin Zhang, CISCO Systems, San Jose, CA
Antonio Mendes and Augusto Moita de Deus, CeFEMA, Instituto Superior Técnico, Universidade de Lisboa, Lisboa, Portugal
Antti Manninen, VTT, Finland
Anurag Bhargava, ISRO
APA Wireless
Aparna M.A, Kings Research, Dubai, UAE
APEI
API Technologies
API Technologies Corp.
API Technologies, Weinschel, Frederick, Md.
APLAC Solutions Corp.
APLAC Solutions Inc.
APLAC Solutions Oy
Application Brief, California Eastern Labs (CEL)
Application Note
Application Note, Anatech Electronics
Application Note, Anritsu
Application Note, Focus Microwave
Application note, Micro-Coax
Applied Engineering Products (AEP)
Applied Radar Inc.
Applied Research Associates Inc.
Applied Wave Research
Applied Wave Research (AWR)
Applied Wave Research Inc.
Applied Wave Research Inc. (AWR)
AR
AR Electronic Conversion Poster
AR Europe
AR Modular
AR Modular RF
AR RF/Microwave Instrumentation
AR RF/Microwave Instrumentation
AR RF/Microwave Instrumentation
AR RF/Microwave Instrumentation
AR RF/Microwave Instrumentation
AR RF/Microwave Instrumentation
AR RF/Microwave Instrumentation, Application Note
AR RF/Microwave Instrumentation, Souderton, PA
AR Worldwide
AR Worldwide – Modular RF, Bothell, WA
AR Worldwide Modular RF
AR Worldwide RF/Microwave Instrumentation
Arbe Robotics, Tel Aviv-Yafo, Israel
ARC International
ARC Technologies
Archie W. Straiton & Charles W. Tolbert
Ardent Concepts Inc., Hampton, N.H.
Arkivator Telecom
Arlon
Arlon Inc.
Arlon, Materials for Electronics Division
ARMMS
ARMMS RF & Microwave Society
ARMMS RF and Microwave Society
Arne Jacob, General Chairman of EuMW 2017; Ivar Bazzy, President, Horizon House Publications
Arralis
Arralis Technologies, Swindon, U.K.
Arrow Electronics, Inc.
Arrow RF & Power
Arrowhead Global Solutions
Art Aguayo, Rogers Corp., Chandler, Ariz.
Art Schaldenbrand, Cadence Design Systems, San Jose, Calif.
ART-Fi
Artech House Inc.
Artem Saakian
Arthur Pini, Independent Consultant; Greg Tate and Oliver Rovini, Spectrum GmbH, Grosshansdorf, Germany
Arvind Kumar, Vellore Institute of Technology, Vellore, India
ASC Signal Corp.
ASDReports
Aselsan
Ashish Chaudhari and David Squires, National Instruments, Austin, Texas
Ashkan Mashhour
Ashkan Mashhour and Assaad Borjak
Ashkan Mashhour, William Domino, Norman Beamish
Ashraf Sheri and Arnold S. de Beer
Ashraf Sheria and Arnold S. de Beerb
Ashutosh Kedar, Defence Research & Development Organization, Bangalore, India
Ashutosh Kedar, Electronics & Radar Development Establishment (LRDE), Bangalore, India
Ashwin Prasad, National Instruments
ASIC North Inc.
Asif Anwar, Director at Strategy Analytics
Asif Anwar, Director, Strategy Analytics
Asif Anwar, Program Director, Strategy Analytics
Asif Anwar, Strategy Analytics, London, UK
Asif Anwar, Strategy Analytics, Newton, Mass.
Asif Anwar, TechInsights, Milton Keynes, England
Aspen Electronics
Assaad Borjak and Taoufik Bourdi
Astrium
Astrium Services/Thales Alenia Space
Astrodyne Corp.
Astrodyne TDI
Astrolab
Astronics Test Systems Inc.
AT&T Inc.
AT4 wireless
ATE Systems
Atlanta Micro, Inc.
AtlanTecRF, Braintree, Essex, UK
AtlanTecRF, Braintree, U.K.
Atlantic Microwave Ltd.
Atmel® Corp.
ATW Companies
Augusto Panella
Auriga Measurement Systems LLC, Lowell, MA
Auriga Microwave
Auriga Microwave
Aurora Andújar, José L. Leiva, Fractus Antennas
Autoliv, Inc.
Autotalks
AUVSI
Avago
Avago Technologies
Avago Technologies Inc.; San Jose, CA
Avago Technologies, San Jose, CA
Avanti Communications Group
Averna
Avi Brillant
Aviat Networks
Aviat Networks Inc.
Aviel Electronics
Avik Santra, Ismail Nasr and Julie Kim, Infineon Technologies
Avishtech, LLC San Jose, Calif.
Aviv Ronai CMO, Ceragon Networks, Ltd.
Aviv Ronai, Chief Marketing Officer, Ceragon Networks
Aviv Ronai, CMO, Ceragon Networks Ltd.
Aviv Ronai, Ron Nadiv and Tsachi Rosenhouse
Avtar S. Virdee and Bal S. Virdee
Avu Brilliant and David Pezo
AVX Corp., Fountain Inn, S.C.
AWR
AWR and Anritsu Co.
AWR and Rohde & Schwarz
AWR Corp.
AWR Corp., El Segundo, CA
AWR Corp.and Antenna Magus
AWR Group, NI, El Segundo, Calif.
AWR, A National Instruments Company
AWR® Corp.
AWR® Corp. and LFoundry GmbH
AWT Global
Axell Wireless
AXIe Consortium
Aymen Ghorbel, Ezgi Dogmus and Poshun Chiu, Yole Intelligence, Lyon, France
Azimuth Systems, Acton, Mass.
B
B. Buchin and R. Leschhorn, Rohde & Schwarz GmbH
B. Come, R. Ness, S. Donnay, L. Van der Perre, W. Eberle, P. Wambacq, M. Engels, I. Bolsens
B. Debaillie, B. Come, W. Eberle, S. Donnay and H. Minami
B. Eged, R. Fiengo, F. Persia and S. Thompson, National Instruments, Austin, TX
B. Gellar, B. Thaler, A. Fathy M.J. Liberatore, H.D. Chen, G. Ayers, V. Pendrick and Y. Narayan
B. Guillaume, J. Mabire, P. Maurin, D. Reffet, F. Chirol and E.K. Polzer
B. Kaltalioglu, H. Takahashi, A. B. Alothman Alterkawi and C. Vockenberger, AT&S, Leoben, Austria
B. Kapilevich
B.D. Shank, J.A. Heilman and A.J. Dahm
B.S. Virdee
BAE Systems Microelectronics Center, Nashua, N.H.
Baidu
Baker IDI
Baljit Chandhoke, Microchip Technology, Chandler, Ariz.
Ball Aerospace
Ball Aerospace & Technologies Corp.
Bantam Instruments
Bao Lu, Xi Gong, Jin Ling and Hong Wei Yuan, Xidian University, Xi’an, China
Bar-Giora Goldberg
Barney Arntz
Barry Alcorn, Agilent Technologies, Inc.
Barry Industries Inc.
Barry Trimmer, Thales Defence Mission Systems Business, Redhill, UK
Basel F. Azzam
BC Systems
Beceem Communications
Beecham Research
Ben Pawling, Harris CapRock and Keith Olds, Harris Government Communications
Ben Thomas and Jackie Johnson; RFMD, Greensboro, NC
Ben Thomas, Qorvo
Benchmark
Ryan Benech
Bengt Svensson, Goran Snygg and Per Holmberg
Benjamin Annino, Analog Devices, Wilmington, Mass.
Benjamin Annino, Analog Devices, Wilmington, Mass.
Benjamin Dannan, Diversey, Inc.
Benjamin Fernald and Greg Gonzales, NI, Austin, Tex.
Benjamin McMahon, BAE Systems, Nashua, N.H.
Benjamin Walter and Fuanki Bavedila, V-Micro SAS, Villeneuve d’Ascq, France
Benoit Derat, Bastian Balk and Jose M. Fortes, Rohde & Schwarz, Munich, Germany
Benoît Derat, Corbett Rowell, Adam Tankielun and Sebastian Schmitz, Rohde & Schwarz, Munich, Germany
Benoit Derat, Mert Celik and Sebastian Schmitz, Rohde & Schwarz, Munich, Germany
Benqing Guo, Shiquan An, No.38 Research Institute of CETC; Guoning Yang, Qualcomm Atheros Co. Ltd.
Benson D. Evans, PhD
Benson D. Evans, PhD, Managing Director, www.rfjobstoday.com
BeRex, Inc.
Berkeley Nucleonics Corp., San Rafael, Calif.
Berkeley Nucleonics Corporation, San Rafael, Calif.
Berkeley Nucleonics Corporation, San Rafael, Calif.
Berkeley Varitronics Systems Inc.
Bernard Prkic’, DragonWave, Ottawa, Canada
Bernd Heinemann and Alexander Fox, IHP, Frankfurt, Germany
Bertalan Eged, Raffaele Fiengo and David A. Hall, National Instruments, Austin, Texas
Bertan Bakkaloglu, RFIC 2015 General Chair; Albert Wang, Technical Program Chair; Kevin Kobayashi, Technical Program Co-Chair
Bertram Arbesser-Rastburg, General Chairman, EuMW 2012; Ivar Bazzy, President, Horizon House Publications
Bertrand Parvais and Hao Yu, imec, Leuven, Belgium
BeSpoon
BethelTronix Inc. (BTI)
BFi OPTiLAS
Bhawani Shankar
Bilal Habib, Muhammad Shoaib Arif and Mujahid Mohsin, National University of Sciences and Technology, Islamabad, Pakistan
Bill
Bill Anklam, Victor Grothen and Doug Olney, Agilent Technologies, Santa Clara, CA
Bill Goumas and Peter Forth, Ampleon, Nijmegen, The Netherlands and Smithfield, R.I.
Bill Jennewein
Bill Linstrom, Jackson Barnard and Jane Rogan, VIDA Products, Rohnert Park, Calif.
Bill Linstrom, Ron Parrott and Allen Sweet, VIDA Products, Rohnert Park, Calif.
Bill McKenney, Analog Devices, Wilmington, Mass.
Bill Oldfield
Bill Pribble and Yueying Liu, Wolfspeed, Durham, N.C.
Bill Reid, National Instruments, Austin, TX
Bill Rosas, Signal Microwave USA, Tempe, Ariz.
Bill Rosas, Southwest Microwave
Bill Rosas, Southwest Microwave Inc.
Bin Song, Songbai He, Jun Peng, Wenman Zou, University of Electronic Science and Technology of China, Chengdu
Bin Yu, Kang Yang and Guangli Yang, Shanghai University, Shanghai, China
Bing Li and Jing-Song Hong, University of Electronic Science and Technology of China, Chengdu, China
Binqi Yang, Zhiqiang Yu, Jianyi Zhou and Yunyang Dong, State Key Laboratory of Millimeter Waves, Southeast University, Nanjing, China
Bird Technologies
BJG Electronics Inc.
BL Microwave
Marleah Blades
Blighter Surveillance Systems
Bliley Technologies
Bliley Technologies Inc., Erie, Pa.
Blu Wireless Technology
Blue Cell Technology
Bluetest
Bo Marr and Bill Dower, Epirus, Hawthorne, Calif.
Bob Buxton, Boonton Electronics, Parsippany, N.J.
Bob Buxton, Boonton Electronics, Parsippany, N.J.
Bob Koupal, Marshall Wang and Cory Edelman
Bob McLaughlin and Kipp Schoen, Picosecond Pulse Labs (PSPL)
Bob Muro, Pentek Inc.
Bob Stern, Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business, Santa Rosa, Calif.
Bob Thiele and Stan Hardin, Dynawave Cable Inc., Haverhill, MA
Bob VanBuskirk
Boeing
Boeing Defence Australia
Bogdan Sadowski, Harris Stratex Networks Inc.
Bonding Source
Bonding Source
Boonton
Boonton, Parsippany, N.J.
Boram Lee and Sungtek Kahng, University of Incheon
Boris Aleiner, boris_aleiner@hotmail.com, Nijmegen, The Netherlands
Boris Aleiner, Motorola
Boris Aleiner, Nijmegen, The Netherlands
Boris Aleiner, Petra Solar, South Plainfield, NJ
Boris Sheyer
Boston Micro Foundation
Brad Cole and Roy Zohrabian, ATE Systems, N. Billerica, Mass.
Brad Frieden, Keysight Technologies Inc., Santa Rosa, Calif.
Bradley K. Benton
Brandon Malatest, Per Vices, Toronto, Canada
Brendon McHugh
Brendon McHugh, Per Vices, Toronto, Canada
Brent Campbell, Marketing Communications Specialist
Brent Dietz, Brent's Musings
Brent Dietz, Brent's Musings
Brett Chermansky, JFW Industries Inc., Indianapolis, IN
Brian Avenell, National Instruments Corp., Austin, TX
Brian Battaglia
Brian Battaglia, Dave Rice, Phuong Le and Mike Purchine, HVVi Semiconductor
Brian Cheng
Brian Coaker and Tony Challis, e2v
Brian Coaker, e2v Technologies Ltd., Chelmsford, Essex, UK
Brian D. Battaglia, Integra Technologies, El Segundo, CA
Brian D. Battaglia, Jeff Burger and John Titizian
Brian Drozd and William T. Joines, Duke University
Brian Floyd, Osama Shana’a and Donald Y.C. Lie, RFIC2021 General Chairs
Brian Heater, TechCrunch
Brian S. Collins
Brian Walker, Copper Mountain Technologies, Indianapolis, Ind.
Brian Walker, Copper Mountain Technologies, Indianapolis, Ind.
BridgeWave Communications
Broadband Antenna Tracking Systems and DragonWave Inc.
Broadband Wireless
Broadcom
Brock J. LaMeres and T.S. Kalkur
Bror Peterson and David Schnaufer, Qorvo, Greensboro, N.C.
Bror Peterson, Qorvo, Greensboro, NC
Bruce A. Kopp, Elizabeth A. Ouellette and Amy J. Billups
Bruce Hemp and Peter Stroet, Linear Technology Corp., Milpitas, Calif.
Bruce Marks, Mini-Circuits
Bruce P. Mahler
Bruno Pattan, Federal Communications Commission
Brush Ceramic Products Inc.
Brush Engineered Materials Inc.
Bryan Goldstein, General Manager Aerospace and Defense, Analog Devices
Bryan Walker, JFW Industries, Inc., Indianapolis, Ind.
BSC Filters Ltd., York, England
BTI Systems and DragonWave
Bud Noren, Agile Materials & Technologies
Burak Tasci, Vocational School of Technical Sciences, Firat University, Elazig,Turkey
Burak Taşcı, Vocational School of Technical Sciences Firat University, Elazig,Turkiye
Business Wire
BUSINESSWIRE
by Brendan P. Rivers, Attleboro, MA
By David Strand, Strand Marketing Inc.
by Doug Allen, Telecommunications® Online
by Ek Heng, Asia-Pacific Correspondent, Telecommunications® Online
By Jack Daniels, EastBridge Partners LLC, Brookline, MA
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by Kendrick Struthers-Watson, Telecommunications® Online
By Melissa Drozdowski, Social Media Evangelist, Interprose Public Relations
By Raghu Das, CEO, IDTechEx
Byung-Jun Jang
Byung-Jun Jang, In-Bok Yom and Moon-Que Lee
Byung-Jun Jang, In-Bok Yom and Seong-Pal Lee
C
C-MAC MicroTechnology
C. Fulton, R. Palmer, M. Yeary, J. Salazar and H. Sigmarsson, University of Oklahoma, Advanced Radar Research Center, Norman, Okla.
C. Oakley, Michigan State University, East Lansing, Mich.
C. Quemada, H. Solar and G. Bistué, Centro de Estudios e Investigaciones Técnicas de Gipuzkoa San Sebastián, Spain <br>J. de No and I. Sancho,Escuela
C. Tsironis and N. Misljenovic, Focus Microwaves
C.B. Dietrich, Jr., R.M. Barts, W.L. Stutzman, W.A. Davis
C.L. Wei, B.F. Jia, Z.J. Zhu and M.C. Tang, University of Electronic Science and Technology of China, Chengdu, China
C.S. Whelan, P.F. Marsh, W.E. Hoke, S.M. Lardizabal, R. Leoni III, K.C. Hwang and T.E. Kazior
C.Y. Su, S.J. Chang, L.P. Chen, Y.P. Ho, G.W. Huang, D.C. Lin, B.M. Tseng, H.Y. Lee, J.F. Kuan, Y.M. Deng, K.A. Wen, C.Y. Chang
CableLabs
Cadence
Cadence
Cadence
Cadence | AWR
Cadence Design Systems
Cadence Design Systems Inc., San Jose, Calif.
Cadence Design Systems, Inc., San Jose, Calif.
Cadence, El Segundo, Calif.
Cadence, San Jose, Calif.
CAES
Caixia Chen, Manh Anh Do, Kiat Seng Yeo, Chirn Chye Boon and Wei Meng Lim, Nanyang Technological University
Calex Mfg. Co. Inc.
California Eastern Laboratories
California Eastern Laboratories
Cambium Networks
Cambium Networks
Cambridge Broadband Networks
Cambridge Broadband Networks Ltd.
Cambridge Consultants
Cambridge Instruments
Cambridge Pixel
Cameron Foley-Molivinsky, Times Microwave Systems, Mesa, Ariz.
Cameron Sheth
Camille Cox, President, OnRamp Communications
Camstar Systems Inc.
Canalys
CAP Wireless
CAP Wireless Inc. Newbury Park, CA
CAP Wireless Inc., Newbury Park, CA
Capella Intelligent Subsystems Inc.
CapRock Government Solutions
Carbonics Inc.
Carissa Sipp, Texas Instruments, Dallas, Texas
Carl De Ranter and Khaled Khalaf, Pharrowtech
Carl Falcon, AMI Semiconductor
Carl L. Everett, Bell Helicopter Textron Inc.
Carl Sheffres, Horizon House Publications, Inc.
Carl Sheffres, Horizon House Publications, Inc.
Carl Sheffres, Microwave Journal Publisher
Carl Sheffres, Publisher
Carl Sheffres, Publisher, <i>Microwave Journal</i>
Carl Sheffres, Publisher, Microwave Journal
Carl Sheffres, Publisher, Microwave Journal
Carlisle Companies Inc.
Carlisle Interconnect Technologies, St. Augustine, Fla.
Carlisle Interconnect Technologies/ECS
Carlo Bencivenni, Abolfazl Haddadi, Abbas Vosoogh and Marcus Hasselblad Gapwaves AB, Göteborg, Sweden
Carlo Bencivenni, Thomas Emanuelsson and Magnus Gustafsson, Gapwaves AB, Gothenburg, Sweden
Carlo Kopp, Monash University
Carlos Calvo and Matthew Pilotte Analog Devices Inc. Norwood, MA
Carlos Fuentes
Carlos Fuentes, Gigatronics Incorporated
Carlson Wireless
Carlson Wireless Technologies
Carmel Instruments LLC, Campbell, Calif.
Carmine De Martino and Marco Spirito, Technische Universiteit Delft, The Netherlands
Carnegie Institution for Science
Carol L. Kory
Carousel Industries
CASAGRAS project
Cascade
Cascade Microtech
Cascade Microtech Inc.
CASSIDIAN
Cassidian/Frequentis Nachrichtentechnik GmbH
Jessy Cavazos
Cavendish Kinetics
CEA-Leti
Cecil Deisch, Tellabs Operations
Cecil W. Deisch, Tellabs
Cédric Malaquin and Antoine Bonnabel, Yole Développement
Cees Links, Qorvo, Greensboro, N.C.
CEITEC
CEL
Celcite
Celiant Corp.
Cellphone-Mate
CEMWorks, Winnipeg, Canada
CENOS, Riga, Latvia
Centellax
Centerline Technologies LLC
Ceragon
Ceragon Networks
Ceragon Networks Ltd
Ceragon Networks Ltd.
Cernex Inc.
CernexWave, San Jose, Calif.
CETECOM
CEYEAR
Ceyear, U.S. Distributors: TopDogTest and Custom-Cal Globaltech
Chalmers
Chalmers University of Technology
Champion Technologies Inc.
Chandra Hackenbruch, Analog Devices
Changhua Wan, Senior Member, IEEE and Jian-X. Zheng, Member, IEEE
Changhyeong Lee, Heejun Park and Sungtek Kahng, Incheon National University, Incheon, South Korea
Channel Microwave
Channel Microwave Corp.
Nicolas Chantier
Charles Baylis University of South Florida Tampa, FL; Lawrence Dunleavy University of South Florida and Modelithics Inc.Tampa, FL; William Clausen Mod
Charles Baylis, Lawrence Dunleavy and William Clausen
Charles Blackwood
Charles D. McCarrick
Charles Dietlein, Spectragem LLC, Bethesda, Md.
Charles Greene, Powercast Corporation, Pittsburgh, Pa.
Charles H. Cox III and Edward I. Ackerman, Photonic Systems Inc., Billerica, Mass.
Charles J. Trantanella and Paul Blount, Custom MMIC, Westford, Mass.
Charles R. Buffer and Per O. Risman
Charles Schroeder, NI, Austin, Texas
Charles Trantanella and Michael Megan, Custom MMIC, Chelmsford, Mass.
Charles Trantanella and Michael Megan, Custom MMIC, Chelmsford, Mass.
Charles Trantanella, Retired from Custom MMIC, Westford, Mass.
Charles Tumbaga, Anritsu Co.
Charles Tumbaga, Anritsu, Morgan Hill, Calif.
Charles Tumbaga, Anritsu, Morgan Hill, Calif.
Charles Walker, Conference Chair
Charles Wright, Chief Scientist, Azimuth Systems
Charlie Jackson
Chelton Microwave Corp.
Chemring Group/Roke Manor Research
Chemring Technology Solutions
Chen Zhu, Jianyi Zhou and Yanwei Wang
Zhiqun Cheng
Cheng-Chi Yen and Huey-Ru Chuang
Cheng-Chi Yen, Huey-Ru Chuang
Cheng-Ying Hsu, Chu-Yu Chen and Chuang Hao Huang, Shu-Te University
Cheng-yuan Liu, Ying-song Li, Tao Jang (also affiliated with Harbin Institute of Technology) and Xiao-dong Yang, Harbin Engineering University, Harbi
Chengdu D Fine Technology Co. Ltd.
Chengjie Su, ZongXi Tang, Biao Zhang and YunQiu Wu, University of Electronic Science and Technology of China, Chengdu
Cheuk-fai Chow, Department of Science and Environmental Studies, The Education University of Hong Kong, Hong Kong
Chi-Chang Lin, Yu-Jui Chang and Huey-Ru Chuang, National Cheng Kung University
Chia Song Wu, Hsien-Chin Chiu, Yi-Feng Lin
Chia-Shih Cheng, Hsien-Chin Chiu, Shao-Wei Lin and Jeffrey S. Fu Chang Gung UniversityTao-Yuan, Taiwan, ROC
Chia-Song Wu and Hsing-Chung Liu, Vanung University, Taiwan, ROC; Hsien-Chin Chiu and Yi-Feng Lin, Chang Gung University, Taiwan, ROC
Chia-Song Wu and Hsing-Chung Liu, Vanung University; Hsien-Chin Chiu and Wei-Hsien Lee, Chang Gung University
Chia-Song Wu, Vanung University; Hsien-Chin Chiu, Chang Gung University
Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan
Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru, Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan
Chien-Cheng Wei, Hsien-Chin Chiu and Wu-Shiung Feng, Chang Gung University
Chin-Chun Meng and Tzung-Han Wu, National Chiao Tung University
Chin-Leong Lim, Avago Technologies, Penang, Malaysia
China Mobile
China Mobile Research Institute and SkyCross
Ruofan DaiI,II,III, Yunlong ZhengI,II, Shichang ZouI,III, Weiran KongIII, Chinese Academy of SciencesI, University of Chinese Academy of SciencesII, Shanghai Huahong Grace Semiconductor Manufacturing III
Chipcon AS
Choice Communications
Shiwei Zhao, Chongqing University of Posts and Telecommunications, Chongqing, China University of Electronic Science and Technology of China, Chengdu, China
Chow-Yen-Desmond Sim, Feng Chia University, Taichung, Taiwan
Chris Aden
Chris Brinton, Matthew Wharton and Allen Katz, The College of New Jersey
Chris DeMartino, Hugo Morales and Larry Dunleavy, Modelithics Inc., Tampa, Fla.
Chris DeMartino, Modelithics Inc., Tampa, Fla.
Chris G. Morton and Chris M. Snowden
Chris Hults, Jim Stack, and M. Jeffrey Barney
Chris Loberg, Tektronix, Beaverton, OR
Chris Marshall and Bill Murphy, Richardson Electronics Ltd., LaFox, IL
Chris O'Connor
Chris Petrole
Chris Rehorn, Agilent Technologies Inc.
Chris Snow, Telecom Engine
Chris Thompson, Mercury Systems, Andover, Mass.
Chris Tojeira, Pentek Inc., Upper Saddle River, N.J.
Chris W. Liu, Morten Damgaard, Broadcom Corporation
Chris Walker, European Antennas Ltd.
Christer Stoij, Sivers IMA AB, Kista, Sweden
Christian Bachmann and Minyoung Song, imec, Leuven, Belgium
Christian Bachmann, Amirashkan Farsaei and Chris Marshall, imec, Leuven, Belgium
Christian Bean, Patrick Roblin, Vakur Ertuk and Roberto Rojas
Christian Rye Iversen
Christina Geßner; Rohde & Schwarz, Munich, Germany
Christoph Hausl, Julian Emmert, Manuel Mielke, Benjamin Mehlhorn and Corbett Rowell, Rohde & Schwarz, Munich, Germany
Christophe Didier, Eric Butaud and Sylvain Ballandras, Soitec, France
Christopher Marki
Christopher Penney and Yong Wang, Remcom Inc.
Christopher Penny, REMCOM Inc.
Christopher Snowden General Chairman, EuMW 2006; Charles A. Ayotte Horizon House Publications Inc.
Christopher T. Rodenbeck and Kai Chang, Texas A&M University; John Aubin, ORBIT/FR Inc.
Christopher T. Rodenbeck and Richard T. Knudson, Sandia National Laboratories, Albuquerque, NM
Christopher Tutt, Carlisle Interconnect Technologies
Christos Tsironis, Apostolos Samelis and Klaus Buehring
Chu-Yu Chen and Cheng-Ying Hsu
Chu-Yu Chen and Li-Mei Tu
Chu-Yu Chen, Li-Mei Tu
Chuck Swift and Les Besser
Chuck Swift with Bob Eisenhart
Chuck Wheatley
Chun-Ping Ge and Yong-Qin Liu, Weinan Normal University, Weinan, China
Chung-I G. Hsu Da-Yeh University Changhua, Taiwan, ROC, Ching-Her Lee and He-Kai Jhuang National Changhua University of Education Changhua, Taiwan, RO
Chunlan Qin, Keysight Technologies, Santa Rosa, Calif.
Chunlei Wang, Christopher T. Rodenbeck and Kai Chang, Matthew R. Coutant
Chunming Liu, Heng Xioa, Fu Li, Qiang Wu
Ciao Wireless
Ciena
Cinch Connectivity Solutions, Waseca, Minn.
Cirexx International Inc.
CirQon Technologies Corp.
Claes Beckman and Ulrik Wahlberg
Clara E. Centeno-Calero, SV Microwave Inc.
Claude M. Weil and Roger B. Marks
ClearCount Medical Solutions
Cliff Rowland, Virginia Diodes, Charlottesville, Va.
Clifford Fung, MEMS Industry Group
CMC Wireless Components
CML Microcircuits
CNBC
Coaxial Components Corp./Coaxicom
Cobham
Cobham Advanced Electronic Solutions
Cobham Antenna Systems
Cobham Antenna Systems (Microwave Antennas)
Cobham Antenna Systems, Microwave Antennas
Cobham Antennas
Cobham AvComm
Cobham plc
Cobham SATCOM
Cobham Sensor Systems
Cobham Tactical Communications and Surveillance
Cobham Technical Services
Cobham Wireless
Julien Cochard
Codan Ltd.
Cohda Wireless
Coherent Solutions Ltd.
Cohort
Coilcraft
Coilcraft CPS
Colby Hobart Fortify, Boston, Mass.
Colby Hobart, Fortify
Colin Warwick, Signal Integrity Product Manager, Agilent EEsof EDA
Colonial Assembly and Design LLC
Colonial Assembly and Design LLC
COM DEV International Ltd
COM DEV Ltd.
COM DEV USA LLC
Comchip Technology Corp.
CommAgility, A Wireless Telecom Group Company, Loughborough, U.K.
CommAgility, Loughborough, U.K.
CommQuest
CommScope
CommScope
CommScope Inc.
Communication Power Corp. (CPC), Hauppauge, N.Y.
Communication Solutions Inc.
Communications & Power Industries
Communications & Power Industries
Communications & Power Industries (CPI) LLC, Palo Alto, Calif.
Communications & Power Industries Canada Inc. (CPI Canada)
Communications & Power Industries Canada Inc. (CPI)
Communications & Power Industries Inc.
Communications & Power Industries LLC
Communications & Power Industries LLC, Beverly Microwave Division
Company ABC
Compass Technology Group, Alpharetta, Ga.
Compiled by Richard Mumford, Microwave Journal International Editor
Component Distributors Inc.
COMPRION
Computer Simulation Technology
Computer Simulation Technology (CST), Darmstadt, Germany
Computer Simulation Technology AG
COMSAT RSI, Anghel Laboratories
Comsearch
COMSOL
COMSOL Inc., Burlington, Mass.
COMSOL, Inc., Burlington, Mass.
Comtech PST, Melville, N.Y.
Comtech Systems, Inc.
Comtech Telecommunications
Comtech Telecommunications Corp
Comtech Telecommunications Corp.
Comtech Xicom Technology
ConcealFab
Conduct RF
ConductRF
ConductRF, Methuen, Mass.
Cong Wang, Won-Sang Lee and Nam-Young Kim Kwangwoon University, Seoul, Korea, NanoENS Co. Ltd., Gyeonggi, Korea
Connects with HUBER+SUHNER; Radiall; and Rosenberger
Constant Wave, Colorado Springs, CO
Contributions by Altair, ANSYS, Cadence/AWR, Keysight and MathWorks
Contributions from: Akoustis Technologies, OnScale, Resonant
Copper Mountain Technologies
Copper Mountain Technologies, Indianapolis, In.
Copper Mountain Technologies, Indianapolis, Md.
Cor Schepens and Roberto Gaddi, Cavendish Kinetics
Corbett Rowell, Benoit Derat and Adrián Cardalda García, Rohde & Schwarz, Munich, Germany
Corbett Rowell, Rohde & Schwarz, Munich, Germany
Cornelius Mayaka, Yonghui Shu and Dhanraj Doshi, Eravant, Inc., Torrance, Calif.
Cornell Dubilier
Corning Gilbert
Ulrich Rohde1,2, Ajay Poddar1,2 and D. Sundararajan3, Brandenburgische Technische Universitat1, Cottbus, Germany; Synergy Microwave Corp.2, Paterson, NJ; SJCET3, Palghar, India
Coupling Wave Solutions S.A.
CPI Aerostructures Inc.
CPI Beverly Microwave Division
CPI Electron Device Business
CPI International Inc.
Craig Blanchette and Rich Rochford, BAE Systems, Nashua, N.H.
Craig Hendricks, Anritsu Company, Morgan Hill, Calif.
Craig Moore and Bruce Kopp
Craig Sapashe, Gary Breed, Jim Culver, Mike Hallman and Larry Dunleavy, WAMICON Steering Committee
Craig Wall, Agilent Technologies Inc., Santa Clara, CA
Crane
Crane Aerospace & Electronics
Crane Aerospace & Electronics Microwave Solutions
Crane Aerospace & Electronics Power Solutions
Crane Aerospace & Electronics, Microwave Systems, Beverly, MA
Crane Aerospace and Electronics Group
Crane Aerospace and Electronics, West Caldwell, N.J.
Crane Co.
Cranfield University Knowledge Transfer Partnership
Credowan Ltd., Chichester, UK
Cree
Cree Inc.
Cree Inc., Research Triangle Park, NC
Cree Research
Cree RF
Creowave
CRFS
CRFS
Cross Border Technologies
Crystal RFI Solutions LLC
Crystek
Crystek Corp.
Crystek Crystals
Crystek Microwave
CSR
CSR and SiRF
CST - Computer Simulation Technology
CST GmbH
CST of America
CST of America Inc.
CST of America, Framingham, MA
CST of America, Wellesley Hills, MA
CTIA - The Wireless Association
CTS
CTS Corp. and Valpey Fisher Corp.
CTS Corp., Elkhart, Ind.
CTS Electronic Components, Inc., Hopkinton, MA
CTT Inc.
Cubic Corporation
Cui Yuxing, Fu Xingchang, Mo Jianghui, Hu Zhifu and He Dawei, Hebei Semiconductor Research Institute
Cuming Microwave Corp.
Curtis Industries
Cushcraft Corp.
Custom Interconnects, LLC
Custom Microwave Components Inc., Fremont, Calif.
Custom MMIC
Custom MMIC, Chelmsford, Mass.
Custom MMIC, Chelmsford, Mass.
Cypress Semiconductor Corp.
Cypress Semiconductor Corp. and Oscium
Cyril Buey and Cédric Malaquin, Yole Intelligence, part of Yole Group, Lyon-Villeurbanne, France
Cyril Luxey, University Nice-Sophia Antipolis and Institut Universitaire de France
Cyril Noger, Anritsu S.A., Villebon-sur-Yvette, France
D
D. Babic, University of Zagreb
D. Djebouri, Space Techniques National Centre;
D. Kaddour, J.D. Arnould and P. Ferrari, ESISAR, Valence, France
D. Packiaraj, M. Ramesh and A.T. Kalghatgi, Bharat Electronics Ltd., Bangalore, India
D.L.S. Electronic Systems Inc.
D.M. Dowthwaite, K.D. Newsome, M.B. Edwards, I.C. Davis and B.M. Coaker, e2v, Chelmsford, UK
D.R. Huang, H.R. Chuang National Cheng Kung University Tainan, Taiwan, ROC, Y.K. Chu Himax Technologies, Tainan, Taiwan and C.L. Lu Kun Shan Universit
D.R. Lang
D3
Daa Sheen Technology Co. Ltd.
Daico Industries Inc., Carson, Calif.
DaisyRS Inc., San Jose, CA
Dale Robinette, Peregrine Semiconductor Inc. San Diego, CA
Dalian Dalicap Technology Co., Ltd.,
Damian Gotch, Filtronic Defence Ltd.
Dan Massé, Associate Technical Editor
Dan Aubertin, Agilent Technologies
Dan Aubertin, Agilent Technologies Inc.
Dan Birch, Fairview Microwave
Dan Birch, Pasternack, Irvine, Calif.
Dan Massé, Associate Technical Editor
Dan Nehring - VP of Engineering, Valpey Fisher Corporation.
Dan Nehring, VP, Engineering, Valpey Fisher Corp.
Dana Cohen Mizrahi, Product Marketing Manager at Sony Semiconductor Israel
Dana Whitlow, Analog Devices
Danaher
Daniel Barnett, Teledyne Storm Microwave, Woodridge, Ill.
Daniel Faria, Lawrence Dunleavy and Terje Svensen
Daniel Gandhi, Christopher Lyons
Daniel I. Amey, Samuel J. Horwitz, Stephen Sekel, Jeff Powell and Brian Durwood
Daniel Kehrer and Deepak Bachu, Infineon Technologies AG, Munich, Germany
Daniel Lam, Advantest, San Jose, Calif.
Daniel M. Dobkin Enigmatics Sunnyvale, CA, Steven M. Weigand WJ Communications Inc. San Jose, CA
DANIEL M. DOBKIN, Enigmatics, Sunnyvale, CA., STEVEN M. WEIGAND, WJ Communications Inc., San Jose, CA
Daniel M. Dobkin, Steven M. Weigand and Nathan Iye
Daniel Schaubert, University of Massachusetts; Jennifer Bernhard, University of Illinois; Robert Mailloux, US Air Force Research Laboratory; W. Devere
Daniel Swanson, DGS Associates LLC
Daniel Swanson, DGS Associates, Boulder, Colo.
Danielle Vanhoenacker-Janvier, EMC 2010 Chair
Danilo Manstretta, RFIC 2024 General Chair, University of Pavia, Pavia, Italy
Danny Polidi and Mike Crist, Raytheon Company, Waltham, Mass.
Daotong Li, Yonghong Zhang, Jing Ai, Kaijun Song and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China
Darby Davis, Gel-Pak, a Division of Delphon, Hayward, Calif.
Darcy Poulin, SiGe Semiconductor
Darcy Poulin, SiGe Semiconductor Inc.
Daren McClearnon, EEsof EDA, Keysight Technologies, Santa Rosa, Calif.
Daren McClearnon, Keysight Technologies, Santa Rosa, Calif.
Daren McClearnon, Keysight Technologies, Santa Rosa, Calif.
Darioush Agahi, William Domino and Nooshin Vakilian
DARPA
DARPA
Darren McCarthy and Steffen Heuel, Rohde & Schwarz, Munich, Germany
Darren McCarthy, Rohde & Schwarz, Beaverton, OR
Darren McCarthy, Tektronix and Wally Arceneaux, Mesuro
Darren McCarthy, Tektronix Inc.
Darren McCarthy, Tektronix Inc., Beaverton, OR
Darren McCarthy, Tektronix, Beaverton, OR
Darren McCarthy, Tektronix, Beverton, OR
Darren Miles and George Bollendorf Empower RF Systems, Inglewood, Calif.
Darren Miles and George Bollendorf, Empower RF Systems, Inglewood, Calif.
Darren Tipton, Rohde & Schwarz, Munich, Germany
Dassault Systèmes
Dassault Systèmes SIMULIA
Data Patterns Group
Datang Telecom Technology
Datum Inc.
Dave Blackham and Ken Wong, Agilent Technologies Inc.
Dave Giles, A-T Solutions; and Sean Thompson, National Instruments
Dave Russell, HXI/Renaissance
Dave Strand, Strand Marketing
Dave Vondran
Dave Whipple, Agilent Technologies
Dave Whipple, Agilent Technologies Inc.
Dave White
David (Da Wei) Vye, Microwave Journal Editor
David A. Hairfield, Phillip D. Harvey, Yvonne L. Krayer and Troy S. Voytko
David A. Hall, Haydn Nelson and Guillaume Pailloncy, National Instruments (NI), Austin, TX
David A. Hall, National Instruments, Austin, Texas
David A. Hall, National Instruments, Austin, TX
David A. Hall, National Instruments, Austin, TX; Janne Roos, AWR – APLAC Division, Espoo, Finland
David A. Hall, National Instruments, Austin, TX; Steve Narciso and Jared Richard, Agilent Technologies Inc., Santa Clara, CA; Edited by David Vye, Mic
Walter Strickler, Anritsu Corp.; Greg Jue, Keysight Technologies; David A. Hall, National Instruments; Reiner Stuhlfauth and Corbett Rowell, Rohde & Schwarz
David Ballo
David Blackham, 85th ARFTG General Chair
David Broadbent, National Instruments, Austin, TX
David Brown, Phonon Corp., Simsbury, Conn.
David Critelli, Times Microwave Systems
David Crook
David Cruickshank, TransTech Inc.
David Cutrer, CEO, Kumu Networks
David Danzilio and Dennis Williams, WIN Semiconductors Corp., Taoyuan City, Taiwan
David Danzillio, WIN Semiconductors, Taoyuan City, Taiwan
David E. Kelly and Kelly Mekechuk
David Farkas, Nxbeam Inc.
David Farr and Bill Henderson, Haigh-Farr, Bedford, NH
David Freeborough, Cambridge Consultants, Cambridge, U.K.
David Halchin and Michael Golio
David Haskin
David Howett, Michael P. Busse, Microwave Products Group; David Rawlinson, BSC
David J. Vondran, OML Inc., Morgan Hill, CA
David Johns and Patrick DeRoy, CST of America, Framingham, MA
David Johns, VP, Electromagnetic Engineering, Flomerics Inc.
David K. Barton
David K. Walker, Dylan F. Williams, Allen Padilla, Uwe Arz, Hartmut Grabinski
David Kiesling, Times Microwave Systems, Wallingford, Conn.
David Lester
David Light, Anthony Faraci and Joe Fjelstad
David M. Jacobson, Andrew J.W. Ogilvy and Alan G. Leatham, Sandvick Osprey Ltd. Neath, UK
David M. Klymyshyn and Surinder Kumar
David Manela and Alan Avidan
David Michael, Abdulkadir Olayinka Abudlbaki, Federal University of Technology, Minna Minna, Nigeria
David Ngo, RFIC 2011 General Chairman
David Owen
David P. Menzer, Auriga Measurement Systems LLC
David Park, Optimal+
David R. Spielman
David R. Vizard, Farran Technology Ltd. Ballincollig, Co. Cork, Ireland
David Robbins and Moeness G. Amin
David Root
David Shively
David Silvius, Director of Strategic Marketing, Richardson RFPD
David Slack, Times Microwave Systems, Wallingford, Conn.
David Slack, Times Microwave Systems, Wallingford, Conn.
David Strand, CEO & Brand Director, Strand Marketing Inc.
David Sumi, Airvine Scientific, Inc. Santa Clara, Calif.
David Vondran
David Vye
David Vye - Editor, Microwave Journal
David Vye and John Dunn, NI AWR Group; Dan Swanson, DGS Associates; Jim Assurian and Ray Hashemi, Reactel Inc.; Philip Jobson, Design Consultant
David Vye and Patrick Hindle, Microwave Journal
David Vye, AWR Group, National Instruments, El Segundo, Calif.
David Vye, Director of Technical Marketing, NI/AWR
David Vye, Editor
David Vye, Editor, Microwave Journal
David Vye, Editor, Microwave Journal; Leonard Pelletier, Freescale Semiconductor; Steven Theeuwen, NXP Semiconductors; Dave Aichele, RFMD; Ray Crampto
David Vye, Microwave Journal
David Vye, Microwave Journal Editor
David Vye, MWJ Editor
David Vye, Richard Mumford and Patrick Hindle, Microwave Journal Editors
David Vye, Sean Kim, Soung Ho Myoung, Jason Yun and Charlie Jeung, Ansoft Corp. Pittsburgh, PA
David Vye, technical editor
David Vye, Technical Editor Microwave Journal
David Vye, Technical Editor, Microwave Journal
David W. Corman, Anokiwave Inc., San Diego, Calif.
David W. Corman, Anokiwave Inc.; Peter Moosbrugger, Ball Aerospace; Gabriel M. Rebeiz, University of California
David W. Porterfield, Jr, Ph.D., Micro Harmonics Corporation
David W. Porterfield, Jr., Micro Harmonics Corp., Fincastle, Va.
Davide Brizzolara, ERTICO - ITS Europe, Belgium
Daying Quan, Huan Jian, Xiaoyu Hou and Xiaoping Jin, China Jiliang University, Hangzhou, China
dB Control Corp., Fremont, Calif.
dB Control Inc.
dBm Corp.
DCM Industries Inc.
Arnold S. de Beerb
Arnold S. de Beerb
Carl De Ranter
Dean Priddy, CFO
Debabani Choudhury, Connected Future Summit Committee Member
Debatosh Guha, University of Calcutta, India; Yahia M.M. Antar, Royal Military College of Canada Kingston, Ontario, Canada; P. Béland and M. Roper, Sp
Debra L. Seifert, Managing Partner, Debra Seifert Communications LLC
Debra Seifert
DecaWave
Delcross Technologies
DelfMEMS
Dell'Oro Group
Delphi Components Inc.
Delta Electronics Manufacturing Corp., Beverly, Mass.
Delta Electronics Mfg. Corp.
Delta Microwave, Oxnard, Calif.
Delta-Sigma Inc., Riverside, Calif.
Denis Barataud and Christian Person, EuMW 2019 General Co-Chairs
Dennis Colin
Dennis Friday
Department of Defense
Derek Campbell, Gopinath Gampala, Martin Vogel and C.J. Reddy, Altair Engineering Inc., Hampton, Virginia
Derek Skousen, MI Technologies; Charlie Orlenius, Bluetest
Derek Smith
DesignArt Networks
DesignCon
DesignCon 2011
Deutsche Telekom and Ericsson
Deutsche Telekom, T-Mobile & Telit Communications
DEV Systemtechnik
Devin Morris, Roos Instruments, Santa Clara, Calif.
DfR Solutions
Dialogic
Dialogic Inc.
Diamond Antenna & Microwave Corp.
Diamond Antenna Europe BVBA
Diamond Liu, Yan Liang and David Shin, SynMatrix Technologies Inc., Richmond, Canada
Diamond Microwave
Diana Gamzina and Richard Kowalczyk, Elve, Inc., Davis, Calif.
Diane Kees, Micro Harmonics, Fincastle, Va.
Didier Belot, José Luis González Jiménez, Eric Mercier, Jean-Baptiste Doré, CEA-Leti, Grenoble, France
Diego Caratelli, Ali Al-Rawi, James Song and David Favreau, The Antenna Company, Eindhoven, Netherlands
Dielectric Communications
Dielectric Laboratories
Dielectric Laboratories Inc.
Dielectric Laboratories Inc. (DLI)
Dielectric Laboratories, Inc., A Knowles Precision Devices Brand, Cazenovia, N.Y.
Dieter Pelz
Dilek Barlas, Gregory Henderson, Xiandong Zhang, Matthias Bopp and Andreas Schuppen
Dima A. Smolyansky and Steven D. Corey
Dima Feldman
Jenn DiMarco
diminuSys
diminuSys, Irvine, CA
Dimov Stojce Ilcev, Durban University of Technology, Durban, South Africa
Dimov Stojce Ilcev, University of Johannesburg, Johannesburg, South Africa
Dimov Stojce Ilcev, University of Johannesburg, Johannesburg, South Africa
Dimov Stojce Ilcev, University of Johannesburg, Johannesburg, South Africa
Dingqing LU, Agilent Technologies, Santa Clara, CA
Dingqing Lu, Keysight Technologies, Santa Rosa, Calif.
Dipti Chheda, Keysight Technologies, Santa Rosa, Calif.
DiTom Microwave, Fresno, Calif.
Divaydeep Sikri and Rajanik Mark Jayasuriya, SatixFy UK Ltd., Farnborough, U.K.
Diversified Technologies Inc.
Diversified Technologies, Inc.
DKN Research
Dominic Clancy and Evert van Veldhuizen
Dominique Schreurs, ARFTG Conference Chair
Dominique Schreurs, Marco Spirito, Mauro Marchetti and Dennis Lewis
Dominique Schreurs, President and 2018 Spring ARFTG Conference Chair;
Don Dingee, STRATISET, Canyon Lake, Texas
Don Dingee, STRATISET, San Antonio, Texas
Don Dingee, STRATISET, San Antonio, Texas
Don Krause, NDK
Don Metzger
Don Metzger, Constant Wave
Donald Y.C. Lie, RFIC 2023 General Chair, Texas Tech University, Lubbock, Texas
Li-Jian Zhang, Seong-Gon Choi, Bireng-Chearl Ahn and Jae-Hoon Bang, Chungbuk National University, Cheongju City, South Korea; Dong-Hyun Kim and Young-Tae Choi, NARO Space Center, Korea Aerospace Research Institute
Mincheol Seo, Inoh Jung, Jeongbae Jeon, Hyungchul Kim, Junghyun Ham, Hwiseob Lee, Cheon-Seok Park and Youngoo Yang, Sungkyunkwan University, Suwon, Korea; Dong-Zo Kim, Ki Young Kim, Samsung Advanced Institute of Technology, Yongin, Korea
Dongke Zhang and Fuqiang Liu, School of Electronics and Information, Tongji University;
Dongze Li, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China
Donn Harvey
Donna Vigneri, NXP RF Group, Tempe, Ariz.
Doodle Labs
Dorine Gurney, Tektronix, Beaverton, Ore.; Fanny Mlinarsky, octoScope, Littleton, Mass.
Dorothy Crenshaw, Crenshaw Communications
Doug Allen
Doug Allen, Telecom Engine
Doug Allen, Telecommunications
Doug Carlson, MACOM
Doug Jorgesen and Christopher Marki, Marki Microwave, Morgan Hill, Calif.
Doug Jorgesen, Marki Microwave, Morgan Hill, Calif.
Doug Reed, Spirent Communications
Dover
Dow
Dow-Key Microwave Corp., Ventura, Calif.
Dow-Key Microwave Corp., Ventura, Calif.
Dr. A. Uhlir, Jr.
Dr. Alfred Grayzel, Gorwara & Associates International, Inc.
Dr. Ali Abuelmaatti RFMD (UK)
Dr. Anil Kumar Singh and Dr. S. Christopher
Dr. Daniel Faircloth, Nullspace, Inc., Irvine, Calif.
Dr. David Johns V.P. Electromagnetic Engineering Flomerics Inc.
Dr. David Root
Dr. Don Goodeve, SixArms/RadioCode Inc., British Columbia, Canada
Dr. Don Metzger, Constant Wave
Dr. Florian Ramian, Rohde & Schwarz
Dr. ing. Marco Lisi, European Space Agency ESTEC, Noordwijk, The Netherlands
Dr. John Howard, Rana Barsbai and Steve Jalil, Electromagnetic Technology Industries, Inc., Boonton, N.J.
Dr. John M. Osepchuk
Dr. Jonthan Wells
Dr. Lin Sun
Dr. Mike Heimlich
Dr. N. Gunavathi, National Institute of Technology, Tamil Nadu, India
Dr. Purna Subedi, 3H Communications Systems Inc., Irvine, Calif.
Dr. Robert Aigner, Director - R&D Acoustic Technologies, TriQuint Semiconductor
Dr. Robert Aigner, Director, R&D Acoustic Technologies, TriQuint Semiconductor
Dr. Steffen Heuel, Rohde & Schwarz, Munich, Germany
Dr. Taro Eichler, Rohde & Schwarz, Munich, Germany
Dr. Ulrich L. Rohde, Universität der Bundeswehr München, Munich, Germany
Drago Kostevc and Joze Mlakar
DragonWave
DragonWave Inc.
Drone Aviation Corporation
Dror Regev, Tower Semiconductor
DRS Signal Solutions, Germantown, Md.
DRS Technologies, Inc., Germantown, Md.
DS Instruments
dSPACE GmbH, Paderborn, Germany
Ducommun Inc.
Ducommun Inc., Carson, Calif.
Dudy Cohen, Ceragon Networks, Tel Aviv, Israel
Duncan Bosworth and Gary Wenger, Analog Devices Inc., Norwood, Mass.
Duncan Bosworth, Analog Devices Inc., Norwood, Mass.
Duncan Pilgrim, Peregrine Semiconductor
Ian Dunn, Mercury Computer Systems
DuPont Circuit & Packaging Materials
DuPont Electronics & Imaging
DuPont Microcircuit Materials
DuPont Polymers and Electronic Materials
Durjoy Roy Rishi Bankim, Chandra College, Naihati, West Bengal, India
DV
Dwayne
Dylan McGrath, Keysight Technologies, Santa Rosa, Calif.
Dylan Stinson, Tektronix, Beaverton, Ore.
DYMAX Corp.
Dynamic Spectrum Alliance
Dynawave Inc.
E
e-tenna Corp.
E. Augendre, CEA-LETI and Université Alpes Grenoble, Grenoble, France
E. Chen, D. Heo, J. Laskar, D. Bien
E. Conner
E. Géron and J. Lewiner, Ecole Supérieure de Physique et de Chimie Industrielle
E. Hernández, R. Berenguer, J. Aguilera and J. Ibarguren Centro de Estudios e Investigaciones Técnicas de Gipuzkoa (CEIT);I. Gutierrez, Tecnun, Univer
E. James Crescenzi, Jr. amd Walter A. Strifler
E. Rius, C. Quendo, A. Manchec, Y. Clavet, C. Person and J.F. Favennec LEST-UMR CNRS no. 6165, Brest, France, G. Jarthon, O. Bosch, J.C. Cayrou, P. Mo
E.F. Knott, A.W. Reed and P.S.P. Wei
E.M. DomÌnguez, R.F. Tigrek, M. Ruggiano, G. Lellouch and W. de Heij, Thales Nederland B.V.; D. Bockstal; Agilent Technologies Inc.; P. van Genderen I
e2v
e2v Group
e2v technologies
e2v technologies (UK) Ltd.
e2v/SP Devices
EADS
EADS and Astrium
EADS Defence & Security
EADS Defence & Security/Alcatel-Lucent
EADS North America Test and Services
Eagleware Corp.
Eamon Nash
Eamon Nash, Analog Devices
Earl Lum, EJL Wireless Research LLC, Half Moon Bay, Calif.
Earl Lum, EJL Wireless Research, Salem, N.H.
Earl Lum, EJL Wireless Research, Salem, N.H.
Earl Lum, EJL Wireless Research, Salem, N.H.
Earl Lum, EJL Wireless Research, Salem, N.H.
Earl Lum, EJL Wireless Research, Salem, N.H.
Earl McCune
East Coast Microwave Inc.
Eastern OptX
EB
EB (Elektrobit), Oulu, Finland
EB, Elektrobit Corp.
Echodyne Corp.
EchoStar Mobile Ltd. (EML)
Eclipse MDI, San Jose, Calif.
Economist Intelligence Unit (EIU)
ECT
Ed Liang, MCV Microwave, San Diego, Calif.; T. K. Wu, FSS & Antenna Consulting, Rancho Palos Verdes, Calif.
Ed Petruzzelli, EchoStar, Englewood, Colo.; Peter Lampel, Rohde & Schwarz, Munich, Germany
EDA Consortium
EDI CON
Edited by: Patrick Hindle, Microwave Journal Editor; Contributions from: Rohde & Schwarz, Keysight Technologies and Aaronia AG
Edward C. Liang, MCV Microwave, San Diego, Calif.
EDX Wireless
eesy-ic
efabless corporation
Efficient Power Conversion (EPC)
Efield
egc
EiC Corp.
Eid Alsabbagh, Haoyang Yu and Kevin Gallagher, TriQuint Semiconductor
Eiji Mochida, Sumitomo Electric Industries Ltd.
EJL Wireless Research
Ek Heng, Asia-Pacific Correspondent
Elanix Inc.
Elbit Systems Ltd.
Elcom Technologies Inc.
Elcoteq
Electro Plate Circuitry
Electro Rent Corp.
Electro Rent Europe
Electro Technik Industries Inc.
Electro-Metrics
Electromagnetic Technologies Industries, Inc.
Electronic Assembly Manufacturing Inc.
Electronic Assembly Manufacturing Inc.
Yong Fang, Baoqing Zeng, Xiaoyun Zhao and Jun Dong, University of Electronic Science and Technology of China; Hai Zhang, Nanchang Institute of Technology, China
electronica
electronica 2010
Electropages
Elektrobit
Elektrobit Corp.
Elektrobit Ltd.
Element Six
element14
Eli Brookner, Raytheon Co.
Eli Brookner, Raytheon Co. (Retired)
Eli Conner
Elisra
Elisra Electronic Systems Ltd., Microwave Division Bene Beraq, Israel
Elite RF, Hoffman Estates, Ill.
Ellen Ferraro and Drew Ganter
Ellen Modock
Elma Electronic Inc.
ELVA-1
ELVA-1
EM Research
EM Research Inc.
EM Software & Systems
EM Software & Systems-SA (Pty) Ltd., Stellenbosch, South Africa
EM Software and Systems GmbH
EM Solutions
Emanuel Kolta and Tim Hatt, GSMA Intelligence, London, U.K.
eMarketer
Emblation Microwave
Emblation Microwave Alloa, Scotland, UK
Emblation Microwave, Alloa, Scotland, UK
EMC Technology
EMC Technology Inc.
Emerson & Cuming Microwave Products
Emerson Network Power
Emerson Network Power Connectivity Solutions
Emhiser Research Inc.
EMITE
EMITE Ing
EMITE Ing, Murcia, Spain
Emmy Johnson, Sky Light Research, Scottsdale, Ariz.
Empower
Empower RF Systems Inc.
Empower RF Systems, Inglewood, Calif.
EMS SATCOM
EMS Technologies
EMS Technologies Inc.
EMSCAN, Calgary, Alberta, Canada
EMSS
EMV
Endicott Interconnect Technologies Inc.
Endwave
Endwave Corp.
Energy Micro
Engalco
Enoch R. Yeh, Chandra R. Bhat and Robert W. Heath, Jr., The University of Texas at Austin, Austin, Texas
Enrico Lia, European Space Agency, Noordwijk, The Netherlands
ENS Microwave LLC
EnSilica
Enterprise IoT Insights
Entropic Communications Inc.
Environmental Stress Systems Inc. (ESS)
eong-Sik Yang, Jong-Hwan Lee and Kyung-Whan Yeom
EPCOS
Epec Engineered Technologies
Epic Communications
Epic Communications Inc.
Eran Agmon, Pacific Grove Consulting
ERANGTEK
Eravant
Eravant, formerly Sage Millimeter Inc., Torrance, Calif.
Eravant, formerly Sage Millimeter Inc., Torrance, Calif.
Eravant, formerly Sage Millimeter Inc., Torrance, Calif.
Eravant, formerly Sage Millimeter Inc., Torrance, Calif.
Eravant, formerly SAGE Millimeter, Torrance, Calif.
Eravant, Torrance, Calif.
Eric Black, Alex Katko and Andjela Ilic-Savoia, Pivotal Commware, Kirkland, Wash.
Eric Desbonnets and Christophe Didier, Soitec, Bernin, France
Eric Drucker, Agilent Technologies, Santa Clara, CA
Eric Higham, Microwave Journal
Eric Higham, Strategy Analaytics, Boston, Mass.
Eric Higham, Strategy Analytics
Eric Higham, Strategy Analytics, Needham, Mass.
Eric Higham, Strategy Analytics, Newton, Mass.
Eric Higham, Technical Editor
Eric Jacquet, Jean-Pierre Bardon and Olivier Bignon
Eric P. Nichols, AlasKit Educational and Scientific Resources
Eric Starkloff, NI Executive Vice President of Global Sales and Marketing
Ericsson
Ericsson Components, RF Power Products
Ericsson RF Power Products
Erik Boch and Julius Kusuma, Facebook Connectivity, Menlo Park, Calif.
Erik Boch, CTO & VP Engineering Dragonwave, Inc.
Erik Boch, Dragonwave Inc.
Erik Boch, Dragonwave, Inc.
Erik Luther, CesiumAstro, Austin, Texas
Erik Ojefors, Sivers Semiconductors AB, Kista, Sweden
Erkan Acar, Analog Devices, Wilmington, Mass.
Ernest Rejman
Ervin J. Nalos, General Electric Co.
Erwin A. Ulbrich, Jr. and Dan Bryden
ERZIA Technologies
ERZIA Technologies of America
ERZIA Technologies, Santander, Spain
Escape
Escape Communications Inc.
ESIA
Steve Dudkiewicz, Gary Simpson and Giampiero Esposito, Maury Microwave Corp.; Mauro Marchetti, Anteverta-mw; Marc Vanden Bossche, National Instruments
Essad Tahan
Andrei A. Muller, Institute of Telecommunications and Multimedia Applications; Esther Sanabria-Codesal, Universitat Politècnica de València, Applied Mathematics Department, Spain
eSurface Technologies
Eta Devices, Inc.
Etenna Corp.
Ethertronics Inc.
ETL Systems
ETS-Lindgren
ETS-Lindgren L.P.
ETSI
Ettus Research
EuMW
Euroconsult
Eurofighter/Selex Galileo
Europa Worldwide Logistics
European Defence Agency
European Southern Observatory (ESO)
European Space Agency
European Space Agency (ESA)
European Standardization Organizations (ESO)
European Telecommunications Standards Institute
Eutelsat
Evans Capacitor Co.
everything RF
Exa¨el Alexander, Temex
Exalt Communications
Exceed Microwave, Torrance, Calif.
Excerpted from “History of Wireless” Tapan K. Sarkar, Robert J. Mailloux, Arthur A. Oliner, Magdalena Salazar-Palma and Dipak L. Sengupta
Exelis Inc.
EXFO
EXFO, Montreal, Canada
EXFO, Québec, Canada
Exodus Advanced Communications, Las Vegas, Nev.
Exodus Advanced Communications, Las Vegas, Nev.
Exodus Dynamics, Poway, Calif.
EXPWAY
Exxelia
Eyelit Inc.
EZ Form Cable, Hamden, Conn.
Ezgi Dogmus, PhD, Power & Wireless Division, Yole Développement
F
F. Alimenti, G. Stopponi, V. Palazzari, P. Placidi, L. Roselli and A. Scorzoni, University of Perugia; P. Ciampolini, University of Parma
F. Allibert, L. Andia, Y. Morandini and C. Veytizou, Soitec, Bernin, France
F. Amrani, M. Trabelsi and R. Aksas, Telecommunication Laboratory of ENP Algiers, Algeria, A. Azrar, University of Shamed Bouguarra Boumrdes, Algeria
F. Ditore and R. Cutler , Agilent Technologies Inc., Santa Clara, CA; S. Jennis, PrismTech, Boston, MA
F. Ejeckam, D. Francis, F. Faili, F. Lowe, J. Wilman, T. Mollart, J. Dodson, D. Twitchen and B. Bolliger, Element Six Technologies
F. Mohd-Yasin and M.K. Khaw, Multimedia University; M.B.I. Reaz, International Islamic University Malaysia
F. Mohd-Yasin, M.K. Khaw and F. Choong, Multimedia University; M.B.I. Reaz, International Islamic University Malaysia
F. Mohd-Yasin, M.K. Khaw and M.B.I. Reaz Multimedia University Cyberjaya, Malaysia
F. Mohd-Yasin, M.K. Khaw and M.B.I. Reaz, Multimedia University, Cyberjaya, Malaysia
F. Robert, R. Leblanc, J. Moron, A. Gasmi, N. Santos and M. Rocchi, OMMIC, Limeil-Brévannes, France
F. Rodriguez-Morales, C. Carabajal, A. Paden and C. Leuschen, Center for Remote Sensing of Ice Sheets, University of Kansas, Lawrence, Kan.
F. Salah-Belkhodja, Djillali Liabes University, Algeria
F.J. Ortega-Gonzalez, J.M. Pardo-Martin, A. Gimeno-Martin and C.B. Peces, Universidad Politécnica de Madrid
F&K Delvotec Inc.
Fa-Lin Liu University of Science and Technology of China, Hefei, China
Sheng Zhang, Hai-Ting Wang, Yi-Kang Zhang and Hai Liu, China University of Mining and Technology; Fa-Lin Liu, University of Science and Technology of China
Fabrisonic LLC
Fadhel M. Ghannouchi and Abbas Mohammadi
Fadhel M. Ghannouchi, University of Calgary
Fairchild Semiconductor
Fairchild Semiconductor Corp.
Fairview Microwave
Fairview Microwave, Lewisville, Texas
Falcon
Farran Technology Ltd., Cork, Ireland
Farran Technology, Cork, Ireland; Copper Mountain Technologies, Indianapolis, Ind.
Farrukh Arslan, PhD Purdue University
Fastback Networks
Fastrax
Federal Armed Forces University Munich, Germany
Fei Zhang, Lina Shi and Chengfang Li
Fei Zhang, Lina Shi and Chengfang Li, Wuhan University
FEKO
ANSYS, Canonsburg, Pa.; CST – Computer Simulation Technology, Darmstadt, Germany; FEKO (Altair Development), South Africa; Keysight EEsof EDA, Santa Rosa, Calif; NI, Austin, TX
Felix Ejeckam, Ty Mitchell, Kris Kong and Paul Saunier, Akash Systems Inc., San Francisco, Calif.
Femto Forum
Fenglong Hao, Changjian Tao, Chuan Jin, First Research Institute of The Ministry of Public Security, Beijing 100048, People’s Republic of China
Ferdinand Gerhardes, Anritsu GmbH; Peter Knott, Fraunhofer Institute
Ferdinando Iucolano, STMicroelectronics, Catania, Italy
Ferdo Ivanek
Ferenc & Christopher Marki, Ph.D.
Ferenc Marki
Ferro Electronic Materials
FiberTower
FierceWireless
FilResearch
Filtronic Broadband Limited
Filtronic Compound Semiconductors
Filtronic Compound Semiconductors Ltd.
Filtronic plc
Filtronic, Sedgefield, U.K.
FIME
Finmeccanica
Finmeccanica – Selex ES
Firas Mohammed Ali Al-Raie
FIRST RF Corp., Boulder, CO
BEN PAWLING Harris CapRock, Melbourne, FL KEITH OLDS Harris Government Communications, Melbourne, FL
Flann Microwave
Flann Microwave, Bodmin, U.K.
Flexiguide
Flirtey
Flomerics
Flomerics EM LOB
Flora Paganelli, Galen Watts and Karen O’Neil, Green Bank Observatory, W. Va.
Florian Krug and Jean Wilwert
Florida RF Labs
Florida RF Labs Inc
Florida RF Labs Inc.
Florida RF Labs/EMC Technology
Fluke Networks
Focus Display Solutions
Focus Microwaves Corp.
Focus Microwaves Inc.
Focus Microwaves, Inc.
Focus Microwaves, Saint-Laurent, QC, Canada
Forbes
Fordahl–FOQ Group
FormFactor Inc.
Fortify
Fortify
Fortify, Boston, Mass.
Forward Concepts
Fox Electronics
Fractal Antenna Systems, Inc.
Fractus Antennas
Fractus SA
Francesco Soldovieri IREA-CNR, Naples, Italy, Giancarlo Prisco and Adriana Brancaccio Second University of Naples, Italy; Giovanni Leone, University o
Francesco Soldovieri, IREA-CNR, Naples, Italy Giancarlo Prisco, Second University of Naples, Italy Raffaele Persico, IBAM-CNR, Lecce, Italy Hara
Francisco Javier Ortega Gonzalez, Jose Luis Jimenez Martin and Alberto Asensio Lopez
Francisco Javier Ortega-González and Jose Manuel Pardo-Martín, Universidad Politécnica de Madrid, Grupo de Ingenieria de Radio GIRA, Madrid, Spain
Francisco Javier Ortega-González, Universidad Politécnica de Madrid
Franck Nicholls and Jose Fernandez Villasenor, M.D., NXP Semiconductors, Chandler, Ariz.
Franco Di Paolo
Franco Sechi and Marina Bujatti
Frank Amoroso
Frank Baberg
Frank Bashore
Frank Bashore, <I>Microwave Journal</I> staff
Frank Bashore, Microwave Journal staff
Frank van Vliet, EuMW 2020, General Chair
Frank Xiaohui Li and Greg Corsetto
Frank Zavosh and James T. Aberle
Frank Zavosh, Mike Thomas, Chris Thron, Tracy Hall, Daniel Artusi, David Anderson, David Ngo and David Runton
Frank-Werner Thümmler and Thilo Bednorz, Rohde & Schwarz
Frank-Werner Thümmler, Rohde & Schwarz, Munich, Germany
Franz Hirtenfelder and Stephen Murray, CST – Computer Simulation Technology
Fraunhofer Institute for Applied Solid State Physics IAF
Fred Bonn
Fred Gardiol and Yves Fournier
Fred Hull, San-tron Inc., Ipswich, MA
Fred Hull, San-tron Inc., Ipswich, Mass.
Fred Schindler, Dennis Rosenauer, John Nielsen, Tom Raschko and Rich Nichols, Anlotek Ltd., London, U.K.
Fred Schindler, General Chairman, 2006 Radio and Wireless Symposium
Fred Schindler, John Nielsen, Dennis Rosenauer and Tom Raschko, Anlotek Ltd.
Fred Schindler, Virender Sadhir, Brian Robbins, David Guo and Jerry Paradis, RF Micro Devices, Greensboro, NC, Billerica, MA
Frédéric Aniel, EuMIC 2010 Chairman
Frederic Roger, Scintera Networks, Sunnyvale, CA
Freescale
Freescale Semiconducteurs S.A.S.
Freescale Semiconductor Inc.
Freescale Semiconductor, Austin, TX
Freescale Semiconductor, RF Division
Freescale Semiconductor, RF Division Tempe, AZ
Freescale Semiconductor, Tempe, Ariz.
Dave Frizelle
Frontlynk Technologies Inc.
Frost & Sullivan
FSY Microwave Inc.
Fu-Ling Lin, Shin-Fu Chen and Huey-Ru Chuang
Fujitsu Laboratories Ltd.
Fujitsu Limited
Fujitsu Microelectronics America Inc.
Fujitsu Semiconductor America Inc.
Fujitsu Semiconductor America Inc., Sunnyvale, CA
Fujitsu Semiconductor Europe
Fujitsu Semiconductor Limited
FUJITSU TEN
Full Spectrum
Future Market Insights
G
G. Cottard, ANTEM, Saint-Maur-des-Fosses, France; Y. Arien, Emerson & Cuming MWP
G. Hau, T.B. Nishimura, and N. Iwata
G. Klaric Felic, R. J. Evans, Hoa Thai Duong, Hoang Viet Le, J. Li and E. Skafidas, University of Melbourne
G. S. Karthikeya, BMS College of Engineering, Bangalore, India
G. S. Karthikeya, Department of ECE, BMS College of Engineering, Bengaluru, India
G. Samuel Dow, Jeff Yang, Kuo-Hsiang Yen, Robert Matreci, Eric Spotted-Elk, Stephen Pettis and Long Trinh
G. Soundarya and Dr. N. Gunavathi, National Institute of Technology, Trichy, Tamil Nadu, India
G. Soundarya and N. Gunavathi, Dept. of Electronics & Communication Engineering, National Institute of Technology, Tiruchirappalli, Tamil Nadu, India
G.A. Sadowy, A.C. Berkun, W. Chun, E. Im, S.L. Durden
G.T. Microwave Inc.
GaAs Code Ltd.
Gaas Labs LLC
GaAsTEK, a unit of ITT Industries
Gabriele Devita, EnSilica, Oxfordshire, U.K.
Gaëtan Prigent, Nathalie Raveu, Olivier Pigaglio and Henri Baudrand
Gaëtan Prigent, Nathalie Raveu, Olivier Pigaglio, Henri Baudrand
Galtronics Corporation Ltd.
GaN Systems
Gang Liu, Fuqi Mu, Yongqing Leng, Yang Li and Xinli Cui
Gang Liu, Fuqi Mu, Yongqing Leng, Yang Li and Xinli Cui, Institute of Microelectronics Chinese Academy & Univ. of Chinese Academy of Sciences
Gang Zhang, Weinan Normal University, Weinan, China
Gareth Lloyd, Rohde & Schwarz, Munich, Germany
Gary Giust, JitterLabs, Milpitas, Calif.; Doug Jorgesen, Marki Microwave, Morgan Hill, Calif.
Gary Lerude, Editor, Microwave Journal
Gary Lerude, Microwave Journal Editor
Gary Lerude, Microwave Journal Technical Editor
Gary Lerude, Microwave Journal, Norwood, Mass
Gary Lerude, Patrick Hindle and Jennifer DiMarco, Microwave Journal Editors
Gary Simpson, Maury Microwave Corp.
Gary Simpson, Maury Microwave, Ontario, CA; David Ballo, Agilent Technologies Inc., Santa Rosa, CA
Gary Zhang and Zhihao Zhang, Guangdong University of Technology, Guangzhou, China Synergy Innovation Institution of GDUT, HY, Heyuan, China
Gauss Instruments
GAUSS INSTRUMENTS GmbH
Gavin Smith and Nathan Glaza, NXP Semiconductors, Chandler, Ariz.
Gavin T. Watkins, Toshiba Research Europe Limited
Gavin Watkins and Stephen Wang, Toshiba Research Europe Ltd., UK
Gayle Collins
Gayle Collins and David W. Runton, RF Micro Devices
Gayle Collins, Nuvotronics, Durham, N.C.
GBI Research
GE Global Research
Geensoft
Geert Carchon, B. Nauwelaers, K.U. Leuven, P. Pieters, K. Vaesen, W. DeRaedt, E. Beyne
Gel-Pak, Hayward, Calif.
General Dynamics
General Dynamics
Geneviève Baudoin, EuWiT 2010 Conference Chair
Genstar Capital
Genstar Capital
Gent Paparisto and David Vye, National Instruments, Austin, Texas
GenXComm
Geoffroy Lerosey, Greenerwave, Paris, France
Geonho Jang and Sungtek Kahng, University of Incheon, Incheon, Korea
George Choquette, Senior Vice President, Hughes
George D. Vendelin, Vendelin Engineering; José Carlos Pedro and Pedro Miguel Cabral, Universitário de Santiago
George F. Brown, Jr., Blue Canyon Partners Inc.
George Karalias, Rochester Electronics
Georges Roussy, Bernard Dichtel and Haykel Chaabane
Georgi S. Kirov, Technical University of Varna, Bulgaria; Hristo D. Hristov and Rodolfo Feick, Universidad Técnica Federico Santa Maria, Valparaiso, C
Georgia Institute of Technology
Georgia Tech Research Institute
Gerald Womer and John Lewis, Micro-Coax, Pottstown, Pa.
Gerard Wimpenny, CTO, Nujira
Gerhard A. Hofbauer
Gerhard A. Hofbauer, Institut für Nachrichtentechnik und Wellenausbreitung
Gerhard P. Fettweis, TU Dresden, Dresden, Germany
German Torregrosa-Penalva, Alberto Asensio-Lopez, Jaime Lluch-Ladron de Guevara and Francisco Javier Ortega-Gonzalez
Kerri Germani
Geyer Electronic America Inc.
Steve Dudkiewicz, Marc Schulze Tenberge and Giampiero Esposito, Maury Microwave Corp., Ontario, Calif.; Travis Barbieri, Freescale Semiconductor, Phoenix, Ariz.
Giga-tronics
Giga-tronics Inc.
GigaLane
GigOptix
GigOptix Inc.
GigPeak
GIL Technologies
Gilat Satellite Networks Ltd.
Gilles Dambrine, General Chair, EuMW 2010; Ivar Bazzy, President, Horizon House Publications
Giorgos E. Stratakos, Paul Bougas and Kostas Gotsis
Giuseppe Macchiarella, Politecnico di Milano; Alberto Bovatti, FOREM S.r.l.
Giuseppe Pelosi, Department of Information Engineering, University of Florence
Giuseppe Pelosi, University of Florence
Giuseppe Vacca Bari Polytechnic Bari, Italy
Glen Fields, Director, Aerospace and Defense, MACOM, Lowell, MA
Global mobile Suppliers Association
Global Semiconductor Alliance
Global Test Solutions
Global VSAT Forum (GVF)
GLOBALFOUNDRIES
Globe Newswire
Globecomm Systems Inc.
Go Long Wireless
Goo-Young Jung and Tae-Yeoul Yun, Hanyan University
Google
Gopinath Gampala and C.J. Reddy, EM Software & Systems Inc.; Oliver Stabler and Thomas Hager, AWE Communications GmbH
Gopinath Gampala, Martin Vogel and C. J. Reddy, Altair Engineering Inc., Hampton Va.
Gopinath Gampala, Rohit Sammeta and C.J. Reddy, EM Software & Systems Inc., Hampton VA
Udi Gordon
Gordon Barber and Ted Hebron of Laird Connectivity
Gordon Reichard
Gordon Vinther, Ardent Concepts Inc., Seabrook, NH
Government Technology
Gowanda Components Group
Gowanda Electronics
Gowrish Basavarajappa, IIT Roorkee, Uttarakhand, India
Grace Remillard, University of Massachusetts-Lowell, Lowell, Mass.
GradConn
Graham Riley, Agilent EEsof EDA, West Lake Village, CA
Graham Teague, Business Development Manager EMEA, TriQuint Semiconductor GmbH.
Granite River Labs
Graphics for Jenn
Greenray Industries Inc.
Greg Adams and Kong S. Luen
Greg Friesen
Greg Jue and Brad Frieden, Agilent Technologies Inc., Santa Clara, CA
Greg Jue, Agilent Technologies Inc.
Greg Jue, Agilent Technologies, Santa Clara, CA; Thomas Dippon, Agilent Technologies, Boeblingen, Germany
Greg Jue, Keysight Technologies Inc., Santa Rosa, Calif.
Greg Jue, Keysight Technologies, Santa Rosa, Calif.
Greg Jue, Keysight Technologies, Santa Rosa, Calif.
Greg Peters, Agilent Technologies Inc., Santa Clara, CA
Greg Ramon, QinetiQ North America
Greg Skidmore, Jamie Infantalino, Jim Stack, Remcom
Gregg Peters, Keysight Technologies Inc., Santa Rosa, Calif.
Gregory L. Amorese, Agilent Technologies Inc. Santa Rosa, CA
GSMA
GSMA
Guang Yang, Wei Liu and Falin Liu, University of Science and Technology of China
Guangping Xie, Zongxi Tang, Biao Zhang and Xin Cao, University of Electronic Science and Technology of China
Guerrilla RF Inc.
Guerrilla RF, Greensboro, N.C.
Guillaume Ducournau, General Chair, University of Lille, IEMN-CNRS, France
Guillaume Pailloncy, Frans Verbeyst and Marc Vanden Bossche, NMDG NV, Bornem, Belgium
Günter Pfeifer and Benoit Derat Rohde & Schwarz, Munich, Germany
Gunter Vorlop
Cantianci Guo
Guoan Wu, Chao Guo, Qinfen Xu and Wenguang Li, Huazhong University of Science and Technology, Wuhan, China
Guohua Liu, Yijun Lin, Cantianci Guo and Zhiqun Cheng, Hangzhou Dianzi University
Guru Subramanyam, University of Dayton, Dayton, Ohio
Gustavo Lopez-Risueno and Jose I. Alonso
Guy Purchon, Bryan Harbor and Tom McConnell
Guy Sene, President of Agilent Technologies' Electronic Measurement Group
Guzik Technical Enterprises, Mountain View, Calif.
GVD Corporation
H
H. García-Vázquez, Sunil L. Khemchandani, J. Arias-Pérez and J. del Pino, University of Las Palmas de Gran Canaria Spain
H. M. Talasila, F. R. Morales and J. Paden, Center for Remote Sensing of Ice Sheets, University of Kansas, Lawrence, Kan.
H. Shigematsu, M. Sato, T. Hirose and Y. Watanabe
H. Thust, K.H. Drue, J. Muller, T. Thelemann, T. Tuschick, J. Chilo, C. Golovanov, F. Ndagijimana
H.C. Chiu, C.S. Cheng, C.C. Wei, Y.J. Shih and S.W. Lin, Chang Gung University; F.T. Chien, Feng Chia University
H.D. Hristov and R. Feick, Universidad Técnica Federico Santa María, Valparaíso, Chile, R.J. Urumov and G.S. Kirov, Technical University of Varna, Bul
H.R. Chuang, C.C. Lin and Y.C. Kan, National Cheng Kung University
H.R. Chuang, S.W. Kuo, C.C. Lin and L.C. Kuo National Cheng Kung University Tainan, Taiwan, ROC
H.T. Lin, Y.K. Chu and H.R. Chuang, National Cheng Kung University
Hadi Aliakbarian
Hai-wen Liu, Institute of Optics and Electronics; Zhiguo Shi, Zhejiang University; R.H. Knoechel, Kiel University; K.F. Schuenemann, Technische Univer
Haigh-Farr Inc.
Haim Spiegel, Keysight Technologies, Santa Rosa, Calif.
Haiwen Liu, Chinese Academy of Sciences, Chengdu, China; Xiaohua Li, University of Electronic Science and Technology of China, Chengdu, China
Haiwen Liu, East China Jiaotong University, Nanchang, China; Fu Tong, Chinese Academy of Sciences, Chengdu, China
Haiwen Liu, Jiuhuai Lei, Yulong Zhao and Wenyuan Xu, East China Jiaotong University, Nanchang, China
Haiwen Liu, Xiaomei Wang, Yulong Zhao, Yan Wang, Baoping Ren, Jiuhuai Lei and Shan Wang, East China Jiaotong University, Nanchang, China
Haiwen Liu, Yan Wang, Jiuhuai Lei, Shen Li and Xiaomei Wang, East China of Jiaotong University, Nanchang, China
Haki Cebi, Skyworks Solutions Inc., Woburn, MA
Hala Elsadek, Electronics Research Institute
Haleakala Research & Development, Inc.
Mike Hallman
Halran Howe
Hamed M. Sanogo, Analog Devices, Wilmington, Mass.
Hammam Shakhtour, Dirk Heberling, Institute of High Frequency Technology (IHF); Karam Noujeim, Anritsu
Han-Jun Wu, Chao Pang, Yu-Xin Cui, Rui-Feng Cao and Lin Li Zhejiang, Sci-Tech University, Hangzhou 310018, China
Hannu Tenhunen, Royal Institute of Technology (KTH), Stockholm, Sweden
Hans Mollee, Steven O'Shea, Paul Wilson and Korne Vennema
Hans O Johansson, Sivers Ima, Kista, Sweden
Hans-Ulrich Nickel, SPINNER GmbH, Munich, Germany
Harlan Howe
Harlan Howe Jr. and Richard Mumford
Harlan Howe Jr., Editor Microwave Journal
Harlan Howe Jr., Richard Mumford, Michael Puttré
Harlan Howe, Jr.
Harlan Howe, Jr. – Editor, Microwave Journal, Richard Mumford – European Editor, Microwave Journal, Michael Puttré – Editor-in-Chief, Journal of Elect
Harlan Howe, Jr. Editor, Microwave Journal
Harlan Howe, Jr., <i>Microwave Journal</i> Editor
Harlan Howe, Jr., Editor, <I>Microwave Journal</I>
Harlan Howe, Jr., Editor, Microwave Journal
Harlan Howe, Jr., Microwave Journal
Harlan Howe, Jr., Microwave Journal staff
Harmon Banning, W.L. Gore & Associates
Harris Corp.
Harris Stratex Networks
Harris Stratex Networks Inc.
Harry Chapell, Retired Professional Engineer
Harvey Kaylie, Mini-Circuits, Brooklyn, N.Y.
Harvey Lehpamer
Harvey Lehpamer, HL Telecom Consulting, San Diego, CA
Gerry Harvey, OnScale
HASCO, Inc., Moorpark, Calif.
He-Kai Jhuang and Ching-Her Lee, National Changhua University of Education; Po-Min Hu and Chung-I G. Hsu, Da-Yeh University
He-Xiu Xu, Guang-Ming Wang, Jian-Gang Liang and Tian-Peng Li, Missile Institute of Air Force Engineering University, Sanyuan, China
Heather Bota, Acceleware Corp.
Hector J. De Los Santos, Randy J. Richards
Hee Yong Hwang and Sang-won Yun, Sogang University
Hee-Yong Hwang, Sang-Won Yun and Joong-Sung Chung
GUANG YANG, WEI LIU AND FALIN LIU University of Science and Technology of China, Hefei, China SHENG ZHANG China University of Mining and Technology, Xuzhou, China
HEI Inc.
Heidi Barnes, Jeff Most and Mike Resso, Keysight Technologies, Santa Rosa, Calif.
Heinrich Daembkes, EADS Defence Electronics
Helen Duncan, MWE Media Ltd., U.K.
Helen Duncan, MWE Media Ltd., U.K.
Helen Duncan, MWE Media Ltd., U.K.
Helen Duncan, MWE Media, Ltd.
Helen Duncan, MWE Media, Ltd., U.K.
Helen Duncan, MWE Media, U.K.
Helen Mills, Agilent Technologies Inc.
Helen Wright
Henrik Morkner and Alfred Riddle, M/A-COM Technology Solutions, Lowell, MA
Henry Wojtunik
Heraeus Inc.
Herbert Schmitt, Rohde & Schwarz, Munich, Germany
Herbert Zirath
Herley Industries Inc.
Herley Industries Inc.</
Herotek
Hervé Aubert, General Chairman, EuMW 2015; Ivar Bazzy, President, Horizon House Publications
Sherry Hess
Hesse & Knipps
Hesse Mechatronics Inc.
Hetvi Patel, Kevin Kellog, Hugo Morales and Larry Dunleavy, Modelithics Inc.; Rob Jones and Paul Head, Raytheon
Heuermann
Heuermann and Rosenberger
Heungjae Choi and Yongchae Jeong, Chonbuk National University; J.S. Kenney, Georgia Institute of Technology; Chul Dong Kim, Sewon Teletech Inc.
Hewlett Packard Co.
Hewlett-Packard Co.
High Speed Interconnects
Patrick Hindle
HIRAI
Hirai SK Corp.
Hirose
Hirose Electric Co. Ltd.
Hiroyuki Maehara, Agilent Technologies Inc., Santa Clara, CA
Hiroyuki Maehara, Mark E. Hanni, Nader Srouji and Dara Sariaslani Keysight Technologies Inc., Santa Rosa, Calif.
Hittite
Hittite Microwave Corp.
Hittite Microwave Corp. Chelmsford, MA
Hittite Microwave Corp., Chelmsford, MA
Hittite Microwave Corp., Chelmsford, MA
Hittite Microwave Corporation
Hittite Microwave Inc.
Holger H. Meinel and Juergen Dickmann, Daimler AG, Stuttgart, Germany
Holger Schwarz, Narda Safety Test Solutions, Pfullingen, Germany
Holger Schwarz, Narda STS, Pfullingen, Germany
Holzworth
Holzworth Instrumentation Inc., Boulder, Colo.
Holzworth Instrumentation, Boulder, CO
Holzworth Instrumentation, Boulder, Colo.
Homayoun Ghani, Toshiba America Electronic Components Inc., Irvine, CA
Homayoun Nikookar
Honeywell
Honeywell, Solid State Electronics Center
Hong-Seop Lee and Hee-Yong Hwang, Kangwon National University
Hongbo Sun, Guosui Liu, Hong Gu, Weimin Su
Hongcheng Yang, Pandeng Wang, Wenyi Zhang, Cuiling Zhang, Cunlin Zhang, Bo Su and Jingsuo He
Hongfei Yao, Jun Hu, Muhammad Asif and Feng Yang, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
Honglei Chen and Rick Gentile, MathWorks, Natick, Mass.
Hoon Hwangbo, Sung-Chan Jung, Youngoo Yang, Cheon-Seok Park, Byung-Sung Kim and Wansoo Nah,
Hope Microelectronics Ltd.
Horizon House Publications
Horizon House, Exhibition Management Company
Houman Zarrinkoub, MathWorks, Natick, Mass.
How-Siang Yap, Agilent
Mike Howard
Howard Hausman
Howard Hausman, MITEQ Inc.
HP EEsof
Hristo D. Hristov, Walter Grote and Rodolfo Feick, Universidad Téchnica Federico Santa María, Valparaiso, Chile
HRL
HRL Laboratories
HRL Laboratories LLC
Hsin-Chih Kuo, Chu-Yun Yang and Huey-Ru Chuang, National Cheng Kung University, Tainan, Taiwan, China
Huang Liang Technologies Co. Ltd.
Huawei
Huber + Suhner AG
Huber+Suhner
HUBER+SUHNER AG
HUBER+SUHNER AG, Herisau, Switzerland
Huber+Suhner and Rosenberger
Huber+Suhner Cube Optics
HUBER+SUHNER, Herisau, Switzerland
HUBER+SUHNER/SPINNER
Hudong Chang, Bing Sun and Honggang Liu, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China
Huey-Ru Chuang, Liang-Chen Kuo, Chi-Chang Lin and Wen-Tzu Chen
Hugh R. Nudd
Hughes Network Systems LLC
Hugo Dinis and Paulo Mendes, University of Minho, Braga, Portugal
Hugo Morales(2), Chris DeMartino(2) and Isabella Bedford (2), Modelithics Inc.(2), Tampa, Fla.
Dennis Hurst
Hussam Ayad and Jalal Jomaah, EDST, Lebanese University, Beirut, Lebanon
HVS Technologies Inc
HVVi Semiconductors
HVVi Semiconductors Inc.
Hwee Yng Yeo, Keysight Technologies, Santa Rosa, Calif.
Hyeong Tae Jeong, Chul Dong Kim and Ik Soo Chang, Sogang University
Hyeonjin Lee and Yeongseog Lim
Hyeonjin Lee, Dongkang College; Jinwoo Jung and Yeongseog Lim
Hyok-Jae Song and Marek E. Bialkowski
HYPERLABS INC., Louisville, Colo.
HYPERLABS, Beaverton, Ore.
Hyun-Chul Go and Yong-Woong Jang; Hankook Antenna Co. Ltd., Keukdong College
Hyun-Chul Go, Hankook Antenna Co. Yong-Woong Jang, Keukdong College
Hyun-Min Park, Kye-Ik Jeon, Songheol Hong
Hyunchul Ku, Wangmyong Woo, J. Stevenson Kenney
Hyung Joun Yoo and Ji-Hoon Kim, Information and Communications University (ICU)
Hyungchul Kim, Hanjin Cho, Min-Su Kim, Mincheol Seo, Junghyun Ham, Cheon-Seok Park and Youngoo Yang, Sungkyunkwan University
Hyungoo Yoon, Myongji College and Byung-Jun Jang, Kookmin University, Seoul, Korea
Hyunsoo Kim and Sungtek Kahng, University of Incheon, Incheon, Korea
I
I-Q Analog, San Diego, Calif.
I-Tseng Tang, National University of Tainan
I. Tseng Tang, National University of Tainan; Ding-Bing Lin, Institute of Computer and Communication; Tzu-Hao Lu, Industrial Technology Research Insti
Iain Morris
Iain Morris, Telecommunications Magazine
Ian Burke, Menlo Microsystems Inc., Irvine, Calif.
Ian Collins and Kazim Peker, Analog Devices Inc., Norwood, Mass.
Ian Doyle, Bourns Electronics Inc.
Ian Dunn, Spectrum Control, Fairview, Pa.
Ian Gresham, Rob McMorrow, David Corman and Nitin Jain, Anokiwave Inc., San Diego, Calif.
Ian Hunter, General Chair, EuMW 2011; Ivar Bazzy, President, Horizon House Publications
Ian Wylie and Gerard Wimpenny, Nujira Ltd., Cambridge, UK; Dave McIntosh, KCB Signal Solutions LLC, Shirley, MA
IBM
Ibrahim Fortas, Department of Electrical Engineering, University of Boumerdes, Algeria
Ibrahim Haroun, Senior Member, IEEE Research Scientist/ RF Systems Developer (retired), Canada
IC Foundry Almanac
iCana, New Taipei City, Taiwan
Icron
IDC
IDirect Government Technologies, Herndon, VA
IDT
IDTechEx
IEE
IEEE
IEEE Antennas and Propagation Society
IEEE Communications Society (ComSoc)
IEEE IMS/MTT-S 2010 Women in Microwaves
IEEE Microwave Theory and Techniques Society (MTT-S)
IEEE-IEDM
IFEN
IFI
IFR Americas Inc.
IFR Sustems Inc.
IFR Systems Inc.
Ignacio Llamas-Garro, Centre Tecnolgic de Telecomunicacions de Catalunya, Barcelona, Spain
Ignacio Montiel-Sanchez, European Defence Agency (EDA), Belgium
Ignatz Eisele, Center for Integrated Sensor Systems, Universität der Bundeswehr, Munich, Germany, Fraunhofer EMFT, Munich, Germany
Igor Abramzon and Vadim Tapkov, Magic Xtal Ltd., Omsk, Russia
Ihn S. Kim, Chisung Jo and Yongin Han
Ihn S. Kim, Key Jeong, Jae Kwon Jeong
IHP
IHP–Leibniz-Institut für innovative Mikroelektronik/Ferdinand-Braun-Institut
IHS
IHS iSuppli
IHS Technology
II-VI Inc.
IKE Micro/Bonding Source
imec
imec Holst Centre
IMS
IMS 2009
IMS 2010
IMS 2011
IMS 2014
IMS Connector Systems
IMS Research
IMS2009
IMS2010
IMSAR
IMST GmbH, Kamp-Lintfort, Germany
IMST, Kamp-Lintfort, Germany
In Ho Kang, Shi Wei Shan, Xu Guang Wang and Young Yun, Korea Maritime University; Ji Hoon Kim and Chul Soon Park, Information and Communications Unive
In-Ho and Xin Guan, Korea Maritime University, Busan, South Korea
In-ho Kang and Haiyan Xu, National Korea Maritime University
In-Ho Kang and Jin-San Park, Korea Maritime University
In-ho Kang, Joo-yeon Kim
In-ho Kang, Xuguang Wang, Young Yun and Hongchao Zhang
In-ho Kang, Xuguang Wang, Young Yun, Hongchao Zhang
In-Phase Technologies
In-Phase Technologies, Bordentown, N.J.
In-Stat
In-Stat Research
Peraso Inc.
Incyte Inc.
Inder J. Bahl
Inder J. Bahl and Mark Dayton, Tyco Electronics, M/A-COM Products
Inder J. Bahl, M/A-COM
Inder J. Bahl, M/A-COM Inc.
indie Semiconductor, Aliso Viejo, Calif.
Indium Corp.
Indium Corporation
Indra
Indra Ghosh, Jan Buchholz, Horst Fischer, Ulrich Altmann, Jörg Berben, Jonas Lehmke, Ulrich Lewark
Infineon and Nokia
Infineon Technologies
Infineon Technologies AG
Infineon Technologies AG, Munich, Germany
Infineon Technologies AG, Neubiberg, Germany
Infineon Technologies and Golden Gate Capital
Infineon Technologies, El Segundo, Calif.
Infineon Technologies, Morgan Hill, Calif.
Infineon Technologies, RF Power Products
Infineon/Nokia
Infinite Electronics
Infinite RF Holdings Inc.
Infolytica Corp
Infonetics
Information Systems Laboratories, Inc., San Diego, Calif.
Ingrid De Wolf, Piotr Czarnecki, Anne Jourdain, Robert Modlinski and
INGUN Prüfmittelbau GmbH, Konstanz, Germany
INGUN USA Inc., Lake Wylie, S.C.
Inmarsat
Inmet Corp.
Innovative Integration, Camarillo, Calif.
Innovative Micro Technology Inc.
Innovative Power Products
Inphi Corp.
iNRCORE
INSIDE Contactless
Insight SIP
Inspower Co., Ltd.
Instec LLC
Wang Xi, Muhammad Asif, Tong Zhihang and Jin Zhi, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China; University of Chinese Academy of Sciences, Beijing, China
Institution of Engineering and Technology
Instruments For Industry
Insulated Wire Inc., Bayport, N.Y.
Insulated Wire Inc., Microwave Products Division, Bethel, Conn.
Insulectro
Integra
Integra Technologies
Integra Technologies Inc.
Integra Technologies Inc. El Segundo, CA
Integra Technologies Inc., El Segundo, CA
Integral Systems
Integral Systems Inc.
Integrated Device Technology Inc., San Jose, Calif.
Integrated Device Technology, Inc. (IDT)
INTEGRATED Engineering Software
INTEGRATED Engineering Software, Winnipeg, MB, Canada
Integrated Microwave Corp.
Integrated Microwave Technologies
Intel
Intelek
J.R. Guerci, Guerci Consulting LLC; T. Driscoll, R. Hannigan, S. Ebadi and C. Tegreene, Intellectual Ventures; and D.E. Smith, Duke University
Intelliconnect (Europe) Ltd.
Intelsat S.A.
Inter-Continental Microwave
Inter-Continental Microwave (ICM)
Intercept Technology Inc.
Intercept Technology, Inc.
Interlligent
International M2M Council (IMC)
International Manufacturing Services Inc
International Manufacturing Services Inc.
International Manufacturing Services Inc. (IMS)
International Microwave Power Institute
International Microwave Symposium
International Telecommunication Union
International Telemetering Conference
International Wireless Communication Expo (IWCE)
International Wireless Communication Expo (IWCE)
inTest Corp.
inTEST Thermal Solutions
Introduction by Peter Staecker, Chairman, 1991 MTT-S Boston Symposium; Compiled by David Vye
ip.access
IPDiA
IPDiA
IQD
IQD Frequency Products Ltd.
IQE
IQE plc
IQLP LLC
Iridium Communications Inc.
Irma Swain, Communications Manager
iRobot
iRobot
Isaac Mendelson and David Bernstein
Isaac Mendelson, ElectroMagneticCareers.com
Isaac Mendelson, ElectroMagneticCareers.com and David Germond, Cleared Executive Search
ISCO International
Ismael Molina, Alba Würth Elektronik eiSos GmbH & Co. KG
Ismail Nasr, Infineon Technologies, Neubiberg, Germany
Isola Group
Isola Group S.a.r.l.
Isola USA Corp.
Isolink Inc.
iSuppli Corp.
iTerra Communications
ITS Electronics
ITS Electronics Inc.
ITT Corp.
ITT Corp.'s Microwave Systems
ITT Exelis
ITT Industries Inc.
ITT Interconnect Solutions
ITT Microwave Systems
Ivan Boshnakov, Ametek Compliance Test Solutions, Reinach, Switzerland
Ivan Boshnakov, Microwave Design Engineer
Ivan Koshurinov
Ivanov Yuri, Nikonov Arkady and Knyazeva Elvira, Morion Inc., St. Petersburg, Russia
Ivar Bazzy, President, Horizon House Publications
IWCE Expo
IXYS Corp.
IZT GmbH
J
J. Anguera, A. Andújar and C. Puente, Fractus Antennas, Sant Cugat del Vallés, Barcelona, Spain
J. Anguera, A. Andújar, J.L. Leiva, C. Puente, R. Arribas, Y. Cobo
J. Brunning and R. Rayit, SARAS Technology, Leeds, U.K.
J. Capwell, T. Weller, D. Markell and L. Dunleavy, Modelithics Inc.
J. Cheng, S. Li, B. Han and J. Gao, East China Normal UniversityShanghai, PR China; X. Yao, Semiconductor Manufacturing International Corp., Shanghai,
J. L. Allen
J. Laskar, S. Pinel, D. Dawn, S. Sarkar, B. Perumana and P. Sen, Georgia Institute of Technology, Atlanta, GA
J. McDaniel, Advanced Radar Research Center, University of Oklahoma, Norman, OK
J. McDaniel, Advanced Radar Research Center, University of Oklahoma, Norman, Okla.
J. Randy Fenton
J. Rodriguez-Tellez
J. Rodriguez-Tellez, N.T. Ali and K.A. Mezher, Etisalat College of Engineering; T. Fernandez, A. Mediavilla, A. Tazon and G. Rafael, Universidad de Ca
J. Rodriguez-Tellez, T. Fernandez, A. Mediavilla and A. Tazon
J. Staudinger
J. Wareberg, D. Kennedy, S. Schmidt
J. Wayde Allen
J. Zhou, S. Ming, J. Zhao, C. Ming and L. Zhang Southeast University Nanjing, China
J.A. Tirado-Méndez and H. Jardón-Aguilar, Center for Research and Advanced Studies, IPN; E.A. Andrade-González and M. Reyes-Ayala, Metropolitan Autono
J.Brunning and R. Rayit SARAS Technology, Leeds, U.K.
J.E. Mueller, U. Gerlach, G.L. Madonna, M. Pfost, R. Schultheis and P. Zwicknagl
J.H. Flemming, R. Cook, S. Sibbet, C.F. Schmidt, K. Dunn and J. Gouker, 3D Glass Solutions Inc., Albuquerque, NM
J.J. Yu and S.T. Chew
J.K. McKinney, IMS2010 General Chairman
J.L. Smith
J.M. Cairon, A. Tazon, T. Fernandez, C. Navarro, A. Mediavilla and J. Rodriguez-Tellez
J.M. Huang, (also affiliated with State Key Laboratory of Information Photonics and Optical Communications); H.Z. Zhu, H. Guo, and K. Han, Beijing Uni
J.P. Bridge, Accent Optical Technologies Inc.
J.P. Lanteri and D.J. Carlson, M/A-COM Inc., Lowell, MA
J.S. Kenney and A. Leke
J.S. Mandeep and H. Abdullah, Universiti Kebangsaan Malaysia Selangor, Malaysia; Nitesh Ram, Universiti Sains Malaysia Pulau, Pinang, Malaysia
Jacek Pierzchlewski and Torben Larsen, Aalborg University
Jack Daniels, EastBridge Partners LLC, Brookline, MA
Jack Pollock
Jacket Micro Devices Inc. (JMD)
Jackie Johnson, RFMD, Greensboro, NC
Jackson Labs Technologies Inc.
Jacques C. Rudell, RFIC 2013 General Chairman
Jacquie McNish and Sean Silcoff; Reviewed by Gary Lerude
Jad Faraj, Verspecht-Teyssier-DeGroote SAS, France; Simon Mathias, Mesuro Ltd., UK; Jean-Pierre Teyssier, XLIM, University of Limoges, France; Johanne
JADAK
Jae-Ho Yoon, Won-Yong Cho, Ah-Rah Koh, Seung-Jun Lee, Bhanu Shrestha, Gary P. Kennedy and Nam-Young Kim, Kwangwoon University Seoul, Korea
Jaehoon Kim, Smit Baua, Gopinath Gampala and Aniket Hegde, Altair Engineering, Troy, Mich.
Jagjit Singh Bal, Infineon Technologies North America Corp.
Jaime Leger, Partner at SLN – Sheppard, Leger, Nowak Inc. Marketing Communications
Jaime Leger, SLN
Jake Goldstein and Mehdi Soltan
Jaleh Komaili, Darioush Agahi and Masoud Kahrizi, Senior Members, IEEE
Jaleh Komaili, Senior Member, IEEE, Darioush Agahi, and Masoud Kahrizi, Senior Member, IEEE
Jamal S. Izadian, AntennEM Communication LLC
Jamal S. Izadian, Ph.D, RFCONNEXT, Inc.
James C. Rautio, IEEE Fellow, FRSE
James C. Rautio, Sonnet Software
James C. Rautio, Sonnet Software Inc., Syracuse, N.Y.
James Chen
James E. De Broeck
James Frame, PhD, Jeritt Kent and Ian Lawee, Analog Devices Inc., Norwood, MA
James J. Rosenberg, Michael P. DeLisio and Blythe C. Deckman Wavestream Corp., Chun-Tung Cheung and David B. Rutledge California Institute of Technolo
James Kimery and Ian Wong, National Instruments, Austin, TX
James Kimery, Director of Marketing, National Instruments
James Kimery, National Instruments, Austin, Texas
James Logothetis and Kevin Spencer, Crane Aerospace & Electronics, West Caldwell, N.J.
James Rautio, Sonnet Software, Liverpool, NY
James Rautio, Sonnet Software, Syracuse, NY, John Reynolds and Allen F. Horn III, Rogers Corp., Rogers, CT
James Skinner and Nick Ridler, National Physical Laboratory, Teddington, U.K.
James Spoto, Applied Wave Research Inc.
James Swonger, Peter Bacon and Gary Wu, Peregrine Semiconductor, San Diego, CA
James Truchard, National Instruments, Austin, Texas
James Weiler, IMS MicroApps 2012 Chair
James Wong, Andrei Grebennikov and Naoki Watanabe, Sumitomo Electric Europe Ltd.
Jan Carlsson, RanLOS AB, Gothenburg, Sweden
Jan E. Prochnow, Rohde & Schwarz Munich, Germany
Jan Whitacre, Agilent Technologies, Santa Clara, CA
Janet Ooi, Keysight Technologies
Janet Smith
Jang-Hyeon Jeong, Young Yun, Hong-Seung Kim and Nat-Won Jang, Korea Maritime University, Yunju Baek, Pusan National University
Janine Love Event Director and Contributing Editor, Microwave Journal
Janine Love, Contributing Editor MWJ, Editor SIJ
Janine Love, Contributing Editor, Microwave Journal
Janine Love, EDI CON Event Director
Janine Love, Technical Program Director, EDI CON China 2017
Janine Love, Technical Program Director, EDI CON China 2018
Jason Breitbarth and Joe Koebel, Holzworth Instrumentation
Jason Breitbarth, Holzworth Instrumentation, Boulder, CO
Jason Breitbarth, Saetta Labs, Boulder, Colo.
Jason Schreiber, SixArms, Queensland, Australia
Jason Smith
Jason Smith and Pat Malloy
Jason Smith and Pat Malloy, AR Worldwide
Jason Smith; Manager Applications Engineer and Pat Malloy; Sr. Applications Engineer. AR Worldwide
Jason Zhang, Jonas Urbonas and Giampiero Esposito, Maury Microwave, Ontario, Calif.
Jaume Anguera, Fractus Antennas and Universitat Ramon Llull
Javelin Semiconductor Inc.
Javelin Semiconductor, Austin, TX
Jay McDaniel, Jie-Bang Yan and Sivaprasad Gogineni, University of Kansas, Lawrence, Kan.
Jayant Kumar Rai and Pinku Ranjan, Atal Bihari Vajpayee Indian Institute of Information Technology and Management Gwalior, Madhya Pradesh, India
Jazz Semiconductor
JCREW
Jean Francois Favennec, Cedric Quendo, Universite de Brest
Jean-Jacques Bouny
Jean-Jacques DeLisle, EMRFS, Theodore, Ala.
Jean-Jacques DeLisle, IXS, Theodore, Ala.
Jean-Pierre Bertinet, Eddie Leleux and Jean-Pierre Cazenave, THALES Microelectronics; Jean-Pierre Ganne, Michel Paté and Richard Lebourgeois, THALES R
Jean-Pierre Bienaime, Chairman, UMTS Forum London, UK
Jeanmarc Laurent and Chinh Doan, Milliwave Silicon Solutions Inc., San Jose, Calif.
Jed Rice
Jeff Barney and Scott Langdon, Remcom Inc., State College, Pa.
Jeff Burkett, Tim Dolan, Rafi Hershtig, K&L Microwave; Douglas King, Pole/Zero Corp.
Jeff Gengler and James Nelson, Qorvo Inc., Richardson, Texas
Jeff Hassannia, President, Aerospace BD
Jeff Heynen, Dell’Oro Group, Redwood City, Calif.
Jeff Owens
Jeff Shamblin, Ethertronics, San Diego, CA
Jeff Shamblin, Taoglas, Enniscorthy, Ireland
Jeff Stitt
Jeffrey Jargon, Jon Martens, Andrej Rumiantsev and Marc Vanden Bossche
Jeffrey M. Pond, IMS 2011 General Chairman
Jeffrey M. Pond, Naval Research Laboratory and IMS General Chair, Washington, DC
Jenn DiMarco, Staff Editor, Microwave Journal
Jennifer DiMarco and Frank Bashore
Jennifer DiMarco and Frank Bashore Microwave Journal staff
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Jennifer DiMarco, Managing Editor, Microwave Journal
Jennifer DiMarco, Staff Editor
Jenshan Lin, General Chair
Jeong-Gab Ju, Young Yun, Young-Bae Park and Suk-Youb Kang Korea Maritime University, Busan, Korea
Jeonghyeon Cha, Ildu Kim, Sungchul Hong and Bumman Kim, Pohang University of Science and Technology (POSTECH), Gyeongbuk, South Korea, Jong Sung Lee a
Jeremy K. Raines
Jeremy K. Raines, Raines Engineering
Jeremy Wensinger, Cobham Defense Systems, Washington, DC
Jerome Kerr
Jerry D. Neal
Jerry Hausner, Electro Science Technologies
Jerry Jordan
Jerry Yue and Jeff Kriz
Jersey Microwave
Jesper Thaysen, Nokia Denmark; Kaj B. Jakobsen, Technical University of Denmark
Jesse C. James
Jessy Cavazos, Keysight Technologies
Jessy Cavazos, Keysight Technologies, Santa Rosa, Calif.
Jessy Cavazos, Keysight Technologies, Santa Rosa, Calif.
JFW
JFW Industries Inc., Indianapolis, Ind.
Jian An, Guang-ming Wang, Chen-xin Zhang and Hui-yong Zeng, Air Force Engineering University, Sanyuan, P.R.C.
Jian-kang Xiao South China University of Technology Guangzhou, China, Shi-wei Ma Shanghai Key Laboratory of Power Station Automation Technology Shangh
Jian-Kang Xiao, Xidian University, State Key Laboratory of Millimeter Waves; Wen-Jun Zhu, Hohai University
Jian-Kang Xiao, Xidian University, Xi’an, China, and State Key Laboratory of Millimeter Waves, Nanjing, China; Wen-Jun Zhu, Hohai University, Changzho
Jian-Qiang Gong and Chang-Hong Liang, Xidian University, Xi’an, China
Jiang Liu, Hugo Morales, Thomas Weller and Larry Dunleavy, Modelithics Inc., Tampa, FL; Gerhard Schoenthal, Virginia Diodes Inc., Charlottesville, VA
Jianhao Ma, Yong Fang, Qingsong Zhang, Huijun Wang, Ziwei Xie and Qi Zhang, Chengdu University of Technology, Chengdu, China
Jianhua Deng, Sichuan Zhongce Microgrid Technology Co. Ltd.
Jianing Zhao, Jianyi Zhou, Jianfeng Zhai, Xiao Liang and Wei Hong, Southeast University, Nanjing, P.R. China
Jianing Zhao, Xiaowei Zhu, Jianyi Zhou, Jin Liu
Jianjun Gao, East China Normal University Shanghai, P.R. China
Jianyi Zhou, Jianing Zhao, Wei Hong and Xiaowei Zhu, Southeast University
Jianyi Zhou, Lei Zhang, Wei Hong, Jianing Zhao and Xiaowei Zhu, Southeast University
Jianyi Zhou, Limin Feng, Xiaowei Zhu and Wei Hong
Jianzhong Chen and An-Xue Zhang, Jiaotong University, Xi’an, Shaanxi, China; Kun Deng and Shuai Yang, Xidian University, Xi’an, Shaanxi, China
Jianzhong Chen, Jie Shen, Ni Gao and Anxue Zhang, Xi’an Jiaotong University, Xi’an, Shaanxi, China
Jie Li, Jia-Bei Zhao, Jia-Jun Liang, Lin-Lin Zhong and Jing-Song, Hong University of Electronic Science and Technology of China, Chengdu, China
Jim Barthold
Jim Barthold, <i>Telecommunications</i>®
Jim Barthold, Telecommunications
Jim Barthold, Telecommunications Magazine
Jim Carlini
Jim D’Ostilio Microwave Circuits Inc. Lynchburg, VA
Jim DeLap
Jim Fallon
Jim Fallon President and CEO, Fallon & Associates LLC
Jim Fallon President and CEO, Fallon and Associates LLC
Jim Fallon, Fallon and Associates Consulting LLC
Jim Fallon, Fallon and Associates LLC, Hingham, MA
Jim Fallon, Hittite Microwave Corporation, Corporate Business Development, Military Systems
Jim Fallon, President and CEO of Fallon & Associates Consulting
Jim Fallon, President and CEO, Fallon and Associates Consulting LLC
Jim Fallon, President and CEO, Fallon and Associates LLC
Jim Harvey
Jim Henderson and Billy Kao, Innovative Integration, Camarillo, Calif.
Jim Holbrook, SiTime, Sunnyvale, Calif.
Jim Mayock, VIPER RF Ltd.
Jim Morgan, SemiGen Inc.
Jim Ross, Skyworks Solutions Inc., Woburn, Mass.; Vic Wilkerson and Peter Lefkin MIPI® Alliance
Jim Stratigos, CEO, Jacket Micro Devices
Jim Tabor Product Planner, Real-Time Spectrum Analyzer Group, Tektronix Inc.
Jimmy Yu, Dell’Oro Group, Redwood City, Calif.
JIN-KUK LEE, SU-TAE KIM AND YONG-CHAE JEONG Chonbuk National University, JONG-SIK LIM Soonchunhyang University, Asan, Korea, CHUL-DONG KIM, Sewon Tele
Jin-Su Kim and Hee-Yong Hwang, Kangwon National University, Chuncheon, South Korea
Jinaing Zhao, Jianyi Zhou, Xiao Liang and Jianfeng Zhai, School of Information Science and Engineering, Southeast University
Jinaing Zhao, Jianyi Zhou, Xiao Liang, Jianfeng Zhai, School of Information Science and Engineering, Southeast University, Nanjing, P.R. China
Jinbiao Xu, Agilent Technologies
Jincan Zhang, Bo Liu, Leiming Zhang and Ligong Sun, Henan University of Science and Technology, Luoyang, China
Jincan Zhang, Bo Liu, Leiming Zhang, Jinchan Wang and Qing Hua, Henan University of Science and Technology
Jincan Zhang, Ligong Sun, Min Liu, Liwen Zhang and Bo Liu, Henan University of Science and Technology, Luoyang, China
Jincan Zhang, Min Liu, Jinchan Wang, Liwen Zhang and Bo Liu, Henan University of Science and Technology, Luoyang, China
Jing Guo, XianQi Lin, YuXin Kang, ChangSong Liang and Delanyo Kulevome, University of Electronic Science and Technology of China
Jing Guo, XianQi Lin, YuXin Kang, ChangSong Liang and Delanyo Kulevome, University of Electronic Science and Technology of China
Jinwoo Jung and Yeongseog Lim, Chonnam National University Gwangju, Korea; Hyeonjin Lee, Dongkang College, Gwangju, Korea
Jinwoo Jung and Yeongseog Lim, Chonnam National University; Hyeonjin Lee, Dongkang College
Jiri Polivka, Spacek Labs Inc.
JitterLabs LLC
Jiyeon Jang, Yejune Seo, Yejin Lee, Department of Information and Telecommunication Engineering, Incheon National University, Incheon, South Korea
Jiyoun Munn, COMSOL, Inc., Burlington, Mass.
Joachim Samuelsson
Joakim Espeland and Andrian Buchi, QuadSAT, Denmark
Joakim Espeland, QuadSAT, Odense N, Denmark
Jochen Wolle and Rainer Lenz, Rohde & Schwarz, Munich, Germany
Joe Chandler, Millitech (Smiths Microwave), Northampton, Mass.; R. William Steagall, L-3 Communication Systems-West, Salt Lake City, Utah
Joe Chandler, Millitech Inc., a Smiths Interconnect Business, Northampton, MA
Joe Cozzarelli, Anadigics
Joe Gorin and Michael Dobbert, Agilent Technologies, Santa Rosa, CA
Joe Madden Avago Technologies San Jose, CA
Joe Madden, Mobile Experts, Campbell, Calif.
Joe Madden, Mobile Experts, Silicon Valley, Calif.
Joe Madden, Mobile Experts; Anirban Bandyopadhyay and Ned Cahoon, GlobalFoundries; Harish Krishnaswamy, MixComm
Joe Madden, Principal Analyst, Mobile Experts
Joe Pusl, Srikanth Sridharan, Philip Antognetti, David Helms, Anurag Nigam, James Griffiths, Kenneth Louie, Mark Doherty
Joel Brand, Kumu Networks, Sunnyvale, Calif.
Joel Dobler and Sam Ringwood, Analog Devices, Wilmington, Mass.
Joel Dobler and Sam Ringwood, Analog Devices, Wilmington, Mass.
Joel Dobler, Analog Devices, Wilmington, Mass.
Joel Dunsmore
Joel Dunsmore, Agilent Technologies Inc., Santa Clara, CA; Ted Heil and Harvey Kaylie, Mini-Circuits, Brooklyn, NY
Joel Dunsmore, Greg Jue and John Kikuchi
Joel Goldstein, President, Goldstein Group Communications Inc.
Joel Kirchman, AWR
Joel Kirschman
Joel Kirshman, AWR Corp.
Joel M. Libove, Brendan R. Illingworth, Steven J. Chacko - Furaxa Inc.; Hal L. Levitt, Naval Research Laboratory
Joel P. Dunsmore, Agilent Technologies Inc., Santa Rosa, CA
Joerg Koepp and Nikola Serdar, Rohde & Schwarz
Johannes Benedikt
Johannes van Bezouwen and Dr. Michael Brandfass, HENSOLDT Sensors GmbH
Johanson
Johanson Technology Inc.
Johanson Technology, Camarillo, Calif.
John Barfuss, Agilent Technologies
John Barr, General Chairman, 2006 International Microwave Symposium
John Brewer
John Brewer and Peter Gammel, SiGe Semiconductor Inc.
John Bushie
John Coonrod, Rogers Corp., Chandler, Ariz.
John Coonrod, Rogers Corp., Chandler, AZ and Brian Rautio, Sonnet Software, North Syracuse, NY
John Coonrod, Rogers Corp., Rogers, CT
John Cowles, Senior Director of Engineering & Technology, Analog Devices, Norwood, Mass.
John Dames, Reticulate, Palm Bay, Fla.
John Dunn, National Instruments, Austin, Texas
John E. Penn
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John F. Aubin
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John Hendricks, Rogers Corp.
John Hoschette
John Kilpatrick and Robbie Shergill, Analog Devices, Norwood, Mass.; Manish Sinha, Xilinx Inc., San Jose, Calif.
John Lee, RFHIC, Gwacheon, South Korea
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John Mruz, Sr., Retired Microwave Engineer
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John S. Hansen, Keysight Technologies Inc., Santa Rosa, Calif.
John Silvestro, Kezhong Zhao and Arien Sligar; ANSYS Inc., Canonsburg, PA
John Thornton, Andy White and Graham Long, University of York, UK
John W. Schultz, Compass Technology Group, Roswell, Ga.
John W.M. Rogers and Calvin Plett
John Walker and James Custer, Integra Technologies Inc.
John Walker and James Custer, Integra Technologies, El Segundo, Calif., Malcolm Edwards, Cadence, El Segundo, Calif.
John Walker, Integra Technologies, El Segundo, Calif.
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John Wood and Gayle Collins, IMS2023 General Chairs
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Joint Institute for VLBI in Europe
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Jon Martens, Anritsu Co., Morgan Hill, CA Jeffrey Hesler and Alex Arsenovic, Virginia Diodes Inc., Charlottesville, VA
Jon Martens, Anritsu Co., Morgan Hill, Calif.
Jonathan Chisum, University of Notre Dame, Notre Dame, Ind.
Jonathan Leitner, Menlo Micro, Irvine, Calif.
Jonathan Loo, University of Hertfordshire, Hertfordshire, U.K.
Jonathan Wells, AJIS Consulting
Jonathan Wells, AJIS LLC, San Francisco, CA
Jonathan Wells, Consultant
Jong-Hwan Lee and Kyung-Whan Yeom, Chungnam National University, Daejeon, Korea
Jonthan Wells
Joon-Won Jang and Hee-Yong Hwang
Jordan Mizerak, JETCOOL Technologies Inc., Littleton, Mass.
Jörg Köpp, Rohde & Schwarz, Munich, Germany
Jorge A. Ruiz-Cruz, Universidad Autónoma de Madrid; Chi Wang, Orbital Sciences Corp.; Kawthar A. Zaki, University of Maryland
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Microwave Journal
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JQL Electronics
JQL Technologies
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Juan Cordovez, James Victory, Samir Chaudhry, Volker Blaschke, Zhixin Yan, Robert Milkovits, Ivan Ban and Marco Racanelli, Jazz Semiconductor
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Juan L. Cano and Eduardo Artal, University of Cantabria, Santander, Spain
Juergen Hartung, Keysight Technologies, Santa Clara, CA
Julian Emmerich and Harald Rudolph KVG Quartz Crystal Technology GmbH, Neckarbischofsheim, Germany
Julian Emmerich and Harald Rudolph, KVG Quartz Crystal Technology GmbH, Neckarbischofsheim, Germany
Julie Declercq
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Julie Teinert, Mimix Broadband
Julien Regoli, VP Operations, Maravedis Inc.
Jun Lee, Skyworks Solutions Inc., Irvine, CA
Jun Won Huh, Ik Soo Chang, Chul D. Kim
Jun-Bao Du, Lin Li and Xian-Chuang Su, Zhejiang Sci-Tech University, Hangzhou, China
Jun-Seok Park, Kookmin University
Junghyun Cho and Sungtek Kahng, Department of Information and Telecommunication Engineering, Incheon National University, Incheon, South Korea
Junil Choi, Pohang University of Science and Technology (POSTECH), Pohang, Gyeongbuk, Korea
Juniper Research
Junkosha USA Inc., Irvine, Calif.
Junkosha, Irvine, Calif.
Junkosha, Irvine, Calif.
Junying Liu, Dongjin Wang, Shengzhao Xiang, Weidong Wang and Sheng Zhang, University of Science and Technology of China, P.R. China
Jürgen Hartung; Cadence Design Systems Inc., Munich, Germany
Jussi Rahola and Jaakko Juntunen Optenni Ltd., Finland
Jussi Rahola and Jaakko Juntunen, Optenni Ltd., Finland
Justin Gallagher, Joseph A. Haimerl, Thomas Higgins and Matthew Gruber, Lockheed Martin MST, Moorestown, N.J.
Jwo-Shiun Sun
Jwo-Shiun Sun , Kwong-Kau Tiong and Jiann-Hwang Liu
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Jwo-Shiun Sun, Tsung-Lin Lee
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K K Jain, Kirti Bansal, Meenakshi Aggarwal, B S Matheru
K. Narendra, Motorola Technology; E. Limiti and C. Paoloni, University of Roma Tor Vergata; V. Zhurbenko, Technical University Denmark
K. Narendra, Motorola Technology; M.F. Ain, J.S. Mandeep and S.I.S. Hassan, University Sains Malaysia
K. Rambabu, M. Ramesh and A.T. Kalghatgi
K. Singh and K. Ngachenchaiah, Semi-Conductor Laboratory Near Chandigarh, India, D. Bhatnagar, University of Rajasthan, Jaipur, India, S. Pal, ISRO Sa
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K. Vaesen, A. Visweswaran, S. Sinha, A. Bourdoux, B. van Liempd and Piet Wambacq, imec, Leuven, Belgium
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K.V. Puglia
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K.W. Kobayashi A.K. Oki, A. Gutierrez-Aitken. J. Cowles, L.T. Tran, T.R. Block and D.C. Streit
K&L Microwave
K&L Microwave Inc., Salisbury, Md.
K&L Microwave, Salisbury, MD
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Kaben Wireless Silicon Inc.
Kae-Oh Sun and Hai Zhang, University of Wisconsin, Madison, Wis.
Kaelus (a Smiths Company), Centennial, CO
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Kaijun Song, Jia Yao, and Qian Li
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Kaltman Creations
Kamaljeet Singh and K. Nagachenchaiah, Semiconductor Laboratory
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Keithley Instruments
Keithley Instruments Inc.
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KEMET Electronics GmbH
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Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business, Santa Rosa, Calif.
Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business
Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business, Santa Rosa, Calif.
Keysight Technologies Inc., Santa Rosa, Calif.
Keysight Technologies Inc., Santa Rosa, Calif.
Keysight Technologies, NI/AWR, ANSYS, COMSOL, CST, Delcross and Sonnet Software
Keysight Technologies, Santa Rosa, Calif.
Khaled Khalaf
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KMW USA Inc., Fullerton, CA
Knowles Capacitors
Knowles Capacitors, Norwich, U.K.
Knowles Corp.
Knowles Precision Devices
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Koch Industries Inc.
Kohei Fujii and Henrik Morkner, Avago Technologies
Kohei Fujii, John Stanback, and Henrik Morkner - Avago
Kohei Fujii, John Stanback, and Henrik Morkner - Avago Technologies
Kohei Fujii, John Stanback, and Henrik Morkner, Avago Technologies
Kokulathasan Thalayasingam and Holger Heuermann, Heuermann HF-Technik GmbHAachen, Germany
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KP Performance Antennas Edmonton, Alberta, Canada
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Krešimir Malaric
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KRYTAR Inc., Sunnyvale, Calif.
Kuhne Electronic GmbH, Berg, Germany
Kumar Narendra & Sangaran Pragash, Motorola Technology, Penang, Malaysia; Lokesh Anand, M.F. Ain & S.I.S. Hassan, University of Science Malaysia
Kumar Narendra, Sangaran Pragash and Chacko Prakash, Motorola Technology; Lokesh Anand, M.F. Ain and S.I.S. Hassan, University Science Malaysia
Kwangjin Koh and Gabriel M. Rebeiz University of California at San Diego
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Kymeta
Kymeta
Kyocera America
Kyocera America Inc.
Kyoung-Joon Cho and Wan-Jong Kim, Dali Wireless; Ji-Yeon Kim and Jong-Heon Kim, Kwangwoon University; Shawn P. Stapleton, Simon Fraser University
Kyu-Ho Park, Hee-Seok Song, Young-Shin Lee, and Yong-Chae Jeong
Kyungseok Kahng, Sungtek Kahng and Inkyu Yang, Incheon National University; Qun Wu Harbin Institute of Technology
L
L-3 Communications
L-3 Electron Devices, San Carlos, Calif.
L-3 Electron Technologies Inc.
L-3 Global Connectivity
L-3 Southern California Microwave
L-3 Telemetry & RF Products
L-3 Telemetry-East
L-3 Telemetry-West
L-3 TRL Technology
L-3 WESCAM
L-com
L-com Inc., North Andover, Mass.
L. Chen, Y. Shang and Y.L. Zhang, Xi’an Technological University, Xi’an, P.R. China; F. Wei, Xidian University, Xi’an, P.R. China
L. Devlin, A. Dearn, G. Pearson and T. Richards, Plextek Ltd., Great Chesterford, UK
L. Dunleavy, W. Clausen and T. Weller
L. Durand, L. Duchesne, L.J. Foged, Reuven Konevky, Lior Shmidov: SATIMO & ORBIT/FR
L.V. Kasatkin and N.F. Karushkin
Labtech Microwave
Ladybug Technologies LLC
LadyBug Technologies LLC
LadyBug Technologies, Boise, Idaho
LadyBug Technologies, Santa Rosa, CA
Laird R&F Products
Laird Technologies
Laird Technologies Inc.
Laird Thermal Systems
Lake Shore Cryotronics
Lake Shore Cryotronics
Lambert Devoe and Alan Devoe
Lamberto Raffaelli
Lamhroe
Lamin Zhan, Kun Li and Guoan Wu, Huazhong University of Science and Technology, Wuhan, China
Lamin Zhan, Yang Pei, Zuwei Li and Wenguang Li, Huazhong University of Science and Technology, Wuhan, China
Lamina Ceramics
Lance Doherty, Jonathan Simon and Thomas Watteyne, Dust Networks Product Group, Linear Technology Corp., Milpitas, CA
Langer EMV-Technik GmbH, Bannewitz, Germany
Lantiq and T-Venture
Alex D. Lapidus, L-3 Communications
Lark Engineering
Larry Dunleavy and Chris DeMartino, Modelithics Inc., Tampa, Fla.
Larry Dunleavy and Hugo Morales, Modelithics Inc.; Charles Suckling and Kim Tran, Qorvo Inc.
Larry Dunleavy, IMS 2014 Chair; Tom Weller, IMS 2014 Vice-Chair
Larry Dunleavy(1,2), The University of South Florida(1), Tampa, Fla.
Larry Giacoletto
Laser Services
Laser Services
Laser Services
Laser Services
Laser Services
Guang Yang, Wei Liu and Falin Liu, University of Science and Technology of China Last
Anritsu Corp. Microwave Measurement Division (MDD) Last
MVG (Satimo) Industries Last
Guzik Technical Enterprises Last
Laura Borgstede, Calysto Communications
Laura Casasanto, Staff Editor, Microwave Journal
Laurent Desclos, Ethertronics, Inc.
Lawrence (“Larry”) Dunleavy
Lawrence Kushner, RFIC 2014 General Chair; Bertan Bakkaloglu, TPC Co-Chair; Albert Wang, TPC Co-Chair
Lawrence P. Dunleavy, Modelithics Inc.
Lawrence P. Dunleavy, Thomas M. Weller, Paul G. Flikkema, Horace C. Gordon, Jr. and Rudolph E. Henning
Lawrence Williams, Matthew Commens and Steve Rousselle, ANSYS Inc.
Lawrence Wilson, Rohde & Schwarz, Munich, Germany
Leader Tech
LeCroy Corp.
LeddarTech and IDT
Ledezma (USF), Weller (Modelithics), Robin (Motorola)
Legacy Technologies Inc.
Lei Xin, Kaiyuan Cao and Xiaoqing Yang, Sichuan University, Chengdu, China
Lei Xu, Guohua Liu and Han Feng, Hangzhou Dianzi University, Hangzhou, China
Leif Jensen, TopSil Global Wafers A/S, Frederikssund, Denmark
Lemko Corp.
Len Crane, Coilcraft
Lennart Berlin, Saab Aerodefense, Stockholm, Sweden
Lenovo
Lenthor Engineering
Leo G. Maloratsky
Leo G. Maloratsky, Aerospace Electronics Co.
Leo G. Maloratsky, Aerospace Electronics Co., Indialantic FL
Leo G. Maloratsky, Rockwell Collins
Leo G. Maloratsky, Rockwell Collins; Simon Y. London, Advanced Power Technologies Inc.
Leo Gumina
Leo Sennott
Leo Sennott
Leonard Pelletier, Freescale Semiconductor
Leonardo
Leonardo DRS
Leonardo MW Ltd.
Leonardo-Finmeccanica
Leondard Hayden and Brett Grossman, ARFTG Conference Co-Chairs
Leonhard Sturm-Rogon, Robert Wieland and Wilfried Lerch, Fraunhofer EMFT, Munich, Germany
Leopold E. Pellon, Otava Inc., Moorestown, N.J.
Les Besser
Les Crane, Coilcraft
Leti
Li Zhao, Jian-Yi Zhou, Wen-Wen Yang, Zhi-Qiang Yu and Li-Na Cao, Southeast University, Nanjing, China
Yong-Qing Leng, Yun Zeng, Guo-Liang Zhang and Wei Peng, Hunan University, Changsha, China Li-Jun Zhang, Ya-Tao Peng, Jin Guan, Hui Lu and Zhan-Qi Zheng, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China
Li-Li Yang, Lin Li, Ting Lang, Zhi-Hao Zhang and Kai-Yu Zhao, Zhejiang Sci-Tech University, Hangzhou, China
Liam Devlin, Plextek RF Integration, Great Chesterford, UK
Liang Han, Ke Wu, Xiao-Ping Chen and Fanfan He, École Polytechnique de Montréal, Montreal, Canada
Liang Jia, University of Electronic Science and Technology of China, Chengdu, China
Liang Ma, Jianyi Zhou and Weichen Huang, Southeast University, Nanjing, China
Liang-Hui Li and Huey-Ru Chuang, National Cheng Kung University
Lianqing Ji, Zhiming Xu, Jianyi Zhou and Jianfeng Zhai, Southeast University, Nanjing, Jiangsu, China
Lianwu Yang and Ying Li, Yichun University, Yichun, China
LightSquared
Lijun Zhang, (1) Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
Lily Geller, Tufts University, Medford, Mass.
Lime Microsystems
Yijun Lin
Lin Lin and Kevin Loughran, Jabil Circuits, Inc., Warren, N.J.
Lin Qiang, Zhang Zu Ying and Guo Wei; Air Force Radar Academy and Huazhong University of Science and Technology
Lin Sun
Lin-Sheng Liu, University of Electronic Science and Technology of China, Chengdu, China
Lina Schmidt, SSB-Electronic GmbH, Lippstadt, Germany
Linear Technology
Linear Technology Corp.
Linear Technology Corp., Milpitas, Calif.
Linear Technology, Milpitas, CA
Linearizer Technology Inc.
LingXia Wang Xidian University, Shaanxi, China HaoJia Lin China Academy of Space Technology, Shaanxi, China
Link Labs
Link Microtek
Link Microtek, Basingstoke, UK
Linli Xie, Yong Hong Zhang and Yong Fan, University of Electronic Science and Technology of China, Chengdu, China
Linwave Electronic Manufacturing Services
Linwave Technology, Lincoln, UK
Linx Technologies
Lise Proust
Litron
Guohua Liu
LNX Corp.
LNX Corp. Salem, NH
Lockard & White
Lockheed Martin
Lockheed Martin Aeronautics
Lockheed Martin Corporation
Locus Microwave Inc., Boalsburg, PA
Locus Microwave, Boalsburg, PA
Lorch Microwave
Loren Betts, Agilent Technologies and Dylan T. Bespalko and Slim Boumaiza, University of Waterloo, Canada
Loren Betts, Agilent Technologies Inc., Santa Clara, CA
Lorenz-Peter Schmidt, General Chairman; Charles Ayotte, Horizon House Publications Inc.
Lorne Graves, Mercury Systems Inc., Chelmsford, Mass.
Los Angeles Air Force Base
Louis Fan Fei, Garmin International
LPKF
LPKF Laser & Electronics
LPKF Laser & Electronics AG, Garbsen, Germany
LPKF Laser & Electronics AG, Garbsen, Germany
LPKF Laser & Electronics, USA
LPRS
Luca Galatro and Raffaele Romano, Vertigo Technologies, The Netherlands
Luca Galatro, Vertigo Technologies, Delft, The Netherlands
Luca Perregrini, EuMW General Chair, University of Pavia, Italy
Luca Stroppolo, Ericsson NSI, Rome, Italy
Lucent Technologies Inc.
Lucia David, Selex Systemi Integrati, Rome, Italy
Luciano Tarricone, EuMW General Co-chair, University of Salento, Italy
Lucix Corp.
Lucy Berridge, Stephen Stones, Peter Kingsland, Tania Harvey and Ross Parsons
Luke Getto, Microlab
LUMILOOP
Luo Xiaobin, Guo Dechun, Yu Weihua, Lv Xin, Beijing Institute of Technology, Beijing, China
Luso Electronics
Lute Maleki, OEwaves, Pasadena, CA
Lutz Wunderlich, Michael Wleklinski, Thorsten Liebig and Simona Bruni, IMST GmbH, Kamp-Lintfort, Germany
Lynk & Co.
LYNX
M
m
M Wave Design Corporation
M-Wave Design Corp., Simi Valley, Calif.
M. ABRI, N. BOUKLI-HACENE AND F.T. BENDIMERAD, Université Abou Bekr Belkaïd, Tlemcen, Algeria; E. CAMBIAGGIO, Université de Nice – Sophia Antipolis, V
M. Conte, University of Massachusetts, Amherst, Mass.
M. Fujimoto
M. Gurumurthy and M. McKernan, Spirent Communications
M. Hagensen, Guided Wave Technology ApS, Hilleroed, Denmark
M. Ibrahim Khalil, Armin Liero, Andreas von Müller and Thomas Hoffmann
M. Imran Cheema, Andrew Kirk McGill University
M. Kameche, and N.V. Drozdovski; National Centre of Space Techniques and ETEC
M. Kameche, M. Feham
M. Mathian, E. Korolkewicz, P. Gale and E.G. Lim
M. McKeown, Hesse-Mechatronics, Inc., Paderborn, Germany
M. Obrien
M. Oldoni, S. Moscato, G. Biscevic and G. Solazzi, SIAE Microelettronica, Milan, Italy
M. Oldoni, S. Moscato, G. Biscevic, G.L. Solazzi and G. Skiadas, SIAE MICROELETTRONICA, Milan, Italy
M. Oldoni, S. Moscato, G. Biscevic, G.L. Solazzi, SIAE MICROELETTRONICA, Milan, Italy and G. Skiadas, COSMOTE, Athens, Greece
M. Palandöken, Gediz University; A. Sondas, Kocaeli University
M. Perotoni and L.A. de Andrade, CST AGl; M.C. Rezende and H. Vieira, Jr., IAE Space and Aeronautic Institute
M. Rack, L. Nyssens and J. P. Raskin, ICTEAM, Université Catholique de Louvain, Louvain-la-Neuve, Belgium
M. Sypek, M. Makowski, Orteh SP. Z.O.O.; C. Martel, T. Crepin, F. Boust, Office National d'Etudes et de Recherches Aerospatiales
M. Wajih Elsallal, Jamie Hood and Ian McMichael, The MITRE Corporation, Bedford, Mass.; Travis Busbee, Voxel8, Somerville, Mass.
M. Weber, University of Oklahoma/National Oceanic and Atmospheric Administration, Norman, Okla.
M.B.I. Reaz, National University of MalaysiaSelangor, Malaysia; J. Uddin, S. Hussain, A.N. Nordin and M.I. Ibrahimy, International Islamic University
M.D. Brunsman, TriQuint Semiconductor, Hillsboro, OR
M.F. Ain, J.S. Mandeep, C.T. Chin, S.I.S. Hassan M.A.Othman and B.M. Nawang
M.J. Poulton, K. Krishnamurthy, J. Martin, B. Landberg, R. Vetury and D. Aichele, RF Micro Devices
M.N. Zybin, JSC Pluton, Moscow, Russia
M.O'Brien
M.P.R. Panicker, D. Douriet, M.S. Hyslop and N.L. Greenman
M.S. Muha, C.J. Clark, A.A. Moulthrop and C.P. Silva
M/A-COM Inc.
M/A-COM Inc., a Tyco Electronics company Roanoke, VA
M/A-COM Tech
M/A-COM Tech Asia
M/A-COM Tech Asia; Taiwan, ROC
M/A-COM Technology
M/A-COM Technology Solutions
M/A-COM Technology Solutions and Mimix Broadband
M/A-COM Technology Solutions Inc.
M/A-COM/Mesuro
M2 Global
M2 Global Technology Ltd.
M2 Global Technology Ltd.
MACOM
MACOM
MACOM Technology Solutions Inc.
Joe Madden
Madhu Gurumurthy, Spirent Communications
Madrone Coopwood and Jason Yoho, HYPERLABS Inc., Beaverton, Ore.
MagCap Engineering Inc.
Magdalena Salazar Palma and José Ignacio Alonso Montes, EuMW 2018 General Chair and General Co-Chair
Magfusion Inc.
MagnaChip Semiconductor Corp. and Peregrine Semiconductor Corp
MAGUS (Pty) Ltd
Magus (Pty) Ltd., Stellenbosch, South Africa
MAGUS, CST and EMSS
MAJ Staff
Maja Systems
Majid Razavi-Rad, Changiz Ghobadi, Javad Nourinia and Reza Zaker, Urmia University, Urmia, Iran
Malcolm Edwards, AWR Corp.
Man Ho Tsoi, Research and Development Office, The Education University of Hong Kong
Man Seok Uhm and In Bok Yom, ETRI, Daejeon, Korea; Juseop Lee, University of Michigan, Ann Arbor, MI; Jeong Phill Kim, Chung-Ang University, Seoul, Ko
Manish Shah, Tagore Technology Inc., Arlington Heights, Ill.
Manny Assurian, Ray Hashemi and Jim Assurian Reactel Inc.
Manny Assurian, Ray Hashemi and Jim Assurian, Reactel Inc.
Mano Vafai, WiMAX Forum® Application Architecture
Manos M. Tentzeris, Rushi Vyas, Vasileios Lakafosis, Taoran Le, Amin Rida and Sangkil Kim School of ECE, Georgia Tech, Atlanta, GA
Manos Tentzeris, Technical Program Chair
Manuel del Castillo and Henry Valenzuela
Mao Tian
Maravedis
Marc Faucher, V-Micro SAS, Villeneuve d’Ascq, France, Univ. Lille, CNRS, Centrale Lille, Univ. Polytechnique Hauts-de-France, Lille, France
Marc Frechette, Marketing Communications, Micronetics
Marc Stackler, Teledyne e2v, Hong Kong
Marc Vanden Bossche and David Vye, National Instruments, Austin, Texas
Marcel Kossel, Hansruedi Benedickter, Werner Bachtold, Roland King and Jan Hansen
Marco Pasian, University of Pavia, Pavia, Italy
Marco Spirito and Jeffrey Jargon, ARFTG 2023 Chairs
Marco Spirito, Basim Noori, Jeffrey Jargon and Jon Martens, ARFTG General Chairs
Marco Spirito, Jeffrey Jargon Jon Martens and Dennis Lewis, ARFTG 2023 Chairs Tech Program Chairs
Marconi Applied Technologies
Marconi Instruments Inc.
Marcus da Silva, Tektronix Inc.
Marcus Dasliva
Marinus (Ron) Korber, Jr.
Mario LaMarche, Mercury Systems, San Jose, Calif.
Mario Narduzzi, Keysight Technologies, Santa Rosa, Calif.
Marjan Grman, Iskra Sistemi
Mark Andres and Heatherly Bucher, Arena Solutions, Foster City, Calif.
Mark Bailly, EMC Technology, Stuart, FL
Mark Chapman, WiSpry Inc., Irvine, CA
Mark Elo Director, RF Products Keithley Instruments, Inc.
Mark Elo, Director, RF Products, Keithley Instruments
Mark Elo, Keithley Instruments
Mark Elo, Marketing Director of RF Products, Keithley Instruments
Mark Elo, Tabor Electronics, Nesher, Israel
Mark Elo, Tabor Electronics, Nesher, Israel
Mark Elo, Tektronix
Mark Fitzgerald, TechInsights, Needham, Mass.
Mark Hickle, BAE Systems, Nashua, N.H.
Mark Lombardi, RT Logic, Colorado Springs, CO
Mark Pierpoint, Keysight Technologies, Santa Rosa, Calif.; Gabriel M. Rebeiz, University of California, San Diego, Calif.
Mark R. Simpson and John M. Dixon
Mark Ravenstahl
Mark Roos, Roos Instruments, Santa Clara, Calif.
Mark Saffian - Soultion Architect, AWR Corp.
Mark Slovick
Mark Walker, Cobham Advanced Electronic Solutions, Arlington, Va.
Mark Winebrand and John Aubin, ORBIT/FR Inc.
Mark Winebrand, John Aubin and Russell Soerens, ORBIT/FR Inc.
Market Research Reports Inc.
MarketsandMarkets
Chris Marki
Marki Microwave Inc., Morgan Hill, Calif.
Marki Microwave, Morgan Hill, Calif.
Marko Marin, Infinera
Markus Kopp, ANSYS Corp., Canonsburg, PA, and Juliano Fujioka Mologni, ESSS, Brazil
Markus Zeier, Federal Institute of Metrology (METAS), Berne-Wabern, Switzerland
Marta Cabedo-Fabrés and Miguel Ferrando-Bataller, Iteam, Universitat Politècnica de València, València, Spain
Marta Iglesias
Marta Iglesias-Xamani
Marten Seth, Jeff Harth and Jonathan Leitner, Menlo Microsystems, Inc., Irvine, Calif.
Martha Zemede, Agilent Technologies, Santa Clara, CA
Martin Coleman, The Satellite Interference Reduction Group (sIRG), Douglas, Isle of Man, UK
Martin J. Salter and Nick M. Ridler, National Physical Laboratory, Teddington, Middlesex, UK
Martin Moder and Joachim Schubert, Rosenberger, Fridolfing, Germany
Martin Schmaehling, Rohde & Schwarz, Munich, Germany
Martin Timm
Marvell
Marvin Test Solutions Inc.
Mary Anne Tupta, Keithley Instruments
Maryam Rofougaran, CEO, Movandi
Masashi Nogawa,, Sr. Member of Technical Staff, Qorvo
Masashi Nogawa,, Sr. Member of Technical Staff, Qorvo
Masashi Nogawa,, Sr. Member of Technical Staff, Qorvo
Massachusetts Bay Technologies
Massachusetts Institute of Technology
Master Bond Inc.
Matajaz Vidmar
Mathew Hubbard, RFMD
MathWorks
Matjaz Vidmar
Matjaz Vidmar, University of Ljubljana
Matt Landry (@mattmatter), Vice President, Matter Communications
Matt Miller, Co-Owner & Principal RF Engineer II, EMA
Matt Morgan and Tod Boyd, National Radio Astronomy Observatory, Charlottesville, Va.
Matt Ozalas, Keysight Technologies Inc., Santa Rosa, Calif.
Matt Spexarth, National Instruments, Austin, Texas
Matteo Oldoni, Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico Di Milano, Milan, Italy
Matthew Funaiole, Brian Hart and Aidan Powers-Riggs, Center for Strategic and International Studies, Washington, D.C.
Matthew J. Maxwell, Tektronix Inc.
Matthew Morgan and Sander Weinreb, National Radio Astronomy Observatory, Jet Propulsion Laboratory
Matthew S. Clements, Department of Electrical and Computer Engineering, University of California, Davis, Calif.
Mauna Kea Semiconductors (MKSemi), San Jose, Calif.
Mauro Marchetti, Anteverta Microwave B.V. Delft, The Netherlands
Maury Microwave
Maury Microwave Corp., Ontario, Calif.
Maury Microwave Corp., Ontario, Calif.
Maury Microwave, Ontario, Calif.
Maxim Integrated Products Inc.
Maxim Integrated, San Jose, Calif.
MaxLinear Inc.
MAXRAD Inc.
Maxtek Components Corp.
MBDA
John McClurg
MCE-KDI Integrated Products
MCE/KDI Integrated Products
MCV Microwave, Laurel, Del.
MCV Microwave, San Diego, Calif.
Mearthane Products Corporation
MECA Electronics Inc., Denville, N.J.
MECA Electronics, Denville, N.J.
Meg Tredinnick and David Malanga
MegaPhase
MegaPhase LLC
MegaPhase, Stroudsburg, Pa.
MegiQ
Mehdi Nosrati, Islamic Azad University (IAU), Ilam Branch, Iran, Mojgan Daneshmand, University of Alberta, Edmonton, Alberta, Canada
Mehran Mossammaparast, Patrick Mullin, Nikki Quinn and Mike Sawicki, Quantic Wenzel, Austin, Texas
Meir Bartur, Optical Zonu, Van Nuys, Calif.
Melissa Cortez, MegaPhase, Stroudsburg, PA
Meller Optics Inc.
MEM Research
Mendy Ouzillou, Scintera; Arwyn Roberts, TriQuint Semiconductor
Mendy Ouzillou, Silicon Labs, Austin, Texas; Ross Yu, Linear Technology Corp. (Dust Networks Group), Milpitas, Calif.
Meng-Chung Tsai, Huey-Ru Chuang
Menlo Micro, Irvine, Calif.
Menlo Microsystems, Inc. Irvine, Calif.
Mentor Graphics
Mentor Graphics Corp., Wilsonville, Ore.
Mercury
Mercury Computer Systems Inc.
Mercury Systems Inc., Andover, Mass.
Meridian Medical Systems
Merrimac Industries Inc.
Mesa Microwave Corp.
MESL Microwave
MESL Microwave/Link Microtek
Messe München GmbH
Messe München International India Pvt. Ltd.
Mesuro
Mesuro Ltd.
MET Laboratories
Metal Processing Co. Inc
Metallized Carbon Corporation
Metawave
Metrigraphics
MFG Galileo Composites
MI Technologies
Mi-Young Lee, Chan-Young Jeong, Jae-Woo Park, Changsik Yoo, Hanyang University, Seoul, Korea; Jin-Soo Park, Samsung Advanced Institute of Technology,
Mic
MIcable
MIcable Inc.
Michael
Michael Ashman and Inder Bahl, M/A-COM Inc. Roanoke, VA
Michael Case
Michael Casper, President/CEO UltraSource, Inc.
Michael Casper, President/CEO, UltraSource Inc.
Michael D. Foegelle, ETS-Lindgren
Michael D. Foegelle, ETS-Lindgren, L.P.
Mark W. Ingalls, Machine2Wireless LLC, Fayetteville, Ark.; Michael D. Glover, University of Arkansas, Fayetteville, Ark.; Ed Liang, MCV Microwave Inc., San Diego, Calif.
Michael D. Hillbun, Diamond Engineering
Michael D. McKinley and Kate A. Remley, National Inst. of Standards and Technology, Boulder, CO; Maciej Myslinski, Katholieke Universiteit, Leuven, Be
Michael Heimlich, Applide Wave Research Inc.
Michael Heimlich, Macquarie University and Joseph Gering, RFMD
Michael Hiebel
Michael Hiebel, Rohde & Schwarz
Michael Hopkins, CurrentRF, Discovery Bay, CA
Michael J. Hannon and Pat Malloy
Michael J. Marcus
Michael Keeley, Spirent Communications
Michael Kettner, Patrick Biebersmith, Nelson Roldan and Balram K. Sharma
Michael Knox, Mode 1 Corp. Ben Zarlingo, Agilent Technologies
Michael Lawton and Peter Cain, Agilent Technologies Inc., Santa Clara, CA
Michael Millhaem
Michael O'Brien
Michael Oberle, Schmid & Partner Engineering AG Zurich, Switzerland
Michael Obrien
Michael Parnes
Michael Puttre
Michael Redding, Quantropi, Ottawa, Canada
Michael S. Heutmaker
Michael Sieber and Attila Simon, European Defence Agency (EDA)
Michael Weizmann
Michael Wohlert, Sang-Kyo Shin and Xiang Feng, Keysight Technologies
Michal Fiszer and Jerzy Gruszczynski
Michal Fiszer, Collegium Civitas, Warsaw, Poland
Michal Grabowski
Michal Odyniec
Michel M. Bègue, Agilent Technologies Inc.
Mician GmbH
Mician GmbH, Bremen, Germany
Mician, Bremen, Germany
Mickael Viot, Alexis Bizalion and Jervais Seegars, Qorvo, Greensboro, N.C.
MiCOM Labs Inc.
Micralyne Inc.
Micro Crystal
Micro Harmonics, Fincastle, Va.
Micro Harmonics, Fincastle, Va.
Micro Lambda Inc.
Micro Lambda Wireless Inc.
Micro Lambda Wireless Inc., Fremont, CA
Micro Metalsmiths Ltd.
Micro Modular Technologies
Micro Systems Inc.
Micro-Ant Inc.
Micro-Coax
Micro-Coax, Pottstown, Pa.
Micro-Precision Technlogies Inc. (MPT)
Micro-Precision Technologies Inc.
Micro-Precision Technologies Inc. (MPT)
Microchip, Chandler, AZ
Microlab
Microlab/FXR
Microlease
Micromanipulator Co.
Micron Technology Inc.
Micronetics
Micronetics Inc.
microRF Europe
Microsanj LLC, Santa Clara, Calif.
Microsemi
Microsemi Corp., Aliso Viejo, Calif.
Microsemi Corp.
Microsemi Corp. and Advanced Power Technology Inc.
Microsemi Corporation
Microsoft Corp.
Microsource Inc.
Microwave Components and Systems
Microwave dB
Microwave Development Labs
Microwave Dynamics
Microwave Flash
Microwave Hournal
Microwave Innovation Group
Microwave Innovation Group (MIG)
Microwave Innovation Group GmbH & Co. KG
Microwave Jounal
Microwave Jounral
Microwave Journal
Microwave Journal
Microwave Journal China
Microwave Journal Staff
Microwave Marketing Ltd./Linwave Technology
Microwave Solutions Inc.
Microwave Staff
Microwave Techniques
Microwave Techniques
MicroWave Technology Inc. (MwT)
MicroWave Technology Inc., Fremont, Calif.
Microwave Theory and Techniques Society
Microwave Vision
Microwave Vision Group (MVG)
Microwave Vision Group (MVG)
Microwave Vision Group (MVG), Kennesaw, Ga.
Microwave Vision Group, ORBIT/FR Inc.
Microwave Vision Group, ORBIT/FR, Horsham, PA
Microwave Vision Group, Paris, France
Microwwave Journal Staff
Micrwoave Journal
Miguel Á. García-Fernández, EMITE Ingeniería S.L. and David A. Sánchez-Hernández, Universidad Politécnica de Cartagena
Mike
Mike Donovan, MathWorks, Natick, Mass.; Andrei Cozma and Di Pu, Analog Devices Inc., Norwood, Mass.
Mike Geen, Filtronic, U.K.
Mike Greenelsh
Mike Heimlich, AWR Corp.
Mike Jones and Peter Delos, Analog Devices Inc., Norwood, Mass.
Mike Jones, Principal Electrical Design Engineer, Analog Devices Inc.
Mike Kappes, IQ-Analog Corporation, San Diego, Calif.
Mike Lincoln
Mike Lincoln, TriQuint Semiconductor Product Marketing
Mike McLernon, MathWorks, Natick, Mass.
Mike Millhaem, Michel Gagne, Greg Jue, Jin-Biao Xu, Jean-Marc Moreau, Keysight Technologies, Santa Rosa, Calif.
Mike O'Brien
Mike Obrien
Mike Roberts, Slipstream Engineering Design Ltd., Shipley, U.K.
Mike Santori, National Instruments; Jean Dassonville and Phil Lorch, Agilent Technologies; and Dave Hutton, Aeroflex
Mike Scarione, Nick Kolias, Michael Booen, Raytheon Co.; David McLaughlin, University of Massachusetts; M.C. Frank Chang, University of California at
Mike Seibel and Brian Denheyer, NI, Austin, Texas
Mike Violette
MILCOM
MILCOM 2009
MilesTek, Lewisville, Texas
Millennium Research Group
MilliBox, San Jose, Calif.
MilliLabs
MilliLabs brings innovative Wireless Channel Emulator to millimeters wave networks for new network generation, SG New Radio and Connected Vehicles.
Millitech Inc.
Milliwave Silicon Solutions Inc., San Jose, Calif.
Milliwave Silicon Solutions, Inc.
MILMEGA
MILMEGA Ltd.
MilSatCom USA
Mimix
Mimix Asia
Mimix Broadband
Mimix Broadband Inc.
Mimix Broadband Inc., Houston, TX
Mimix Broadband, Houston, TX
Mimix Broadband, Inc.
mimoOn
MIMOon GmbH
Mimosa Networks, Inc.
MIMOtech
Min Liu, Deyong Wang, Panpan Zhang, Xuefeng Hou and Jincan Zhang Henan University of Science and Technology Luoyang 471023, China
Mindspeed
Minh-Chau Huynh and Warren Stutzman, Virginia Tech Antenna Group
Mini-Circuits
Mini-Circuits
Mini-Circuits, Brooklyn, N.Y.
Mini-Circuits, Brooklyn, N.Y.
Mini-Circuits, Brooklyn, N.Y.
Mini-Circuits, Brooklyn, NY
MiniRF Inc., Fremont, Calif.
MIPI Alliance
Mirin Lew
Mirin Lew, Agilent Technologies
Mirza Shujaur Rahman, MarketandMarkets, Pune, India
Mission Microwave
Mission Microwave
MIT News Office
Mitchell Lazarus
Mitel Networks Corporation
MITEQ
MITEQ Inc.
MITEQ Inc., Hauppauge, NY
Mitron, Fuzhou, China
Mitsubishi Electric Corporation, Tokyo, Japan
MixComm, Inc., Chatham, N.J.
Mixed Signal Integration (MSI)
mmTron
mmTron Inc., Redwood City, Calif.
Mobile Experts
Mobile World Live
MoD Australia
Modelithics
Modelithics and Taconic
Modelithics Inc. and Dielectric Laboratories Inc.
Modelithics Inc., Tampa, Fla.
Mohamed Kameche, Centre National des Techniques Spatiales (CNTS), Algeria
Mohamed Sanad and Noha Hassan
Mohamed Sanad and Noha Hassan, Cairo University, Giza, Egypt
Mohamed Sanad, Amant-Antennas, Giza, Egypt; Noha Hassan, Cairo University, Cairo, Egypt
Mohamed Sayed, 83rd ARFTG General Chair
Mohamed Sayed, ARFTG Conference Chair
Mohammad A. Saed, Department of Electrical and computer Engineering of Texas Tech University
Mohammad Fairouz, TelecommunicationandNavigationInstitute, Kuwait
Mohammad H. Haroun EDST, Lebanese University, Beirut, Lebanon, Iteam, Universitat Politècnica de València, València, Spain
Mohammad Madihian, General Chairman, 2007 Radio and Wireless Symposium
Mohammad Reza Dehghani, Ahmed H. Akgiray, Arshad Mehmood and Onur Hamza Karabey, ALCAN Systems, Darmstadt, Germany
Mohammed R. Alshareef, National Center for MEMS Technology, King Abdulaziz City for Science and Technology, Riyadh, Saudi Arabia
Mohammed Salhi, Thomas Kleine-Ostmann and Thorsten Schrader, Physikalisch-Technische Bundesanstalt (PTB), Germany
Mohammed Tahir, Stuart Glynn, Liam Devlin, Andy Dearn and Graham Pearson, Plextek RFI, Great Chesterford, Saffron Walden, U.K.
Mohsen Hayati and Azadeh Khajavi Razi University, Kermanshah, Iran
Mohsen Hayati, Razi University; Parisa Karami Moghadam, Islamic Azad University
Mohsen Hayati, Sohrab Majidifar and Omid Sadeghi Fathabadi, Razi University
Molex
Molex Inc.
Molly Heyward, Strand Marketing
Monica Paolini, Senza Fili Consulting
Monika Roth, press@rohde-schwarz.com
Moray Rumney
Moray Rumney, Agilent Technologies
Moray Rumney, Agilent Technologies Inc.
Moray Rumney, Keysight Technologies, Edinburgh, Scotland
Morgan Advanced Materials
Morion US, LLC, San Jose, Calif.
Morris Engelson
Morris Engleson and Len Garrett
Morten Hagensen, Guided Wave Technology ApS, Hilleroed, Denmark
Morten Hagensen, Guided Wave Technology ApS, Hilleroed, Denmark, Anders Edquist, ANSYS Inc., Canonsburg, PA
Moscow Smart City Lab
MOSIS
Motorola
Motorola Inc.
Motorola Semiconducteurs S.A.S.
Mouloud Ayad, Department of Telecommunications, University of Setif, Algeria
Mouqun Dong, California Eastern Laboratories, Santa Clara, Calif.
MPI Corp & Rohde & Schwarz
MPI Corporation
MRCM GmbH
MSC Vertriebs/Micro Crystal AG
MTI-Milliren Technologies Inc.
MtronPTI
Mu’ath Al-Hasan, Al Ain University, Abu Dhabi, UAE
Muddaser Mohiyuddin, Rathna Kumar M, Jacob Mathew, Puneet Kumar Pandey, ISRO Satellite Centre
Muhammad Tahir
Multigig
Munkyo Seo, Joo-Yeol Lee, Kyung-Kuk Lee and Sangwook Nam
Murari Shaw, Institute of Engineering and Management
Murari Shaw, Institute of Engineering and Management, West Bengal, India
Murat Eron, Wireless Telecom Group
Murata
Murata Electronics North America
Murata Electronics North America Inc.
Murata Manufacturing Co. Ltd.
Bob Muro, Wireless Telecom Group
Murthy Upmaka and DingQing Lu, Agilent Technologies, Santa Clara, CA
Murthy Upmaka and Eva Ribes-Vilanova, Keysight Technologies, Santa Rosa, Calif.
MVG (Satimo) Industries
MVG-EMC (Rainford EMC Systems Ltd)
MVG-ORBIT/FR
MVG, Paris, France
MW Journal staff
MWJ
MWJ Ediorial Staff
MWJ Editorial Staff
MWJ Editors
MWJ Staff
MwT Inc.
MX-COM Inc.
My Le Truong
Myrianne Regis, Hugues Lafontaine, Steve Kovacic, Gilles Cibiel, Olivier Llopis
N
N. Benahmed and M. Feham
N. Benahmed and S. Seghier, University of Tlemcen
N. D. Orloff and D. Gu, National Institute of Standards and Technology, Boulder, Colo
N. Logan, J.M. Noras and J.G. Gardiner, Alcatel-Lucent
N. Sainz, I. Gutierrez, A. Muñoz and J. de Nó, TECNUN; E. Hernández and A. Garciá-Alonso, CEIT
M. Jordão, P.M. Cruz, D. Ribeiro, A. Prata, N.B. Carvalho, Instituto de Telecomunicações - Universidade de Aveiro, Campus Universitário de Santiago Aveiro, Portugal
N.D. du Toit, R. Thomas, J.H. Smith, F.N. Schirk and J.A. Mogel, AR RF/Microwave Instrumentation Souderton, PA
N.M. Ridler, National Physical Laboratory (NPL) Teddington, UK; R.A. Ginley, National Institute of Standards and Technology (NIST), Boulder, CO
Na-Fu Wang and Yu-Zen Tsai, Cheng Shiu University, Taiwan; Tseng Tang, National University of Tainan; Mau-Phon Houng, Institute of Microelectronics, N
Nader Behdad(2) and Zhenqiang Ma(2), University of Science and Technology of China(1)
Nadine Collaert
Nadine Collaert and Michael Peeters, imec, Leuven, Belgium
Naftali Herscovici
Nan-Lei Larry Wang
Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif
Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.
Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.
Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.
Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.
Nancy Friedrich, Keysight Technologies, Santa Rosa, Calif.
Nano Dimension
Nano Dimension, Ness Ziona, Israel
Nano Materials International Corp.
Nano Materials International, Tucson, AZ
Nanotron
Narayan Propato, Mehran Mossammaparast and Patrick Mullin, Wenzel Associates, A Quantic Company, Austin, Texas
Narda
Narda Microwave
Narda Microwave-East
Narda Safety Test Solutions GmbH, Pfullingen, Germany
Narda Safety Test Solutions, Pfullingen, Germany
NASA
NASA Jet Propulsion Laboratory
NATEL
Felix P Nater
Nathan Burley, Ovum
Nathan Cohen, Fractal Antenna Systems, Bedford, Mass.
Nathan Kundtz, Kymeta Corp., Redmond, Wash.
Nathan Miller, Sam Brokenshire, Nathan Bayley and Peter Young, Flann Microwave Ltd., Bodmin, U.K.
National Association of Broadcasters
National Instruments, Austin, Texas
National Instruments, AWR Group (NI), El Segundo, Calif.
National Instruments, Microwave Components Group, Santa Clara, Calif.
National Instruments, Santa Clara, Calif.
National IT and Telecom Agency
National Semiconductor
Naval Air System Command
Naval Sea Systems Command
Navi Miglani, RaGE Systems, Lowell, Mass.
NDK
Nearfield Systems Inc.
Nearfield Systems Inc., Torrance, CA
NEC
NEC America Inc.
NEC and Renesas
NEC Corp.
NEC Corp. of America
NEC Corporation
NEC Electronics (Europe) GmbH
NEC Electronics Europe
Neha Baheti and Avik Santra, Infineon Technologies AG, Munich, Germany
NEL
NEL Frequency Controls Inc.
Nemai C. Kamakar and Marek E. Bialkowski
Nemai Chandra Karmakar and Mohammad Nurunnabi Mollah, Nanyang Technological University
Nemai Chandra Karmakar, Monash University; Mohammad Nurunnabi Mollah, Nanyang Technological University
Nenad PopoviĆ and Ivana RadnoviĆ; IMTEL Institute, Belgrade, Serbia
New York University
Newark element14
NewEdge Signal Solutions, Shirley, Mass.
Newtec
Newtec and Quantis
Newtec/SES
Newtec/Vizada Networks
Nexius
Nexyn Corp.
NGC
nGimat Co.
NGMN
NGMN Alliance
NI (National Instruments)
NI AWR, El Segundo, Calif.
NIC
Nicholas Cannon
Nicholas Cannon, Anritsu Co., Morgan Hill, CA
Nick Langston, Jr., TE Connectivity, Menlo Park, Calif
Nick Ridler, EuMW General Chair and John Cunningham, EuMW General Co-chair
Nickander J. Damaskos and Benuel J. Kelsall, Damaskos Inc.
Nickander J. Damaskos, Benuel J. Kelsall and James E. Powell, Jr. Damaskos Inc., Concordville, PA
Nickolas Kingsley, Auriga Measurement Systems
Nicolas Chantier and Julien Cochard, Teledyne e2v Semiconductors
Nicolas Garcia and Nicholas Estes, Cheshir Industries, Albuquerque, N.M.
Nicolas Labrousse and Wissam Saabe, AMCAD Engineering, Limoges, France
Niels Kirkeby, Chong Mei and Tom Buck, TTM Technologies, Santa Ana, Calif.
Nigel Bowes, Credowan Limited
Nils Heininger, LPKF Laser & Electronics AG
Nir Sever, proteanTecs
NIT DOCOMO
Nitero
Nitronex
NITRONEX Corp.
Nkorni Katte, Joseph Haus, Jean-Bosco Serushema, Michael Scalora
NMDG
Noam Levine, Partner Manager, MathWorks
NOFFZ Technologies GmbH, Toenisvorst, Germany
Noise Com Inc.
Noise eXtended Technologies (Noise XT), Elancourt, France
Noise XT
Noisecom
NoiseTech Microwaves Ltd.
NoiseWave
Nokia
Nokia Bell Labs
Nokia Networks
Nokia Siemens Networks
Nokia Siemens Networks/Motorola
Nokia Solutions and Networks
Nolato Silikonteknik AB
Noman Rangwala and Rick Myers; Analog Devices Inc., Norwood, MA
Norbert Schmidt, IMST GmbH, Kamp-Lintfort, Germany
Norden Millimeter Inc., Placerville, CA
Nordic Semiconductor
Norsat International Inc.
Norsat International, Richmond, British Columbia
North Carolina State University
Northrop Grumman
Novatel Wireless
Novator Solutions
Novelda
Novotronik
NRL
NRL, Arne Fliflet and M. Ashraf Imam
NSI-MI Technologies
NSI-MI Technologies
NSI-MI Technologies
NSI-MI Technologies
NSI-MI Technologies, LLC
NTT Communications Corporation
NTT DOCOMO
Nuhertz Technologies
Nujira and TriQuint Semiconductor
Nujira Ltd.
Nujira/KCB Signal Solutions
Nujira/Xilinx
Numerical Innovations
Nuno Borges de Carvalho and Jose Carlos Pedro
Nurad Technologies Inc.
NuRAN Wireless
Nuria G. Prelcic, Universidade de Vigo, Vigo, Spain
Nurnihar Begam, Rahul Mondal and Partha Pratim Sarkar, University of Kalyani, West Bengal, India
NuSil Technology LLC
Nutaq
Nuvotronics LLC
NuWaves Engineering
Nxbeam
Nxbeam Inc., Los Alamitos, Calif.
Nxbeam Inc., Los Alamitos, Calif.
NXP
NXP Semiconductors and STMicroelectronics
NXP Semiconductors N.V.
NXP Semiconductors, Eindhoven, The Netherlands
NXP Semiconductors, Chandler, Ariz.
NXP Semiconductors, Eindhoven, The Netherlands
NXP Software
Nynex/Newtec
NYU Tandon School of Engineering
NYU WIRELESS
O
O.K. Jensen, T.E. Kolding, C.R. Iversen, S. Laursen, R.V. Reynisson, J.H. Mikkelsen, E. Pedersen, M.B. Jenner and T. Larsen
Objective Interface Systems Inc.
Oclaro Inc.
OctoScope Inc.
octoScope Inc.
Oculii, Beavercreek, Ohio
Odile Ronat, SiTime Corporation, Santa Clara, Calif.
ODIN
OEM Capital
OEWaves
OEwaves Inc.
Yong Fang, Baoqing Zeng, Ye Yuan, Peng Gao and Xubo Wei, University of Electronic Science and Technology of China; Tiguo Gan, 10th Institute of China Electronic Technology Group Corp.; Hai Zhang, Nanchang Institute of Technology
Oleksandr Gorbachov
Oleksandr Gorbachov and Yie-Der Shen
Oleksandr Gorbachov STMicroelectronics Taipei, Taiwan, ROC
Oleksandr Gorbachov, Independent Contractor and Mario Paparo STMicroelectronics, Catania, Italy
Oleksandr Gorbachov, Leonid Kasatkin
Oleksandr Gorbachov, STMicroelectronics
Oleson Microwave Labs (OML)
Gopinath Gampala and C.J. Reddy, EM Software & Systems (USA) Inc., Hampton, VA; Oliver Stabler and Thomas Hager, AWE Communications GmbH, Boeblingen, Germany
Olli Pekonen, Arvi Karhumaki and Martti Valtonen
Omid Sotoudeh, Sony Ericsson Mobile Communications; Tilmann Wittig, CST GmbH
OML (Oleson Microwave Labs), Morgan Hill, CA
OML Inc.
OML Inc., Morgan Hill, CA
OMMIC
OMMIC, Paris, France
Omniradar
Omrane Necibi, University of Jouf, Jouf, Saudi Arabia
Omron Electronic Components LLC
ON Semiconductor
OneWeb Ltd.
ONR
OnScale
Onyx EMS LLC
Ooredoo
Ooredoo
OpenET Alliance
Optenni Lab
Optenni Ltd.
Optimal+
Optotek Ltd.
Orbel Corp., Easton, Pa.
Orbit
ORBIT Communication Systems
ORBIT Communication Systems Inc.
ORBIT Communication Systems Ltd.
ORBIT Communications Systems
Orbit Technologies
Orbit Technologies Ltd.
Orbit Technology Group
ORBIT/FR
ORBIT/FR - Europe GmbH
ORBIT/FR Israel
Erik Org
Erik Org
OriginGPS
Orolia
Orolia
Osama Shana'a, Donald Y.C. Lie and Danilo Manstretta, RFIC 2022 Chairs
Oscilent
Oscilloquartz SA
Osprey Metals Ltd.
Ossama El Bouayadi, Yann Lamy, Laurent Dussopt and Gilles Simon, CEA-Leti, Grenoble, France
OSU Research Communications
Ouslimani Hafdallah Habiba, Universite Paris Nanterre, France
OVUM
P
P. Angeletti, European Space Agency, and M. Lisi, Telespazio
P. Asbeck, J. Mink, T. Itoh and G. Haddad
P. Heymann, R. Doerner and M. Rudolph
P. Laforge, University of Regina, Regina, SK, Canada
P. Lagoiski, L. Matytsine and M. Matytsine, Matsing Pte. Ltd.; P.K. Tan, Temasek Laboratories, National University of Singapore
P. Latha St. Joseph's College of Engineering and Technology, Chennai, India
P.C.A. Hammes, H.F.F. Jos, F. van Rijs, S.J.C.H. Theeuwen and K. Vennema, Philips Semiconductors
P.K. Jain, Space Applications Centre (ISRO), Ahmedabad, India
P.S. Neelakanta, A.K. Stampalia and D. De Groff, Florida Atlantic University
P.S. Neelakanta, Jesada Sivaraks, Charoonkierti Thammakoranonta
P.S. Neelakanta, W. Preedalumpabut and S. Morgera, Florida Atlantic University
P1dB
P3 Communications
Paciwave Inc., Sunnyvale, CA
Palomar Technologies
Panasonic
Panasonic Corp. and Renesas Technology Corp.
Panasonic Corporation, Osaka, Japan
Pankaj Goyal, National Semiconductor
Pankaj R. Katiyar, M. M. Shafiei and Wan Nor Liza Binti Wan Mahadi, University of Malaya (UM), Kuala Lumpur, Malaysia
Paolo Arcioni, Rinaldo Castello, Luca Perregrini, Enrico Sacchi and Francesco Svelto
Paolo Lampariello, General Chairman, EuMW 2009; Ivar Bazzy, President, Horizon House Publications
Paradigm Services
Paratek
Paratek and STMicroelectronics
Paratek Microwave
Paratek Microwave Inc.
Paricon Technologies Corp
Paris Akhshi, PhD, Keysight Technologies, Santa Rosa, Calif.
Park Electrochemical Corp.
Park Electrochemical Corp., Melville. N.Y.
Parker Hannifin Corp.
Parker Traweek, SiTime, Santa Clara, Calif.
ParkerVision Inc.
Pascall
Pascall Electronics Ltd.
Pascall Electronics Ltd.
Pasquale Dottorato
Passive Plus
Passive Plus Inc.
Pasternack Enterprises Inc., Irvine, Calif.
Pasternack, an Infinite Brand, Irvine, Calif.
Pasternack, Irvine, Calif.
Pat Hindle
Pat Hindle and Kristen Anderson, MWJ Staff
Pat Hindle, Editor and Janine Love, Contributing Editor
Pat Hindle, Editor, Microwave Journal
Pat Hindle, Gary Lerude and Richard Mumford, Microwave Journal
Pat Hindle, Gary Lerude, Janine Love - MWJ Editors
Pat Hindle, Microwave Journal
Pat Hindle, Microwave Journal Editor
Pat Hindle, Microwave Journal Media Director
Pat Hindle, Microwave Journal Technical Editor
Pat Hindle, MWJ Editor, and Richard Mumford, MWJ International Editor
Pat Hindle, Technical Editor
Pat Hindle, Technical Editor, Microwave Journal
Patric Heide
Patrick Courtney, Qorvo, Richardson, Texas
Patrick Garrec, Thales, Paris, France
Patrick Hindle - Editor, Microwave Journal
Patrick Hindle and Gary Lerude, Microwave Journal, Norwood, Mass.
Patrick Hindle and Jennifer DiMarco
Patrick Hindle, Editor, Microwave Journal
Patrick Hindle, Editorial Director
Patrick Hindle, Gary Lerude and Richard Mumford Microwave Journal
Patrick Hindle, Gary Lerude, Jenn DiMarco, Microwave Journal Editors
Patrick Hindle, Microwave Journal
Patrick Hindle, Microwave Journal Editorial Director
Patrick Hindle, Microwave Journal Technical Editor
Patrick Hindle, Microwave Journal, Norwood, Mass.
Patrick Hindle, Richard Mumford and Gary Lerude, Microwave Journal Editors
Patrick Hindle, Technical Editor, Microwave Journal
Patrick J. Sullivan, Walter H. Ku and Bernard A. Xavier
Patrick Naraine and Chandra Mohan, Skyworks Solutions Inc., Woburn, MA
Patrick Naraine, Skyworks Solutions Inc.
Patrick Robbins, Micronetics Inc.
Patrizia Mühlbauer, press@rohde-schwarz.com
Patrizia Mühlbauer, Rohde & Schwarz
Anton Patyuchenko
Paul A. Crandell & Fredrick J. Dominick
Paul A. Moakes, CommAgility, Loughborough, U.K.
Paul Beasley and Damian McCann, MACOM, Lowell, MA
Paul Blount and Charles Trantanella, Qorvo, Inc., Chelmsford, Mass.
Paul Chiavacci
Paul Colestock
Paul Colestock, Agilent EEsof EDA
Paul Harris, Mark Beach and Simon Armour, University of Bristol (U.K.); Ian Mings British Telecom (BT)
Paul Hendriks, Analog Devices, Norwood, Mass.
Paul Hurwitz, Amol Kalburge, Edward Preisler, David Howard and Chris Masse, Tower Semiconductor, Migdal HaEmek, Israel
Paul Leclaire, KnowMade, Sophia Antipolis, France
Paul Mattheijssen, NXP Semiconductors, Eindhoven, The Netherlands
Paul Pino, W. L. Gore & Associates Inc., Landenberg, PA
Paul Pino, W.L. Gore & Associates Inc. Elkton, MD
Paul Pino, W.L. Gore & Associates, Newark, Del.
Paul Pino, W.L. Gore and Associates Inc.
Paul Tilghman, Defense Advanced Research Projects Agency (DARPA), Arlington, Va.
Paul Tornatta, Cavendish Kinetics Inc., San Jose, CA
Paul Turner, Systems4Silicon Limited, Bristol, U.K.
Paulo Correa and George Bollendorf, Empower RF Systems, Inglewood, Calif.
Pavin Singh Virdee, Department of Electrical Engineering California Polytechnic State University
Pavin Singh Virdee, Department of Electrical Engineering California Polytechnic State University
Payman Shanjani and Vikas Choudhary, pSemi Corporation, San Diego, Calif.
PCTEL Inc.
PCTEST Engineering Laboratory Inc.
Pedro Emiliano Paro Filho1,2, Mark Ingels1, Piet Wambacq1,2, Jan Craninckx1, Imec1, Leuven, Belgium; Vrije Universiteit Brussel2, Ixelles, Belgium
Pedro Miguel Cabral, José Carlos Pedro and Nuno Borges Carvalho
Pendulum
Pendulum Instruments
Pendulum Instruments AB
Pengcheng Jia, CAP Wireless Inc.
Pengfei Zhang, RF Micro Devices
Pentek
Pentek Inc., Upper Sadle River, N.J.
Per Vices
Per Vices, Toronto, Canada
Per Viklund
Per Viklund, Mentor Graphics and How-Siang Yap, Agilent
Per Viklund, Mentor Graphics; How-Siang Yap, Agilent Technologies Inc.
Peraso
Peraso Inc.
Peraso Technologies Inc.
Peraso, Inc., San Jose, Calif.
Peregrine
Peregrine Semiconductor Corp.
Peregrine Semiconductor Corp., San Diego, Calif.
Peregrine Semiconductor, San Diego, CA
Peregrine Semiconductor, San Diego, CA
Permac Electronics
Perry M. Malouf, Ph.D. and Robert E. Wallis, Johns Hopkins University Applied Physics Laboratory
Peter A. Rabbeni, Alvin Joseph, Theodore Letavic and Anirban Bandyopadhyay, GlobalFoundries, Santa Clara, Calif.
Peter Bacon and Kinana Hussain, Peregrine Semiconductor, San Diego, Calif.
Peter Bacon and Young-Taek Lee, pSemi, San Diego, Calif.
Peter Bacon, Chandra Mohan, David Fryklund and Peter Zampardi, Skyworks Solutions Inc.
Peter Bacon, Peregrine Semiconductor, San Diego, CA; Drew Fischer and Ruan Lourens, National Instruments, Austin, TX
Peter Barnwell, Michael O'Neill and Charles Sabo
Peter Cain, Agilent
Peter Carson and Steve Brown, Qualcomm
Peter Delos, Analog Devices, Inc., Norwood, Mass.
Peter Delos, Mike Jones and Mark Robertson, Analog Devices
Peter Delos, Mike Jones and Mark Robertson, Analog Devices Inc.
Peter Fox, aiRadar Inc., Vancouver, Canada
Peter Futter, Altair Engineering Inc., Troy, Mich.
Peter Gammel, Ph.D Skyworks Solutions, Woburn, MA
Peter Hoogeboom
Peter Ladbrooke and James Bridge
Peter Matthews, Knowles Precision Devices
Peter Matthews, Knowles Precision Devices, Cazenovia, N. Y.
Peter Matthews, Knowles Precision Devices, Cazenovia, N.Y.
Peter McNeil, Pasternack, Irvine, Calif.
Peter Shveshkeyev
Peter Staecker
Peter von Nordheim, Spectrum Elektrotechnik GmbH, Munich, Germany
Peter Y. Hong
Zachariah Peterson
Petteri Alinikula
PH
Phase Matrix
Phase Matrix Inc., San Jose, CA
Phasor Inc.
PHAZR
Phil Lambert, Fortify
Phil Lambert, Fortify, Boston, Mass.
Phil Leslie
Phil Lindsey, ARSI LLC, Atlanta, Kan.; C. J. Reddy Altair Engineering Inc., Hampton, Va.
Phil Warder and Nicolas Layus, TriQuint Semiconductor, Hillsboro, OR
Phil Warder, David Schnaufer, TriQuint Semiconductor
Philbert F. Marsh, Christopher Rutherglen, Alexander A. Kane, Tyler A. Cain and Kosmas Galatsis, Carbonics Inc., Culver City, Calif.
Philip F. Dindo
Philip Lambert, Fortify, Boston, Mass.
Philip Lambert, Jeff Von Loesecke and Henrik Ramberg, Fortify, Boston, Mass.
Philip M. Fabis
Philippe Eudeline, EuRAD 2010, Conference Chairman
Philippe Ferrari, TIMA, Université Grenoble Alpes, Grenoble, France
Philips Semiconductor
Philips Semiconductors
Philsar Electronics Inc.
Phoenix Microwave Corp.
Phonon Corp.
phys.org
Pickering Interfaces
Pickering Test Solutions
Pico Technology
Pico Technology, St Neots, U.K.
picoChip
Picochip/Wavesat
Piconics and Modelithics
Piconics Inc.
Picosecond Pulse Labs, Boulder, CO
Piero Angeletti and Marco Lisi, European Space Agency, Noordwijk ZH, The Netherlands
Pierre Bertram, Thales Air Defense
Pierre Piel
Pierre Piel, Wayne Burger, David Burdeaux, Warren Brakensiek, Freescale Semiconductor
Piet van Genderen, General Chairman; Charles Ayotte, Horizon House Publications Inc.
Pike Research
Bob Pinato
Ping Hui, Nokia Mobile Phones
Ping Yin, RF Micro Devices Inc.
Pivotal Commware
Pivotone
Pixus Technologies
Planar Electronics Technology
Planar Electronics Technology Inc. Frederick, MD
Planar Filter Co.
Planar LLC
Planar Monolithics Industries
Planar Monolithics Industries and AmpliTech
Planar Monolithics Industries Inc.
Platronics
Plessey Semiconductors
Plessey Semiconductors Ltd.
Plextek
Plextek RF Integration
Ploughshare Innovations
PMI and AmpliTech
PMR
PMT
POET Technologies Inc.
Point 35 Microstructures
Polaris Networks
Polaris Wireless
Pole/Zero
Polese Co.
PoLTE
PolyPhaser, Hayden, Idaho
Polytechnic Institute of NYU (NYU-Poly)
Poseidon Scientific Instruments Pty Ltd.
Poshun Chiu and Ezgi Dogmus, Yole Développement (Yole), Lyon-Villeurbanne, France
Power Module Technology
Power Module Technology, Carson City, NV
Power PR
Powering the Next Seven Billion Voices
PPC
PPM Systems, Swindon, U.K.
Patrick Pratt
Pravin Patel, Rubina Ahmed, Moises Cases -IBM; Gourgen Oganessyan, Quellan; Dave Dunham, Molex
Precision Devices
Precision Receivers Inc., Marshall, Va.
precisionWave Corp.
Premix Oy
PREMO
Presented by COMSOL
Presto Engineering Inc.
Princeton Electronic Systems Inc. (PES)
PrismTech
PRNewswire
Production Team
Professor Theodore Rappaport, Founding Director, NYU WIRELESS
Professor Theodore Rappaport, NYU WIRELESS
Programmed Test Sources (PTS)
Programmed Test Sources Inc.
Programmed Test Sources Inc. (PTS)
Promex Industries
Pronghorn Solutions, Denver, Colo.
ProPlus
Protek
Protek Inc.
Protium Technologies Inc.
Provigent
pSemi Corp.
pSemi Corp., San Diego, Calif.
Pulsar Microwave Corp.
Pulse
Pulse Electronics Corp.
Pulse Systems, Inc., South Easton, Mass.
PureWave Networks Inc.
Q
Q Microwave
Q Microwave
Q-par Angus
Q-par Angus Ltd.
Q-Tech Corporation
Qian Cheng, Chen Yiyuan and Zhu Xiaowei
Qian Wang, Cheng Yuan and Yasen Huang, Southeast University; Jianjun Gao, East China Normal University
Qiang Chen, Hou Zhang and Xue-liang Min, University of Airforce Engineering, Xi’an, China, Lu-Chun Yang, China Mobile Ltd., Shenzhen, China
Qiang Wu, Heng Xiao and Fu Li
Qiao Ke, Tang Zongxi, University of Electronic Science and Technology of China, Chengdu, China
QinetiQ
Qingqing Ye and Lijun Zhang, Institute of Microelectronics of Chinese Academy of Science, Beijing, China
Qingqing Ye, (1) Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, (2) University of Chinese Academy of Sciences
Qingshuang Liu(1,2), Yilong Lu(2), Jie Jin(2), Nanyang Technological University(1); Tianjin University(2)
Qingzhen Xia, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China
Qirong Li, Songbai He, Zhijiang Dai and Weimin Shi, University of Electronic Science and Technology of China, Chengdu, China
Qiu-Huan Huang, Dar-Ron Huang and Huey-Ru Chuang, National Cheng Kung University
Qorvo
Qorvo Inc., Greensboro, N.C.
Qorvo, Inc., Newbury Park, Calif.
Qosmotec
QPER
QRC Technologies, Fredericksburg, Va.
Quad Industries
QuadSAT
QuadSAT, Odense N, Denmark
QUALCOMM
Qualcomm Inc.
Qualcomm Technologies Inc., San Diego, Calif.
Qualcomm Technologies, Ericsson and AT&T
Quantic Croven
Quantic MWD
Quantic PMI (Planar Monolithics)
Quantic Wenzel, Austin, Texas
Quantum Microwave, Cohasset, Mass.
QuarterBranch Technologies Inc.
Quarterwave, Rohnert Park, Calif.
Quartzlock
Quartzlock (UK) Ltd. Totnes, Devon, UK
Quartzlock UK Ltd.
Quectel Wireless Solutions/MSC Vertriebs
Queen’s University Belfast
Quintech Electronics & Communications Inc.
R
R. Banham, G. Valsecchi, Lucci, G. Pelosi, S. Selleri, V. Natale, R. Nesti, and G. Tofani
R. Chair, A.A. Kishk, K.F. Lee and D. Kajfez, University of Mississippi
R. Dahle, State University of New York, New Paltz, New York, USA
R. El-Bouslemti, Ecole Nationale Polytechnique d’Oran, Algeria
R. El-Bouslemti, Ecole Nationale Polytechnique d’Oran, Algeriasup
R. Fuks and A. Weirback, Astrolab Inc.
R. Fulcoli, M. Sedehi, E. Tilli and L. Timmoneri, SELEX Sistemi Integrati, Rome, Italy
R. Giofre, L. Piazzon, P. Colantonio and F. Giannini, University of Tor Vergata
R. Joseph, K. Herbertz, T. Bertuch, Fraunhofer Institute for High Frequency Physics and Radar Techniques FHR
R. Kumar, N. Gupta and K.P.M. Bhat, Institute of Armament Technology
R. Lai, H. Wang, Y.C. Chen, T. Block, P.H. Liu, D.C. Streit. D. Tran. M. Barsky, W. Jones, P. Siegel and T. Gaier
R. Rathna and M. A. Bhagyaveni, Anna University, Chennai, India
R. Rathna and M. A. Bhagyaveni, S. S. Shamina P. Latha
R. Tayrani, Raytheon Space & Airborne Systems
R. Vilar, J. Marti, Universitat Politecnica de Valencia; R. Czarny, Thales Research and Technology
R. Wolf, A. Joseph, P. Rabbeni and J. Dunn, IBM Microelectronics Division Essex Junction, VT
R.A. Abd-Alhameed, D. Zhou, N.J. McEwan, P.S. Excell and A. Ghorbani
R.A. Abd-Alhameed, M. Zewani, P.S. Excell, J.G. Gardiner and N.J. McEwan, Bradford University; N.T. Ali, Etisalat Polytechnic
R.A. Abd-Alhameed, P.S. Excell and J.G. Gardiner, Bradford University;
R.C. Hansen
R.C. Hansen, Associate Editor MWJ (Dec. 1978)
R&D Microwaves
R&S
Racal Instruments Limited
Racal Instruments Wireless Solutions, an Aeroflex company Slough, UK
Rachid El Assir, Rohde & Schwarz
Radha Setty and Brandon Kaplan, Mini-Circuits, Brooklyn, N.Y.
Radhoine Aloui, Zied Houaneb and Hassen Zairi, University of Carthage, Tunisia
Radiall Inc.
Radiall USA
Radiall USA Inc., Chandler, AZ; Radiall France, Rosny sous Bois (Paris), France
Radiall, Paris, France
Radio Design Group Inc.
Radio Engineering Services
Radio Frequency Interference – End Users Initiative (RFI-EUI)
Radio Frequency Systems
Radio Waves
Radio Waves Inc.
RADX Technologies Inc., San Diego, Calif.
RADX Technologies, Palo Alto, Calif.
Raffaele Persico and Francesco Soldovieri
Rafi Hershtig and Tim Dolan, 2011 MicroApps Co-Chairmen
Rafi Hershtig, K&L Microwave
Raghavendra G. Kulkarni
Raj Kumar, N. Gupta and K.P.M. Bhat, Institute of Armament Technology; R. Sreehari Rao, Defence Electronics Research Laboratory
Raj Sodhi, Keysight Technologies; Jim Taber, X-COM Systems
Rajanish, P. Onno and N. Jain, Anokiwave Inc.,San Diego, CA; C. Weigand, P. McIntosh and B. Rizzi, M/A-COM Inc.,Lowell, MA; K. Izzac, Paratek Microwav
Rajesh Pazhyannur, Co-Founder and CEO of Ataya
Rakon
Ralf Kakerow, Continental Automotive and Matthias Tröscher, CST Munich, Germany
Ralph Levy
Ramesh K. Pokharel, Kyushu University
Randall North, David Kennedy and Mike Murphy
Randall Rhea
Randall W. Rhea
Randy Cochran, Phil Knights, Jarek Lucek - NXP
Randy Haupt, Utah State University
Randy J. Richards and Hector J. De Santos
Randy Oltman, Analog Devices Inc., Norwood, Mass.
Randy Rhea and Bill Clausen, Eagleware Corp.
Randy Rhea, Susina LLC
Randy Rhea. Susina LLC
Ranfy Haupt and Hugh Southall
Ranplan
Raven Industries
Ravinder Gill, Gigatronics
Ravish R. Shah, Amit Patel, Ved Vyas Dwivedi and Hitesh B. Pandya
Ray Crampton
Ray Pengelly, Cree RF Products
Ray Pengelly, WAMICON 2014 General Chairman
Ray Schwartz, Cobham DES M/A-COM
Raymond Pengelly and Ryan Baker, Cree Inc., Research Triangle Park, NC; Mattias Astrom and Joel L. Dawson, Eta Devices, Cambridge, MA
Raymond Quéré and Charles A. Ayotte
Raymond Rumpf, Professor at UTEP and Director of EM Lab
Raymond Schwartz and Peter Waltz, Cobham Defense Systems, Microwave Components, Exeter, NH
RAYSPAN Corp.
Raytheon
Raytheon Co.
Raytheon Microelectronics
RCL Microwave, Inc.
RCR Wireless News
RDECOM CERDEC Public Affairs
RDL Inc.
Reactel
Reactel Inc.
Red Oak Canyon LLC, Spicewood, Texas
Redline Communications
Reeves-Hoffman Inc.
Regina Gani and Grant A. Ellis, Universiti Teknologi Petronas Perak, Malaysia; Teoh Chin Soon, DreamCore Technologies, Malaysia
Reiner Stuhlfauth, Rohde & Schwarz, Munich, Germany
Relay
RelComm Technologies
RelComm Technologies Inc.
Remcom
Remcom Inc
Remcom Inc., State College, PA
Remcom Inc., State College, Pa.
REMEC Magnum INC.
Rémi Comyn, KnowMade, Sophia Antipolis, France
Rémi Comyn, PhD, Knowmade
Remote Sensing Solutions, Barnstable, Mass.
Remtec
Remtec Inc.
Rena Raj, Keysight Technologies Inc., Santa Rosa, Calif.
Renaissance Electronics
Renaissance Electronics & Communications LLC
Renaissance Electronics Corp.
Renaissance Electronics Corp. (REC)
Renaissance Electronics Corp./HXI
Renee Z. Jones and Bruce A. Kopp
Renesas Electronics
Renesas Electronics Corp.
Renesas Electronics Europe
Renesas Mobile Corporation
Res-Net Microwave, Clearwater, Fla.
Research and Markets
Resonant Inc.
Response Microwave Inc.
Reto Germann, HUBER+SUHNER AG, Herisau, Switzerland
Reuters
Reza Firoozabadi, Airvana Network Solutions and Eric L. Miller, Tufts University
Reza Kamali-Sarvestani, Rowan University, Glassboro, NJ and John D. Williams, UAHuntsville, Huntsville, AL
Reza Mohammadi and Simon Ndiritu, Per Vices, Toronto, Canada
Reza Rofougaran, Movandi, Irvine, Calif.
RF & MW Components Group, M/A-COM Inc.
RF Energy Alliance
RF Energy Alliance (RFEA)
RF Engines Ltd.
RF Industries
RF Industries Ltd.
RF Innovation, Starnberg, Germany
RF Micro Devices
RF Micro Devices Inc.
RF Micro Devices, Greensboro, NC
RF Microtech
RF Monolithics Inc.
RF Power Components
RF Prime Corp.
RF Savvy Technologies LLC, Santa Rosa, Calif.
RF Superstore
RF Systems
RF-Comm
RF-Lambda, San Diego, Calif.
RFaxis
RFCONNEXT Inc.
RFCONNEXT inc., San Jose, CA
RFE Inc., Fremont, Calif.
RFEL
RFEMX
RFHIC
RFHIC Corp., Anyang, South Korea
RFHIC Corp., Anyang, South Korea
RFHIC Corporation, Suwon, Korea
RFHIC, South Korea
RFHIC, Suwon, Korea
RFI
RFI Global Services
RFI Global Services Ltd.
RFIC
RFMD
RFMD Inc.
RFMD, Greensboro, NC
RFMD®, Greensboro, NC
RFMW
RFMW and Aeroflex-Metelics
RFMW and Smiths Interconnect
RFMW Ltd.
RFuW Engineering Ltd.
rgwergre
Rhonda Franklin, IMS2021 WIM Event Chair
Rice University
Rice University
Richard Bay-Ramyon, MiniRF
Richard Chen, Neal Mellen, Makoto Shibata and Masahiro Miyazaki, TDK Corp.
Richard Duvall, Keysight Technologies, Santa Rosa, Calif.
Richard F. Bilotta
Richard F. Schwartz
Richard Fiore
Richard G. Ranson
Richard Harlan, Director of Technical Marketing, ParkerVision
Richard Hilton and Steve Dudkiewicz, Maury Microwave Corp., Ontario, Calif.
Richard I. Harrison, General Telephone and Electronics Labs Inc.
Richard Mumford
Richard Mumford and Jennifer DiMarco, Microwave Journal staff
Richard Mumford and MWJ Staff
Richard Mumford and Pat Hindle, Microwave Journal Editors
Richard Mumford Microwave Journal European Editor
Richard Mumford, European Editor
Richard Mumford, European Editor, Microwave Journal
Richard Mumford, International Editor
Richard Mumford, International Editor – Microwave Journal
Richard Mumford, International Editor, Microwave Journal
Richard Mumford, International Editor, Patrick Hindle, Editor and Gary Lerude, Technical Editor
Richard Mumford, Microwave Journal
Richard Mumford, Microwave Journal European Editor
Richard Mumford, Microwave Journal European Editor
Richard Mumford, Microwave Journal International Editor
Richard Mumford, Microwave Journal International Editor
Richard Mumford, Microwave Journal, International Editor
Richard Mumford, Microwave Journal’s International Editor
Richard Mumford, MWJ International Editor
Richard Mumford/ARMMS
Richard Remski
Richard V. Snyder
Richardson
Richardson Electronics
Richardson Electronics Inc.
Richardson Electronics Ltd.
Richardson Electronics, Ltd.
Richardson RFPD
Richardson RFPD / Arrow RF & Power
Richardson RFPD Inc.
Richardson RFPD, Inc., LaFox, IL
RichardsonRFPD Inc.
Rick Hartman and Tom Bell Kaelus, Smiths Interconnect, Denver, CO
Rick Hartman, Kaelus Inc., Thousand Oaks, CA
Rick Montgomery and Patrick Courtney, Qorvo, Greensboro, N.C.
RIGOL, Beaverton, Ore.
Rikard Eliasson, Anders Sundberg and Anders Wall
Riot Research
Diane Ritchey
RJR Polymers
RJR Technologies Inc.
RLC
RLC Electronics
RLC Electronics Inc., Mt. Kisco, N.Y.
Rob Lefebvre
Rob Van Brunt
Robab Kazemi, R. Ali Sadeghzadeh, and Reza Fatemi Mofrad, K. N. Toosi University of Technology
Robab Kazemi, R. Ali Sadeghzadeh, Reza Fatemi Mofrad and K.N. Toosi, University of Technology
Robert Grossbach
Robert Gubser and David Kenny, Pletronics Inc.
Robert Gunnels
Robert H. Caverly, Nikolai V. Drozdovski and Michael J. Quinn
Robert John, W. L. Gore & Associates Inc., Landenberg, PA
Robert O’Rourke, Remcom Inc., State College, Pa.
Robert P. Bernardo, Micro Networks
Robert Plana, CNRS
Robert Smith and Liam Devlin, Plextek RFI, Great Chesterford, Saffron Walden U.K.
Robert Smith, Liam Devlin, Stuart Glynn, Tony Richards and Graham Pearson, PRFI, Great Chesterford, U.K.
Robert Syputa, Senior Analyst, Maravedis
Robert Wagner, Javelin Semiconductor
Robert Weigel, General Chairman, EuMW 2013 and Ivar Bazzy, President, Horizon House Publications
Roberto Cammarata and Alfio Scuto, STMicro, Italy
Roberto Lalli, Caterina Rapisarda, Alessandro Manuale and Valerio Tocca, Land & Naval Defence Electronics Leonardo S.p.A
Roberto Sorrentino
Roberto Sorrentino and Andre Vander Vorst, European Microwave Association
Roberto Sorrentino, General Chairman, EuMW 2014; Ivar Bazzy, President, Horizon House Publications
ROBIN Radar Systems
Rochester Electronics
Rockwell Collins
Rodger Billings and Tony Edridge, M2 Global Technology Ltd.
Rodger Hosking, Mercury Systems, Saddle River, N.J.
Rodrigo Kenji Enjiu, CST AG, Darmstadt, Germany; Marcelo Bender Perotoni, UFABC, Santo André, Brazil
ROG of Rogers Corp (aka John Coonrod)
Roger Clarke
Roger Hill
Roger Nichols, Keysight
Rogers
Rogers Corp.
Rogers Corp., Advanced Circuit Materials Division Chandler, AZ
Rogers Corp., Chandler, Ariz.
Rogers Corp., Rogers, CT
Rogers Corporation
Rohde & Schwarz
Rohde & Schwarz
Rohde & Schwarz
Rohde & Schwarz GmbH & Co. KG
Rohde & Schwarz Professional
Rohde & Schwarz USA
Rohde & Schwarz USA
Rohde & Schwarz, Munich, Germany
Rohde & Schwarz, Munich, Germany
Rohde & Schwarz, Munich, Germany
Rohde & Schwarz, Munich, Germany
Rohde & Schwarz/Synopsys
Rohde & Schwarz/u-blox
Roke Manor Research
Roke Manor Research Ltd.
Roland Hassun
Roland Hassun, Roland Hassun Consulting
Rolf Jakoby, European Microwave Conference 2007 Chairman
Ron Demcko
Ron Demcko and Daniel West, AVX Corporation, Greenville, S.C.
Ron Demcko, AVX Applications Engineer
Ron Ginley, IMS2022 General Chair
Ron Rausch and Mark Buffo, Keithley Instruments Inc., Cleveland, OH
Ron Williamson Aeroflex Test Solutions, Plainview, NY
Ronald A. Marino
Ronald A. Marino and Wesley Hearst
Ronen Holtzman, Elisra
Ronen Holtzman, Elisra Electronic Systems Ltd., Bene Beraq, Israel
Ronen Holtzman, General Microwave Israel Ltd., Jerusalem, Israel
Roos Instruments, Santa Clara, Calif.
Rosenberger
Rosenberger Hochfrequenztechnik
Rosenberger Hochfrequenztechnik Gm, Fridolfing, Germany
Rosenberger Hochfrequenztechnik GmbH & Co. KG, Fridolfing, Germany
Rosenberger Hochfrequenztechnik, Tittmoning, Germany
Rosenberger Hochrfrequenztechnik GmbH & Co KG
Rosenberger of North America
Rosenberger of North America LLC
Rosenberger, Fridolfing, Germany
Royal Australian Navy
Royal Philips Electronics
RT Logic
RTX and SiTel
Rudy Fuks
Rudy Fuks, Astrolab Inc., Warren, NJ
Rui Ma and Mouhacine Benosman, Mitsubishi Electric Research Laboratories, Cambridge, Mass.
Rui Wang and Jun Xu, University of Electronic Science and Technology of China, Chengdu, China
Ruixia Yang, Heibei University of Technology, Tianjin, China
Ruska Patton and Ning Yang, EMSCAN Corp., Calgary, Canada
Ruska Patton, EMSCAN, Calgary, Canada
Russ Alm (ALC), Dave Strand (Strand Mktg)
Russell J. Hoppenstein, Texas Instruments, Dallas, Texas
Russell J. Hoppenstein, Texas Instruments, Dallas, Texas
Russell Lake, Aalto University, Finland
Ruth Jackson
Rutronik UK
Ryan Benech, Roos Instruments
S
S C Bera, R V Singh and V K Garg
S. Aich, J. Dhar, S.K. Garg, B.V. Bakori and R.K. Arora, Space Applications Center, ISRO, Ahmedabad, India
S. Azam, C. Svensson and Q. Wahab, Linköping University, Linköping, Sweden; R. Jonsson, Swedish Defense Research Agency Linköping, Sweden
S. Korneev, S. Alyakrinsky.
S. Kuhn, Phasor Instruments
S. M. Stout-Grandy, J.S. Wight, A. Petosa, I.V. Minin and O.V. Minin
S. Yoo, M.R. Murti, D. Heo and J. Laskar
S.C. Bera and R.V. Singh, Space Applications Centre (ISRO)
S.C. Bera, P.S. Bharadwaj, R.V. Singh and V.K. Garg, Space Applications Center
S.C. Bera, R.V. Singh and V.K. Garg
S.C. Bera, R.V. Singh and V.K. Garg, ISRO
S.C. Bera, R.V. Singh and V.K. Garg, Space Applications Centre (ISRO)
S.C. Bera, R.V. Singh, V.K. Garg Space Applications Centre, ISRO Ahmedabad, India
S.E.A. Datentechnik
S.F. Ooi, S. Gao, A. Sambell, D. Smith and P. Butterworth, University of Northumbria
S.J. Caprio, Laurel, MD
S.J.C.H. Theeuwen, J.A.M. de Boet, V.J. Bloem and W.J.A.M. Sneijers, NXP Semiconductors
S.K. Lee, A. Sambell, E. Korolkiewicz, S.F. Loh, S.F. Ooi and Y. Qin
S.P. Yeo and M. Cheng
S.S. Riaz Ahamed
S.S. Shamina, Vellore Institute of Technology, Vellore, India
S.Y. Lin, H.R. Chuang and T.S. Horng
Saab
Saab AB
Saab Defense and Security USA (SDAS)
Saab Sensis
Sabritec
Sachin Kumar Yadav, Amanpreet Kaur and Rajesh Khanna, Thapar Institute of Engineering and Technology, Punjab, India
SAF North America
SAF Tehnika, Riga, Latvia
SAF Tehnika, Riga, Latvia
Sage Laboratories
Sage Laboratories Inc.
SAGE Millimeter Inc., Torrance, Calif.
SAGE Millimeter Inc., Torrance, Calif.
Saheli Roy Choudhury, Reporter, CNBC.com
Sai Gunaranjan Pelluri, Alok Joshi and Apu Sivadas, Steradian Semiconductors Pvt. Ltd., Bangalore, India
Saint-Gobain
Salam Dindo
Salisbury Engineering Inc.
Sam Bookman
Sam Kusano, Keysight Technologies, Santa Rosa, Calif.
Sam Morrar, Hughes Network Systems, LLC, Germantown, Md.
Sami Bousnina, PolyGrames Research Center
Samir El-Ghazaly
Samo Vehovc
Samsung
Samsung Electronics Co. Ltd.
HYUNGCHUL KIM, HANJIN CHO, MIN-SU KIM, MINCHEOL SEO, JUNGHYUN HAM, CHEON-SEOK PARK & YOUNGOO YANG, SUNGKYUNKWAN UNIVERSITY, SUWONG, KOREA YAO XI, SAMSUNG ELECTRONICS, KIHEUNG, KOREA SUNGCHAN JUNG, SAMSUNG TECHWIN, SUNGNAM, KOREA
Samtec
Samtec Inc., New Albany, Ind.
Samuel C. Yang
Samuel Cho, CTO, RFHIC Corp.
San-tron
San-tron Inc.
Sanan Optoelectronics
Sandeep Palreddy and Rudolf Cheung, Microwave Engineering Corp. North Andover, MA
Sandy Fraser, Agilent Technologies Inc.
Brook Sandy-Smith
Sang Hyun Park Chung-Ang University Seoul, Korea
Sang Won Kim, Han Yu Cho, Young Kim, Ik Soo Chang and Won Woo Lee
Sang-Kyo Shin and Xiang Feng, Keysight Technologies, Santa Rosa, Calif.
Sang-Tae Kim, Jong-Soo Lim and Kyoung-Rok Cho
Sang-Tae Kim, Jong-Soo Lim, Kyoung-Rok Cho
Sanggee Kang, Heonjin Hong and Sungyong Hong
Sanghoon Lee, James Kaney and Edgar Garay, Falcomm, Atlanta, Ga.
Sangshin Elecom
Sanjay Moghe, Babak Matinpour, and Drayton Avera, RF Solutions Inc.
SANTIER
Sapphicon and AWR
Saptarsika Das, Ramesh Chandra Tiwari and Lourembam Lolit Kumar Singh, Mizoram University, Mizoram, India
Sarah LeSalva, NI
Sarah Yost, National Instruments, Austin, Texas
Sascha Laumann, Rohde & Schwarz, Munich, Germany
SATCOM Digital Networks
SATELLITE 2011
Satellite Interference Reduction Group (IRG)
SATIMO (Nicolas Gross. Alessandro Scannavini and Meryam Abou el Anouar) MI Technologies (Derek Skousen)
SATIMO Industries, Villebon-sur-Yvette, France
SatNews Publishers
Saurabh Chaturvedi, Mladen Božanic and Saurabh Sinha University of Johannesburg, Johannesburg, South Africa
Saurabh Chaturvedi, Mladen Božanic and Saurabh Sinha, University of Johannesburg, Johannesburg, South Africa
Sawtek Inc.
Sawtek, Inc.
Scalable Network Technologies
Scalable Network Technologies Inc.
Scalable Network Technologies Inc. and VT MAK
Schaffner
Schleuniger Inc.
Schmid & Partner Engineering AG
Schmid & Partner Engineering AG (SPEAG)
Schmid & Partner Engineering AG (SPEAG)/Zurich MedTech AG (ZMT), Zurich, Switzerland
SCHMID Group
SCHOTT
SCHOTT Electronic Packaging
Schott Electronic Packaging, Landshut, Germany; IX-CAD GMBH Eichenau/Munich, Germany
Science and Technology Facilities Council
Science and Technology Facilities Council’s
Scintera
Scintera Networks Inc.
Scintera, Sunnyvale, CA
Scott Barker and Sanjay Raman
Scott Blanchard, Vaunix
Scott DeMange and Barry Wu, Keysight Technologies, Santa Rosa, Calif.
Scott Gibson, Symmetricom Inc., San Jose, CA
Scott Langdon, Remcom Inc., State College, Pa.
Scott Sentz, AEM Inc., San Diego, CA
Scott Wartenberg
Scott Wartenberg, RF Micro Devices
Scott Wedge, Evgeny Wasserman and David Neilson
Scott Wood, Milestone Marketing Inc.
Sean Buckley
Sean Buckley, Telecommunications
Sean Cordone, ISCO International, Elk Grove Village, IL
Sean Cordone, Vice President of Engineering
Sean D’Arcy, Director, Aerospace and Defense, ADI
Sean Ferguson and Haydn Nelson, National Instruments
Sean Thompson, National Instruments
Sean Thorne
Sector Microwave Industries, Deer Park, N.Y.
Secure Communication Systems
Sefa Tanis, Analog Devices Inc., Norwood, Mass.
Seiko Epson
Seikoh Giken Co. Ltd.
Select Fabricators Inc.
Selex ES
Selex Galileo
SELEX Sistemi Integrati
SELEX Systems Integration
SEMA Industries
Sematron
SEMI Silicon Manufacturers Group (SMG)
Semiconductor Industry Association ( SIA)
Semiconductor Industry Association ( SIA)
Semiconductor Industry Association ( SIA)
SemiGen Inc.
SemiGen, Manchester, N.H.
Semtech Corp.
SenarioTek
SenarioTek, Santa Rosa, Calif.
Senglee Foo
SenSyTech Inc.
Seok Kyun Park, Ik Soo Chang, Yun Seo Choi, Jun Won Huh, Young Kim
Seong-Jun Kangand Hee-Yong Hwang, Kangwon National University Chuncheon, Korea
Seong-Sik Myoung and Jong-Gwan Yook, Yonsei University
Seongryong Yoo and Sungtek Kahng, University of Incheon, Incheon, Korea; Jong-Guk Kim, LG Innotek Co. Ltd., Ansan, Korea
Septentrio/QinetiQ
Sergey Beltchicov, Andrey Dzisiak and Igor Guletskiy, ELVIRA Production Co. Ltd., Russia
Sergio Cardona and Joe Schmelzer, ED2 Corporation, Tucson, Ariz.
SES S.A.
Seste Dell'Aera and Tom Riley, Kaben Research Inc.
Seste Dell'Aera and Tom Riley, Kaben Research Inc., Osgoode, Ontario, Canada
SETCOM Wireless
Seth Godin, Review by Gary Lerude
Shahar Peleg, Siklu
Shailender Timiri
Shane Collins and Kieran Flynn
Shanghai Simgui Technology Co., Ltd.
Shangyao Huang, Yanjie Wang and Xianfeng Que, South China University of Technology
Shanmukha Venkatesh and Amit Gulhane, MarketsandMarkets
Shaojun Li, Xidian University, Xi’an, China
Sharwan Ram, Madanapalle Institute of Technology & Science, Madanapalle, India
Shaun Cummins, Nujira Limited, Cambridge, UK
Shaun McFall, Harris Stratex Networks, San Jose, CA
Shawn Cheadle, Cougar Components Corp.
Shawn Cheadle, Lockheed Martin Space Systems, Denver, CO
Shawn Cheadle, Teledyne Cougar Inc
Shawn Logan, IEEE, Andover, Mass.
Shawn P. Stapleton
Shay Gross, Lawrence P. Dunleavy and Thomas M. Weller
Carl Sheffres
Sheng Chang, Qijun Huang and Jin He, School of Physics and Technology, Wuhan University, Wuhan, China
Sheng Zhang, China University of Mining and Technology
Sheng Zhang, Jian-Kang Xiao and Ying Li, Shanghai University
Sheng Zhang, Jian-Kang Xiao, Zi-Hua Wang and Ying Li, Shanghai University Shanghai, China
Sheng Zhang, Tian-Jian Bian and Yao Zhai, China University of Mining and Technology
Shengbiao An, Hebei University of Science and Technology, Shijiazhuang, China
Shengyi Technology
Sheppard Leger Nowak Inc.
Sheri DeTomasi, Keysight Technologies, Santa Rosa, Calif.
Ashraf Sheria North-West University
Ashraf Sheria
Sherif Ahmed and Andreas Schiessl, Rohde & Schwarz, Munich, Germany
Sherif R. Zahran, Emilio Arnieri, Giandomenico Amendola and Luigi Boccia, MAIC-LAB University of Calabria, Rende, Italy
Sherry Hess
Sherry Hess, AWR Corp.
Sherry Hess, VP Marketing, AWR Corp.
Sherry Hess, WIM Organizer
Cameron Sheth
Shiban K. Koul and Chaitanya Mahajan, C.A.R.E, Indian Institute of Technology, Delhi, India
Shiban K. Koul and Chaitanya Mahajan, C.A.R.E, Indian Institute of Technology, Delhi, India
Shiban K. Koul and Karthikeya G. S, Center for Applied Research in Electronics, IIT Delhi, India
Shiban K. Koul and Pranav K. Srivastava, C.A.R.E, Indian Institute of Technology, Delhi, India
Shiban K. Koul, Centre for Applied Research in Electronics, IIT Delhi, New Delhi, India
Shiban K. Koul, Indian Institute of Technology, Delhi, India
Shiqi Feng and Victor Wollesen, Per Vices Corporation Toronto, Canada
Shiva Khani and Mohsen Hayati, Islamic Azad University, Kermanshah, Iran
Shivansh Chaudhary and Eddie Rodriguez, National Instruments, Austin, Texas
Shivansh Chaudhary, National Instruments, Austin, Texas
Shiwei Zhao, Chongqing University of Posts and Telecommunications
Shiwei Zhao, Chongqing University of Posts and Telecommunications; Xiaosen Dai, Shanghai Radio Equipment Research Institute
Shiwei Zhao, Zongxi Tang and Ping Su, University of Electronic Science and Technology of China, Chengdu, China
Shiyong Li and Houjun Sun Beijing Institute of Technology, Beijing 100081 People’s Republic of China
Shmuel Auster
Shmuel Auster
SHOW: A.T. Wall
SHUMIN WANG AND HAI L, AUBURN UNIVERSITY, AUBURN, AL; C.J. REDDY, EM SOFTWARE & SYSTEMS (USA) INC., HAMPTON, VA
Shumin Wang, Hai Lu, Auburn University; C.J. Reddy, EM Software & Systems (USA) Inc.
SIAE MICROELETTRONICA Milan, Italy
SIAE MICROELETTRONICA Milan, Italy
SIAE MICROELETTRONICA S.P.A. Milan, Italy
SIAE MICROELETTRONICA, ErreBi Servizi and G&G Eléctronique
Siemens
Siemens AG
Siemens Semiconductors
Sierra Nevada Corp.
SiGe Semiconductor Inc.
SIGFOX
Siglent
SIGLENT Technologies, Solon, Ohio
SIGLENT Technologies, Solon, Ohio
Sigma
Sigma Systems Corp.
Sigma Systems Corp., El Cajon, CA
Signal Antenna Systems (SAS)
Signal Antenna Systems (SAS)
Signal Hound
Signal Hound, Battle Ground, Wash.
Signal Hound, Battle Ground, Wash.
Signal Hound, Battle Ground, Wash.
Signal Hound, Battle Ground, Wash.
Signal Hound, Battle Ground, Wash.
Signal Hound, Battle Ground, Wash.
Signal Hound, Battle Ground, Wash.
Signal Hound, La Center, Wash.
Signal Microwave, Chandler, Ariz.; GigaProbes, San Carlos, Calif.
Signal Microwave, LLC
Signal Microwave, LLC, Tempe, Ariz.
Signal Technology Corp.
SignalCore, Austin, Texas
Sijia Deng, Christopher J. Slezak, George R. MacCartney Jr. and Theodore S. Rappaport, NYU WIRELESS, NYU Polytechnic School of Engineering
Siklu
Silicon Image Inc.
Silicon Laboratories
Silicon Labs
Silvus Technologies
Simon Barke, University of Florida Precision Space Systems Laboratory, Gainsville, Fla.
Simon Grant, Knowles Corporation Precision Devices, Cazenovia, N. Y.
Simon L. Cotton and William G. Scanlon Queen’s University Belfast, UK
Simon L. Cotton and William G. Scanlon, Queen's University of Belfast; Efstratios Skafidas, University of Melbourne; Bhopinder K. Madahar, Ministry of
SIMULIA, Dassault Systèmes
Sinisa Jovanovic and Ivana Radnovic, IMTEL Komunikacije, Belgrade, Serbia
Sirenza Microdevices
SiTime Corp., Santa Clara, Calif.
SiTune, San Jose, Calif.
Sivers IMA AB
Sivers IMA AB, Kista, Sweden
Sivers IMA, Kista, Sweden
Sivers Semiconductors, Kista, Sweden
Sivers Semiconductors, Kista, Sweden
Skylogic
Skyworks Solutions
Skyworks Solutions Inc.
Skyworks Solutions Inc., Irvine, Calif.
Skyworks Solutions Inc., Woburn, MA
Skyworks Solutions Inc., Woburn, MA
Skyworks Solutions Inc., Woburn, Mass.
Skyworks Solutions, Inc., Irvine, Calif.
Skyworks, Cork, Ireland
SLN Marketing
Small Cell Forum
Smart Electronics
Smart Equipment Technology (SET)
Smith Marketing Services
Smiths Group
Smiths Group plc
Smiths Interconnect
Smiths Interconnect, Stuart, Fla.
Soitec
Solon J. Spiegel, RIO SYSTEMS, Giv’at Shmuel, Israel
Solution Paper, Motorola
Somnath Mukherjee, Mridul K. Pal, Ralph Inducta
Somnath Mukherjee, RB Technology
Sondrel
Sonja R. Nedeljkovic, John R. McMacken, Paul J. Partyka and Joseph M. Gering, RFMD
Sonnet
Sonnet Software
Sonnet Software Inc.
Sonnet Software Inc., North Syracuse, NY
Sonoscan
Sony Corporation
Soo Deok Moon and Hee Yong Hwang, Kangwon National University
Sophia Hsu and Yusuke Tajima, ACCO USA Corp.
Sophia Wireless Inc.
Sophia Wireless Inc., Chantilly, VA
Giovanni Bianchi, Advantest Europe GmbH;Fabrizio Gentili and Roberto Sorrentino, University of Perugia; Laura Urbani and Luca Pelliccia, RF Microtech SRL
Soufiane Tebache, Electrical Engineering Department, National Polytechnic School of Algiers, Algeria
Southwest Antennas, San Diego, Calif.
Southwest Microwave Inc., Tempe, Ariz.
Space Data Corp.
Space Tech Conference 2014
Spacecom
Spacek Labs Inc., Santa Barbara, CA
Spacek Labs, Santa Barbara, Calif.
Special Hermetic Products Inc.
Specialist Microwave Solutions Ltd.
Specialty Coating Systems
Spectra7 Microsystems Inc.
Spectracom
Spectrum
Spectrum Control
Spectrum Control Inc.
Spectrum Control, Fairview, Pa.
Spectrum Elektrotechnik GmbH, Munich, Germany
Spectrum Instrumentation Corp.
Spectrum Instrumentation GmbH, Grosshansdorf, Germany
Spectrum Instrumentation GmbH, Grosshansdorf, Germany
Spectrum Instrumentation, Grosshansdorf, Germany
Spectrum Microwave Delmar, DE
Spectrum Systementwicklung GmbH
Spectrum Systementwicklung Microelectronic GmbH, Grosshansdorf, Germany
Spinnaker Microwave
SPINNER
Spinner GmbH and Precision Tube Co.
SPINNER GmbH, Munich, Germany
Spinner GmbH, Munich, Germany
SPINNER GmbH, Munich, Germany
Spirent
Spirent Communications
Spirent Communications plc
Spirent Communications, Sunnyvale, CA
Spirent/ETS-Lindgren
Spreadtrum Communications Inc.
Sprint/T-Mobile
Sravan Kundojjala, Lead Analyst, Strategy Analytics
SRC
SRC Inc.
SRCTec
SRI Connector Gage
Sridhar Kanamaluru, IMS2018 General Chair
Srikanth Sridharan
Srikanth Sridharan, Peregrine Semiconductor, San Diego, CA
SSI Cable Corp.
ST-Ericsson
St. D. Ilcev
St. D. Ilcev – Durban University of Technology (DUT)
St. D. Ilcev, Durban University of Technology (DUT)
Stackpole
Stacy Baniszewski, Allison Greco, James T. Walsh
staff
Stan Oda, Anritsu, Morgan Hill, Calif.
Stanford Research Systems Inc., Sunnyvale, CA
Stanford Research Systems, Sunnyvale, CA
Stanford Telecom, Telecom Component Products Group
Stanislaw Alechno
Mark Stanley
State of the Art Inc.
STEALTH Concealment Solutions Inc.
Stealth Microwave
Steatite
Steatite Q-par Antennas
Stefan Pongratz, Anritsu
Stefan Pongratz, Dell’Oro Group, Redwood City, Calif.
Stefan Zehle
Stefanie Lucas, slucas@remcom.com
Stefano Maddio University of Florence, Florence, Italy
Stefano Moscato and Alessandro Fonte, R&D Microwave Laboratory, SIAE MICROELETTRONICA, Cologno Monzese (MI), Italy
Stefano Selleri
Stefano Selleri, University of Florence
Steffen Heuel and Andreas Roessler, Rohde & Schwarz, Munich, Germany
Steffen Heuel and Darren McCarthy, Rohde & Schwarz, Munich, Germany
Steffen Heuel, Tobias Köppel and Sherif Ahmed, Rohde & Schwarz, Munich, Germany
Stellant Systems, Torrance, Calif.
Stepan Lucyszyn, EuMC 2011 Conference Chair
Stéphane Elisabeth, System Plus Consulting, Cédric Malaquin, Yole Développement (Yole)
Stephane Wloczysiak, Skyworks Solutions, Inc.
Stephanie Knight, Filtronic Compound Semiconductors Ltd.; Bill Johnson, Johnson Graphic Arts, San Francisco welcomes all IEEE
Stephen A. Maas
Stephen A. Maas and Ted Miracco
Stephen A. Maas, Nonlinear Technologies Inc., Long Beach, Calif.
Stephen D. Turner, Teledyne Paradise Datacom, State College, PA; Tom Dekker, Cree Inc., Durham, NC
Stephen Harman, Aveillant Ltd., Cambridge, U.K.
Stephen Heiser
Stephen J. Kovacic, Foad Arfaei Malekzadeh, Hassan Sarbishaei, Skyworks Solutions, Woburn, Mass.
Stephen L. Pendergast, 4ward Sciences, San Diego, Calif.
Stephen M. Hanham, University of Birmingham, Birmingham, U.K.
Stephen McClelland
Stephen Morley, TE Connectivity
Stevan Preradovic
Stevan Preradovic and Nemai C. Karmakar Electrical & Computer Systems Engineering, Monash University
Steve C. Cripps
Steve Dudkiewicz, Maury Microwave Corp., Ontario, CA
Yoshiyuki Yanagimoto, Keysight Technologies, Santa Rosa, Calif; David Vye and Marc Vanden Bossche, National Instruments, Austin, Texas; Steve Dudkiewicz, Maury Microwave, Ontario, Calif; Vince Mallette, Focus Microwaves, Montreal, Canada
Steve Dudkiewicz, Maury Microwave, Ontario, Calif.
Steve E. Avery and Richard Barber, Cobham Advanced Electronics Solutions, San Jose, Calif.
Steve Egolf
Steve Fry, Greenray Industries Inc.
Steve Huettner, Nuvotronics LLC, Radford, VA
Steve Hurwitz, Dir. of Product Marketing, ADI
Steve Kenney and John Papapolymerou, IMS2021 General Co-Chairs
Steve Loyal
Steve Maas
Steve Maas, Applied Wave Research Inc.
Steve Maas, J. Delacueva, J. Li and S. White
Steve Munns, ADI
Steve Murray , Keithley
Steve Reyes Anritsu Co., Morgan Hill, CA
Steve Reyes, DCM Industries Inc.
Steve W. Y. Mung, Research and Development Office, The Education University of Hong Kong, Hong Kong
Steve Williams, RT Logic, an Integral Systems Company, Colorado Springs, CO
Steven Fry, Greenray Industries
Steven G. Pytel JR., PHD.
Steven Gao, University of Kent, Canterbury, U.K.
Steven Gao, University of Kent, Canterbury, U.K.
Steven Norsworthy, RF2BITS, Inc., San Diego, Calif.
Steven Pong, Infinite Electronics, Irvine, Calif.
Steven R. Wilkinson, Charlie Hansen, Barry Alexia, Bishara Shamee and Brian Lloyd, Raytheon Intelligence & Space, El Segundo, Calif.
Steven Theeuwen, NXP Semiconductors
Stilwell Baker Inc.
STMicroelectronics
STMicroelectronics Inc.
STMicroelectronics/CMP
Storm Products
Strand Marketing
Strand Marketing Inc.
StratEdge
Strategic Defence Intelligence
Strategy Analytics
Structural Research & Analysis Corp.
Stuart Glynn, Robert Smith, Liam Devlin, Andy Dearn and Graham Pearson, Plextek RFI Ltd., U.K.
Stuart Little, Director of Global and Corporate Marketing of Aviat Networks
Stuart Little, Harris Stratex; Trevor Manning, TMC Global Ltd.
Stuart P. Litt
Su Yongbo, Zhao Hua, Ding Wuchang and Ding Peng, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China
Su-Wei Chang, Ethan Lin, Andrew Wu and Jackrose Kuo, TMYTEK, New Taipei City, Taiwan
Sub10 Systems
Sub10 Systems/HUBER+SUHNER
Sumitomo Corporation
Sumitomo Electric Device Innovations USA Inc., San Jose, Calif.
Sumitomo Electric Industries, Ltd.
Summitek Instruments
Summitek Instruments Inc., Englewood, CO
Sun-Sook Kim, Jong-Hwan Lee and Kyung-Whan Yeom, Chungnam National University
SunCastle Microwave LLC
Sunday Achimugu, Abraham Usman Usman, Suleiman Zubairu, Federal University of Technology, Minna Minna, Nigeria
Sunder Gopani
SunEdison Inc.
Sungchan Jung, Samsung Techwin
Sungtek Kahng and Dongjin Lim, University of Incheon, Incheon, Korea
Sungwoo
Sunsight Instruments
Sunstone Circuits
Superconductor Technologies Inc.
Suren Singh, Keysight Technologies, Santa Rosa, Calif.
Suresh Ram and Jagjit Singh Bal, Infineon Technologies, Milpitas, Calif.
Surinder Kumar, Abbas Mohammadi and David Klymshyn
Surrey NanoSystems
SUSS
SUSS MicroTec
SUSS MicroTec Test System
SUSS MicroTec Test Systems
SUSS MicroTec Test Systems, Dresden, Germany
Suss/Rosenberger
Susumu Deutschland GmbH, Eschborn, Germany
SV Microwave
SV Microwave Inc., an Amphenol company, West Palm Beach, FL
SV Microwave, Commercial Products Group
SV Microwave, West Palm Beach, FL
Sven König, Langer EMV-Technik GmbH, Bannewitz, Germany
SW Filter Design
Daniel Swanson
SWE-DISH
Swift Bridge Technologies
SWISSto12
SWISSto12 SA, Renens, Switzerland
Marc Esquius-Morote, Jean-François Zürcher and Juan R. Mosig, Laboratoire d’Electromagnétisme et d’Acoustique (LEMA), Ecole Polytechnique Fédérale de Lausanne (EPFL), Switzerland, Benjamin Fuchs, IETR/University of Rennes I, France
Syfer Technology
Symmetricom
Symmetricom Inc.
Symmetricom® Inc.
Synergy Microwave Corp
Synergy Microwave Corp., Paterson, N.J.
Synergy Microwave Corp., Paterson, NJ
SynMatrix Technologies Inc., Toronto, Canada
SynMatrix Technologies Inc., Toronto, Canada
SynMatrix Technologies Inc., Toronto, Canada
SynMatrix, Richmond Hill, Canada
SynMatrix, Richmond Hill, Ontario, Canada
Syntonic Microwave Campbell, Calif.
Sypris Electronics/ Cassidian
Sypris Solutions Inc.
Sypris Test & Measurement Inc.
Syrlinks, Cesson-Sevigne, France
Mercury Systems
T
T-Tech Inc.
T. AlSharabati and Y. Chen, University of South Carolina, Columbia, SC
T. Jamsa, J. Malm<sup>1.</sup>; N. Gross, A. Scannavini<sup>2.</sup>
T. Johansson, P. Lundin, J. Engvall, D. Uggla and U. Hagström
T. Korosec, P. Ritosa, B. Batagelj and M. Vidmar University of Ljubljana, Slovenia
T. Pan, K. Song and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China
T. Santos, L. C. Costa, M. Valente, J. Monteiro, J. Sousa
T. Warnagiris, Southwest Research Institute
T.K. Tsang and M.N. El-Gamal, McGill University; W.S. Best, Triangle ElectroMagnetics LLC; H.J. De Los Santos, NanoMEMS Research LLC
T.T. Chia, DSO National Laboratories and Temasek Laboratories, National University of Singapore
Tabor Electronics Ltd.
Taconic
Taconic Advanced Dielectric Division
Taconic Advanced Dielectric Division, Petersburgh, NY
Tadeusz Brenner, Leszek Lamentowski and Roman Mularzuk, PIT-RADWAR S.A.
Tahoe RF Semiconductor
Tahoe RF Semiconductor Inc.
Tahoe RF Semiconductor, Auburn, CA
Tailei Wang, Xi Wang, Rongwei Wang, Rensheng Xie, Dong Chen and Shouzheng Zhu, East China Normal University, Shanghai, China
Taiwan Union Technology Corp.
Taj Manku and Oleksiy Kravets, Cognitive Systems, Waterloo, Canada
Takao Inoue and David Vye, AWR Group, NI, El Segundo, Calif.
Takao Inoue, National Instruments, Austin, TX
Takao Ishida, Mitsubishi Electric Corp. Itami City, Hyogo, Japan
Tamagawa Electronics, Ayase, Japan
Tamarind Phinisee
Tamas Madarasz, Nokia, Espoo, Finland
Tamir Moran, Menlo Microsystems, Irvine, Calif.
Tampa Microwave
Tampa Microwave Inc., Tampa, FL
Tanbir Haque, Leonid Kazakevich and Alpaslan Demir, InterDigital Communications Corp.
Tango Wave
Tanner EDA
Taoglas
Tapani Ryhänen, Mikko A. Uusitalo, Olli Ikkala and Asta Kärkkäinen
Taro Eichler, Ute Philipp, Heinz Mellein and Lorenz Rädler, Rohde & Schwarz, Munich, Germany
Tarun Amla, Isola Group, Chandler, Ariz.
TASC Inc.
Tata Elxsi Ltd.
Tatsuo Itoh
Tatsuo Itoh, Technical Program Chair, IMS 2007
Tazca Connects
TDK Corporation
TDK-EPC
TE Connectivity
TE Connectivity
Tecdia, Santa Clara, CA
Tech Brief, Tektronix
Tech-Inter
Tech-Inter
Tech-Inter
Tech-Inter
Tech-Inter
Tech-Inter
Tech-Inter
Tech-X Corporation, Boulder, Colo.
TechCrunch
Technical Communities
Technical Research and Manufacturing Inc. (TRM)
Technicolor
Technology Business Research, Inc.
Technology Service Corp., Fairfax, VA
TechPlus Microwave
Techtrol Cyclonetics
TECOM
TECOM Industries Inc.
Tecore Networks
Ted Heil, Bill Roehrich and Jack Hakoupian
Ted McKenna, eDefense Online
Ted McKenna, Journal of Electronic Defense
Ted Miracco, Applied Wave Research Inc.
Ted Prema, Times Microwave Systems, Wallingford, CT
Ted Saad
Ted Saad and David Vye
Ted Saad, Harlan Howe, Jr., Peter Staecker and Glen Thoren Former IMS Chairmen Fred Schindler IMS Chairman 2009
TEGAM Inc.
Tekamul Buber, Pragti Narang, Giampiero Esposito and Sathya Padmanabhan, Maury Microwave, Ontario, Calif.
Tektelic Communications
Tektronix
Tektronix Application Note
Tektronix Component Solutions
Tektronix Inc.
Tektronix Inc., Beaverton, Ore.
Tektronix Service Solutions
Tektronix, Beaverton, OR
Telecommunications
Telecommunications Magazine Staff
Telecommunications staff
Telecommunications Staff, from news sources
Telecompetitor
Teledyne Coax Switches
Teledyne Defence
Teledyne e2v
Teledyne e2v Semiconductors
Teledyne e2v Semiconductors
Teledyne Electronics and Communications Europe
Teledyne Labtech
Teledyne LeCroy
Teledyne Ltd.
Teledyne Microwave Solutions, Mountain View, Calif.
Teledyne Microwave Solutions, Mountain View, Calif.
Teledyne Microwave Solutions, Rancho Cordova, CA,
Teledyne Microwave, Mountain View, CA
Teledyne Paradise Datacom, Rancho Cordova, Calif.
Teledyne Paradise Datacom, State College, Pa.
Teledyne Relays, a Teledyne Technologies company
Teledyne Relays, Hawthorne, Calif.
Teledyne Reynolds UK
Teledyne Reynolds, Newbury, UK
Teledyne Storm Products
Teledyne Technologies Inc.
Telefónica
Telegärtner
Telegärtner Karl Gärtner GmbH, Steinenbronn, Germany
Telemakus
Telemakus LLC
Telespazio
TeliaSonera
Telit
Telit Communications
Telit Wireless Solutions
Telonic Berkeley Inc.
Temex
TEMWELL
Tensolite, a Carlisle company
Terence W. Barrett
Terma
Terma Group
Terma/Printca
Tero Kiuru and Henrik Forstén, VTT Technical Research Centre of Finland Ltd., Espoo, Finland
Tero Ranta and Rodd Novak, Peregrine Semiconductor
Terry Edwards
Terry Edwards, Engalco-Research, Bridlington, England
Teseq
Teseq AG
Teseq Holding AG
Teseq Inc.
Teseq Ltd.
Teseq UK
test
Test Equipment Connection Corp.
Test Equipment Plus
Testing Technologies
TestMart
TestWorld Inc.
Tetsuo Sato and Chris Grigorean, Hitachi Semiconductor (America) Inc.
Texas Instruments
Texas Instruments Inc.
Texas Instruments, Dallas, Texas
Texas Microwave & Surplus
Thai Hoa Duong and Ihn S. Kim, Kyung Hee University, South Korea
Thaicom Public Company Limited
Thales
Thales Alenia Space
Thales Alenia Space España
Thales Electron Devices
Thales MESL, Edinburgh, Scotland
Thales Nederland
ThalesRaytheonSystems
The American Society of Breast Surgeons
The Associated Press
The EDA Consortium
The Ferraro Group
The Global Semiconductor Alliance
The IEEE
The IET
The Institute for System Level Integration
The Institution of Engineering and Technology
The International Microwave Symposium
The Micromanipulator Co.
The Microwave Journal Staff
The Phoenix Company of Chicago Inc.
The Rt Hon Matt Hancock MP
The Vitec Group
The Wi-Fi Alliance
The WiMAX Forum
The Z-Wave Alliance
The ZigBee Alliance
The ZigBee® Alliance and the Wi-Fi Alliance®
Theodore (Ted) S. Rappaport, Mingjun Ying and Dipankar Shakya, NYU WIRELESS, Tandon School of Engineering, New York University, Brooklyn, N.Y.
Theodore S. Rappaport, Director of NYU WIRELESS, New York, NY
Theodore Trembinski
Thi Thu Nga Tran, Chirn Chye Boon, Manh Anh Do and Kiat Seng Yeo, Nanyang Technological University, Singapore
Thierry Guillemin, Intelsat, Luxembourg District, Luxembourg
Thilo Bednorz and Jochen Wolle, Rohde & Schwarz, Munich, Germany
ThinKom Solutions Inc.
thinkRF
ThinkRF, Ottawa, Ontario
Thintri Inc.
Thomas Arthur, Valpey Fisher Microwave Products Group, Hopkinton, MA
Thomas Boegl, Rohde & Schwarz, Munich, Germany
Thomas Cameron, Analog Devices Inc., Norwood, Mass.
Thomas Chen, Donuwan Navaratne, Tom Huang, Habib Rastegar, Patrick Houghton and Andrew Chen, SwiftLink Technologies, Richmond, Canada
Thomas Elliott and Russel Lindsay, Anritsu Corporation, Morgan Hill, Calif.
Thomas Gneiting, AdMOS GmbH, (http://www.admos.de), Adrian Scott, CST AG, (http://www.cst.com)
Thomas Gneiting, AdMOS GmbH, Adrian Scott, CST AG
Thomas J. Warnagiris
Thomas Jungmann, Texterei Jungmann, Wangen, Germany
Thomas Jungmann, Texterei Jungmann, Wangen, Germany
Thomas Kleine-Ostmann, Buy Harles
Thomas Neu, Texas Instruments, Dallas, Texas
Thomas P. Budka, David Antopolsky and Matthew T. Pizzella
Thomas Roeder and Dr. Carolin Troester, Rohde & Schwarz
Thomas Sporkmann
Thomas Zwick, EuMW General Chair, Karlsruhe Institute of Technology and Vadim Issakov, EuMW General Co-Chair, Technical University Braunschweig
Thorbjörn Ebefors, Silex Microsystems AB, Järfälla, Sweden; Joachim Oberhammer, KTH Royal Institute of Technology, Stockholm, Sweden
Thunderline-Z
TiaLink Inc.
TiaLinx
TiaLinx Inc.
Tian Qi, University of Electronic Science and Technology of China, Chengdu, China
Tianze Su, Shanghai Transcom Instrument Technologies Co. Ltd., Shanghai, China
Ticer Technologies
Tim Boles, MACOM, Lowell, Mass
Tim Das, NXP
Tim Galla, Fairview Microwave, Lewisville, Texas
Tim L. Hillstrom, Agilent Technologies
Tim Lee, IMS2020 General Chair
Tim Smith, Cameron Staton and Bill Rhyne, Cubic Nuvotronics, Durham, N.C.
Times Microwave Systems
Times Microwave Systems Wallingford, Conn.
Times Microwave Systems, Wallingford, Conn.
Timo Reinhardt
Timothy Boles and Andrew Freeston - M/A-COM Technology Solutions, Lowell, MA
Tina Quach, General Chair
Ting Lang, Lin Li, Li-Li Yang and Zhi-Hao Zhang, Zhejiang Sci-Tech University, Hangzhou, China
TJ Green Associates LLC
TMD Technologies LLC
TMD Technologies Ltd.
TMYTEK
TNO
Tobias Lindström, National Physical Laboratory, U.K.
Tobias Willuhn and Goetz Mayser, Rohde & Schwarz, Munich, Germany
Todd Gillenwater, Mobile Products CTO and VP of Engineering, Qorvo, Greensboro, N.C.
Toko America Inc.
Tokyo Keiki
Tom Brinkoetter, Anritsu Company
Tom Cameron
Tom Galla
Tom Hill, Tektronix Inc., Beaverton, OR
Tom Lam, Rich Bidwell and Scott Blee, Lockheed Martin, Owego, NY
Tom McWalters, Microwave Development Labs, Needham, MA
Tom Newman
Tom Nolle
Tom Raschko, IMS 2013 General Chairman
Tom Rosa, Terabeam-HXI — Haverhill, MA
Tom Weller, David Markell, John Capwell and Vivi Cojocaru
Tomasz Waliwander, Farran, Cork, Ireland
Tommi Jamsa and Juha Ylitalo, Elektrobit
Tommi Jämsä, Anite
Tony Balistreri, R&D Manager, TriQuint Semiconductor
Tony Brown, EuRAD 2011, Conference Chairman
Tony Edridge; M2 Global Technology Ltd. San Antonio, TX
Tony Fattorini and David A. Richardson, Mimix Broadband Inc. Houston, TX
Tony Fedor, Times Microwave Systems, Wallingford, Conn.
Tony Gasseling, Amcad-Engineering, Limoges, France
Tony Lymer, Satori-Technology Ltd.
Tony Mattingly, Rogers Corp., Chandler, Ariz.
Tony Trinh, Mercury Systems, Andover, Mass.
Tore N. Anderson, Airtron Inc.
Toshiba Imaging
TotalTemp Technologies
Tower Semiconductor Ltd.
TowerJazz
TowerJazz and Presto Engineering
TowerJazz Panasonic Semiconductor Co. (TPSCo)
TowerJazz, Newport Beach, CA
Towerstream Corporation
TRAK Microwave Corp.
TRAK Microwave, Tampa, Fla.
Trans-Tech
Transline Technology Inc.
Trescal
Triad RF Systems Inc., East Brunswick, NJ
Triad Semiconductor Inc. and Kaben Wireless Silicon Inc.
Trilithic
Trilithic Inc.
Trimble
Triquint
TriQuint Semiconductor
TriQuint Semiconductor and Agilent Technologies Inc.
TriQuint Semiconductor Design Center
TriQuint Semiconductor Inc.
TriQuint Semiconductor Inc.
TriQuint Semiconductor Inc., Hillsboro, OR
TriQuint Semiconductor Inc.</
TriQuint Semiconductor, Hillsboro, Oregon
TriQuint Semiconductor, Richardson, TX
TriQuint/VIPER RF
Trisynt Technology Inc., Wilmington, Del.
TRM Microwave
TRM Microwave
Troels Emil Kolding
Tronics
TRU Corp., Peabody, MA
TS2 Satellite Technologies
Tsang-Yen Hsieh and Nai-Chueh Wang, National Central University
Daniel S. Green, U.S. Defense Advanced Research Projects Agency (DARPA), Arlington, Va.; Carl L. Dohrman, Jeffrey Demmin, Yan Zheng, Booz Allen Hamilton Inc., Arlington, Va.; Tsu-Hsi Chang, HetInTec Corp., Rockville, Md.
TT electronics
TT electronics plc
TTE Filters
Tudor Williams, Filtronic, Sedgefield, England
Tudor Williams, Randeep Saini and Simon Mathias, Mesuro UK; Andreas Henkel, Rohde & Schwarz
Tyco Electronics
U
u-blox
U.L. Rohde and A.K. Poddar
U.L. Rohde and A.K. Poddar, Synergy Microwave Corp.
U.S. Air Force
U.S. Army
U.S. Department of Transportation
U.S. Navy
Ubidyne
UBIFRANCE Press Office, London
UBM Electronics
UBM Tech
UBM Tech Electronics
UC San Diego
UC San Diego
Ulf Huegel, Alejandro Garcia-Tejero, Rafal Glogowski, Eugen Willmann, Michael Pieper and Francesco Merli, HUBER+SUHNER, Herisau, Switzerland
Uli B. Koelle, Avago Technologies, San Jose, Calif.
Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave Corp., Paterson, N.J., USA
Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave Corp., Paterson, NJ
Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave, Paterson, NJ
Ulrich L. Rohde, Ajay K. Poddar and Anisha M. Apte, Synergy Microwave Corp., Paterson, NJ
Ulrich L. Rohde, Brandenburgische Technische Universitat, Cottbus, Germany; Ajay K. Poddar, Synergy Microwave, Paterson, N.J.
Ulrich L. Rohde, Brandenburgische Technische Universitat; Ajay K. Poddar, Synergy Microwave Corp.
Ulrich L. Rohde, Federal Armed Forces University, Munich, Germany ; Ajay K. Poddar, Synergy Microwave, NJ
Ulrich L. Rohde, Jerry C. Whitaker, Hans Zahnd
Ulrich L. Rohde, Synergy Microwave, Paterson, N.J., Center for Integrated Sensor Systems, Universität der Bundeswehr, Munich, Germany
Ulrich L. Rohde, Univ. der Bundeswehr, Technische Informatik Munich, Germany
Ulrich L. Rohde, Universitat der Bunderwehr and Thomas Boegl, Rohde & Schwarz, Munich, Germany
Ulrich L. Rohde, University der Bundeswehr, Department of Informatics, Microwave Systems, Munich, Germany
Ulrich L. Rohde, University of the Armed Forces Federal University, Munich, Germany
Ulrich L. Rohde, University of the Bundeswehr, Technische Informatik Munich, Germany, Thomas Boegl, Rohde & Schwarz, Munich, Germany
Ultra Electronics Command & Control Systems
UltraSource
UltraSource Inc.
UltraSource Inc. Hollis, NH
UltraSource Inc., Hollis, NH
UMS
UMS/Agilent Technologies
Umut Bulus, Antenom Antenna Technologies Inc., Ankara, Turkey
United Computer and Telecommunication Inc. (UCT)
United Microelectronics Corporation (UMC)
United Monolithic Semiconductors S.A.S.
United Monolithic Semiconductors SAS, France
United Monolithic Semiconductors, Paris, France
Unity Wireless Systems Corp.
Universal Microwave Technology
Universal Switching Corp.
University of Bristol, Bristol, UK
University of Chinese Academy of Sciences, Beijing, China
University of Chinese Academy of Sciences, Beijing, China
K.D. XU1,2, Y.H. ZHANG1, W.T. JOINES2, Q.H. LIU2 AND Y. FAN1 University of Electronic Science and Technology of China1, Chengdu, China Duke University2, Durham, NC
K.D. Xu1,2, Y.H. Zhang1, Y. Yang1, W.T. Joines2, Q.H. Liu2 and Y. Fan1, University of Electronic Science and Technology of China1, Chengdu, China, Duke University2, Durham, NC
University of Glasgow
University of Manchester
University of South Florida
University of Surrey, UK
uRAD, Navarra, Spain
Urmila Nath, Spectral Energies LLC, Dayton, Ohio
Uros Mavric and Brian Chase, Fermi National Accelerator Laboratory
USCD
UT Austin
UTAC Holdings Ltd.
Utsav Gupta, Antoinette Tan, James Liu and Whitney Lohmeyer, Olin College of Engineering, Needham, Mass.
Utsav Gupta, Antoinette Tan, James Liu and Whitney Lohmeyer, Olin College of Engineering, Needham, Mass.
UW-Madison
UW-Madison
UW-Madison
Uwe Gollor, Wolfgang Wischmann and Rüdiger Follmann, IMST GmbH, Kamp-Lintfort, Germany
Uwe Knorr
Ü
Ünal Isler, DEV Systemtechnik
V
V. Manimala, Builders Engineering College, Tamil Nadu, India
V. Rodriguez, ETS-Lindgren L.P.; S. Matitsine, Matsing Pte. Ltd. and Temasek Laboratories, National University of Singapore
V. Sambasiva Rao, PES University, Bangalore, India; M.C. Basava Raj and L. Nicholas, Formerly With Kavveri Telecom Products Ltd., Bangalore, India
Valence Semiconductor
Valeria Brunel and Eric Leclerc, UMS, France
Valpey Fisher
Valpey Fisher Corp.
Valpey Fisher Corp., Hopkinton, MA
Vanguard EMS and Tektronix Component Solutions
Anaya Vardya
Vari-L Co. Inc.
Vari-L Company Inc.
Varun Joshi, University of Colorado, Boulder, CO.
Vaunix
Vaunix Technology Corp.
Vaunix Technology Corporation
Vector Fields
Vector Fields Inc.
Vector Fields Ltd.
VectorNav Technologies
Vectria Ltd.
Vectron International
Ved Vyas Dwivedi and Y.P. Kosta, MIEEE; Shweta Srivastava and H.B. Pandya, Charotar Institute of Technology
Ved Vyas Dwivedi MIEEE, Y.P. Kosta MIEEE, Shweta Srivastava, H.B. Pandya, Charotar Institute of Technology
Venkat Nandivada and Rohit Ramnath, MasterBond Inc., Hackensack, N.J.
Verizon Communications Inc.
Verotec Inc.
Versatile Power
Versatile Power Inc.
Vertigo Technologies, Delft, The Netherlands
VI Technology
Viasat Inc.
VIAVI Solutions
Vicente Rodriguez Senior Principal Antenna Design Engineer
Vicente Rodríguez, ETS-Lindgren
Vicente Rodriguez, Senior Principal Antenna Design Engineer
Victor Fernandez, Anritsu (U.K.)
Victor Sharir, Galormic; Benny Haddad, Jaakko Juntunen, National Instruments
Victor Steel and Art Morris, WiSpry Inc.
Victor Volkov, Michael Parnes, Victor Korolkov
Vida Products
Vijay Nair, IMS2015 General Chair; Steve Goodnick, IMS2015 Vice-Chair
Viktor Bondarchuk, Jabil Software Services, Lviv, Ukraine
Vince Rodriguez, MI Technologies, Suwanee, Ga.
Vincent Kotzsch NI, Emerson Test & Measurement, Austin, Texas
Vincotech
VIPER RF/WIN Semiconductors
Virginia Diodes, Inc., Charlottesville, Va.
Vishay Intertechnology Inc.
Vishay Precision Group Inc.
Visible Assets Inc.
Vislink
Vista Research
Viswanathan Ganesan, WiMAX Application Engineer, Agilent Technologies
Vitali Penso, Noisecom, a Wireless Telecom Group company, Parsippany, NJ
Vitaly Koslov, Independent Consultant
Vito Giannini, Manju Hegde and Curtis Davis, Uhnder, Austin, Texas
Vladimir M. Gevorkyan and Yuri A. Kazantsev, Moscow Power Engineering Institute, Moscow, Russia
Vladimir Veremey and John Dunn, AWR Corp., El Segundo, CA; Alexander Sulima, AVS Microwave, Toronto, Canada
Volker Aue, AMD-Xilinx, Dresden, Germany
Volker Aue, Xilinx, Dresden, Germany
Shahin Gheitanchi1, Christophe Quindroit2, Patrick Roblin2, Naveen Naraharisetti2, Volker Mauer1 and Mike Fitton1, Altera Corp.1, The Ohio State University2
Volker Mühlhaus, Dr. Mühlhaus Consulting & Software GmbH, Witten, Germany
VPG
VRF Micro Devices Inc.
Vsevolod Tanygin Orion Science Research Institute Kiev, Ukraine
VT Networks
VTI Instruments
VTI Instruments Corp.
Vubiq Inc.
VXI Technology Inc.
David Vye
W
W. Ismail, S.A.Z. Murad, T.J. Jiat and J.S. Mandeep, Universiti Sains Malaysia, Pulau Pinang, Malaysia; P. Gardner, University of Birmingham, UK
W. L. Chen, X. Z. Liu, H.D. Wu and G. J. Wang, Nanjing University; G. P. Li, University of California
W. L. Gore & Associates
W. L. Gore & Associates Inc.
W. L. Gore and Associates (Gore)
W. Simon, J. Kassner, O. Litschke, H. Fischer and S. Holzwarth, IMST GmbH, Kamp-Lintfort, Germany
W. Xue, Y.H. Zhang, Z.J. Feng and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China
W.L. Gore
W.L. Gore
W.L. Gore & Associates
W.L. Gore & Associates Inc.
W.L. Gore & Associates Inc., Landenberg, PA
W.L. Gore & Associates, Inc., Landenberg, PA
W.R. Deal, Y. Qian, T. Itoh and V. Radisc
Wael A. Al-Qaq and JianHua Gu, Ansoft Inc.; William J. Martin and Jeffrey L. Cutcher, Motorola Inc.
WAFIOS Machinery Corporation, Branford, CT / Mokena, IL
Walid Ali-Ahmad, RFIC 2018 General Chair; Stefano Pellerano and Waleed Khalil, RFIC 2018 Technical Program Co-Chairs
Walt Strickler, Boonton Electronics, Parsippany, N.J.
Walt Strickler, Boonton Electronics, Parsippany, N.J.
Walt Strickler, Wireless Telecom Group, Parsippany, N.J.
Walter A. Wohlmuth, Wayne Struble and Domingo Farías, TriQuint Semiconductor
Walter Honcharenko, MACOM
Walter R. Frei, COMSOL Inc.
Walter R. Frei, Ph.D., COMSOL, Inc.
Walter Witt, Amplifonix
WAMICON
WAMICON 2011
WAMICON 2014
Wan-Jong Kim, Kyoung-Joon Cho and Shawn P. Stapleton Simon Fraser University Burnaby, BC, Canada Jong-Heon Kim Kwangwoon University Seoul, Korea
Wan-Thai Hsu, Discera Inc.; W. Scott Best, Triangle ElectroMagnetics LLC; Héctor J. De Los Santos, NanoMEMS Research LLC
Tim Wang Lee
Judy Warner
Warren L. Stutzman and Carey G. Buxton
Watkins-Johnson Co.
Wavepia, Hwaseong, South Korea
WavePro, a Brand of Garlock | an Enpro company, Palmyra, N.Y.
WavePro®, A Garlock Brand, Palmyra, N.Y.
Wavesat Inc.
Wavesat Telecom
Wavestream
Wavestream, San Dimas, CA
Wayne A. Shiroma
Wayne A. Shiroma, General Chair, IMS 2007
Wayne Struble
Weber Shandwick
Wei Jiang, Agere System Co. Ltd.; Xiaowei Zhu, Southeast University
Wei Liu and Da Wenpen, MICable Inc., Fuzhou, Fujian, China
Wei Liu, Guang Yang and Fa-Lin Liu, University of Science and Technology of China
Wei Liu, MIcable Inc., Fuzhou, China
Wei Liu, Mitron Inc., Fuzhou, China
Wei Luo, Hongyuan Zhang, Xiaolong Weng, Haiyan Chen, Wentao He and Kai Li, University of Electronic Science and Technology of China, Chengdu, China
Wei-Ting Lee and Huey-Ru Chuang National Cheng Kung University Tainan, Taiwan, ROC, Chun-Lin Lu Kun Shan University Tainan, Taiwan, ROC
Weichen Huang, Liang Ma, Zhiqiang Yu and Jianyi Zhou, State Key Laboratory of Millimeter Waves, Southeast University Nanjing, China
Weightless SIG
Weilong Tang, Lin Peng and Shaoxin Lin, Guangdong University of Technology, Guangzhou, China
Weinschel Associates
Weinschel Associates, Gaithersburg, MD
Weinschel Corp.
Wen Phan
Wen-Chung Liu and Jiun-Kai Chen, National Formosa University Yunlin, Taiwan
Wen-Ling Chen and Guang-Ming Wang, Missile Institute of Air Force Engineering University, Shaanxi Province, P.R. China; Guo-Dong Chen, Guang-Feng Yao,
Wen-Ling Chen, Guang-Ming Wang and Yi-Na Qi, Missile Institute of Air Force Engineering University
Wen-Shan Chen and Bao-Hung Kao Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC
Wen-Shan Chen and Fu-Mao Hsieh, Southern Taiwan University of Technology
Wen-Shan Chen and Ho-Yu Lin, Southern Taiwan University of Technology
Wen-Shan Chen and Kai-Cheng Yang, Southern Taiwan University
Wen-Shan Chen and Kuang-Yuan Ku, Southern Taiwan University
Wen-Shan Chen and Kuang-Yuan Ku, Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC
Wen-Shan Chen and Mao-Kai Hsu
Wen-Shan Chen and Mao-Kai Hsu, Southern Taiwan University of Technology, Tainan Hsien, Taiwan, ROC
Wen-Shan Chen and Sheng-Che Wu Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC
Wen-Shan Chen and Shih-Hung Cheng, Southern Taiwan University, Taiwan, ROC
Wen-Shan Chen and Yen-Hao Yu, Southern Taiwan University
Wen-Shan Chen and Yu-Chen Chang, Southern Taiwan University of Technology
Wen-Shan Chen, Chi-Huang Lin and Mao-Kai Hsu
Wen-Shan Chen, Ho-Yu Lin S. Taiwan Iniversity of Technology
Wen-Shan Chen, Southern Taiwan University of Technology
Wenming Li, University of Electronic Science and Technology of China, Chengdu, China; Haiwen Liu, Institute of Optics and Electronics, Chinese Academy
Wenteq Microwave
Wenzel Associates, Austin, TX
Werlatone Inc.
Werlatone Inc., Patterson, N.Y.
Werlatone, Patterson, NY
Werner Wild
Wes Fields, Aeroflex / Metelics, Sunnyvale, CA
Wes Littlefield, Vice President, Business Development, Hypres
Wes Mickanin
West Technology Research Solutions
WEST•BOND, Anaheim, Calif.
Weston Sapia, RF Applications Engineer, Linear Technology Corp. / Now Part of Analog Devices, Inc.
White Paper
White Paper, Agilent Technologies
White Paper, AWR Corp.
White Paper, Bridgewave Communications
White Paper, Intelsat
White Paper, Peregrine Semiconductor
White Paper, Polaris Wireless
White Paper, Polaris Wireless, Inc.
White Paper, Skyworks Solutions
Whitney Q. Lohmeyer, Phillip Post, Katie Fleming, Celvi Lisy, Argyris Kriezis and Abby Omer, Olin College of Engineering, Needham, Mass.
Widad Ismail, JS Mandeep and Mohammed Saeed Jawad
Widad Ismail, JS Mandeep, Mohammed Saeed Jawad
Wide Band Systems Inc.
William B. Kuhn and Naveen K. Yanduru
William B. Sullivan
William Bazzy and Carl Sheffres
William Conley, Mercury Systems, Andover, Mass.
William Dunham, Cadence Design Systems Inc., San Jose, CA
William T. Thornton and Lawrence E. Larson
William Walsh, Quantic Wenzel, Austin, Tex.
William Webb, Neul Ltd., Cambridge, UK
William Yu and Urvashi Sengal, Mini-Circuits, Brooklyn, N.Y.
Willie L. Thompson II, Eric V. Miller and Carl White
Willtek Communications
Wilson Electronics
Wilson Electronics, Salt Lake City, Utah
WiMAX Trends
WIN Semiconductors
WIN Semiconductors and Agilent Technologies
WIN Semiconductors Corp.
WIN Semiconductors Corp., Tao Yuan Shien, Taiwan
Winchester Electronics
Winfried Simon and Andreas Lauer, IMST GmbH, Kamp-Lintfort, Germany
Winfried Simon, Aline Friedrich, Oliver Litschke, Markus Krengel, IMST GmbH, Kamp-Lintfort, Germany
Christopher F. Marki, Marki Microwave; Tim Bagwell, TB Engineering; Wing Yau, Yuefei Yang, Chung-Hsu Chen and David Wang, Global Communications Semiconductors
WIPL-D
WiQuest Communications
Wireless Gigabit Alliance
Wireless Telecom Group
Wireless Telecom Group Inc.
Wireless Telecom Group.
WiSilica
WiSpry Inc.
Wissam Saabe, AMCAD Engineering, France
WJ Communications
WJ Communications Inc.
WJ Communications Inc. San Jose, CA
WJ Communications Inc., San Jose, CA
Wolfgang Damm, Product Management Director
Wolfgang Heinrich, General Chairman; Ivar Bazzy, Horizon House Publications Inc.
Wolfgang Heinrich, President, European Microwave Association
Wolfgang Menzel
Wolfspeed
Wolfspeed, Durham, N.C.
Women in Microwave Engineering
Worcester Polytechnic Institute (WPI)
WORK Microwave
World Wireless Communications Inc. (WWC)
Ron Worman
Wurth Electronics Midcom, Inc.
Würth Elektronik
Würth Elektronik eiSos
Würth Elektronik eiSos GmbH & Co. KG
Würth Elektronik eiSos Group
Würth Elektronik iBE
Würth Elektronik IQD
Würth Group
Wurth Wireless Connectivities and Sensors
Wyatt Taylor, RF Engineer, Analog Devices
Wyman L. Williams and James M. Howell, EMS Technologies Inc.
X
X-COM Systems
X-COM Systems LLC
X-FAB Semiconductor Foundries
X-Microwave
X-Rel Semiconductor
X-Series White Paper
X. Feng, Y.H. Zhang, W. Xue, H. Zhang and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China
X. Li, L. Yang, S.X. Gong, Y.J. Yang, T. Hong and X. Chen, Xidian University, Shaanxi, People’s Republic of China
X. Zhao, T. Haarakangas, J. Katajisto, M. Niemi, P. Myllylä, J. Inget and J. Alasalmi, Elektrobit (EB), Oulu, Finland
X.L. Sun, S.W. Cheung and T.I. Yuk, University of Hong Kong, Hong Kong, China
X.Q. Chen, Y.C. Guo and X.W. Shi, Xidian University
X2Y Attenuators LLC
Xerafy
Xi Wang, Zhihang Tong and Zhi Jin, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
Xi Yao, S.C. Jung, M.S. Kim, J.H. Van, H. Cho, S.W. Kwon, J.H. Jeong, K.H. Lim, C.S. Park and Y. Yang, Sungkyunkwan University, Suwon, Korea, H.C. Par
Xi-Zheng Ke, Xi’an University of Technology, Xi’an, China
Xiangmin Li and Zhuang Kang, Yangtze University College of Arts and Sciences, Jingzhou, China
Xianrong Zhang, Qingyuan Wang, Jinhua Cao and Anj Peng, University of Electronic Science and Technology of China, Chengdu, China
Xiao Lu, Agilent Technologies Inc.
Xiao Qun Chen, Ling Xia Wang, Chang Yun Cui and Xiao Wei Shi, Xidian University, Shaanxi, China
Xiaomi
Xiaoming Chen, BreconRidge Manufacturing Solutions
Xiaosen Dai Shanghai Radio Equipment Research Institute
Xiaowu Zhan, Zongxi Tang, Yunqiu Wu and Biao Zhang, University of Electronic Science and Technology of China, Chengdu, Sichuan, China
Xiaoxi Cui, Haihui Yu, Jiqun Jiang, First Research Institute of The Ministry of Public Security, Beijing 100048, People’s Republic of China
Xicom Technology
Xilinx Inc., San Jose, Calif.
Xin Feng, William T. Joines and Qing Huo Liu, Duke University, Durham, N.C.
Xin Feng, Yonghong Zhang, Guide Zhu and Yong Fan, University of Electronic Science and Technology of China, Chengdu, China
Xin Wang, Yuhang Lu, Junlin Wang, Zelong Wang, Tao Liu and Min Wei Inner Mongolia University, Hohhot 010021, China
Xinlin Xia, Zhichen Zhao, Fengjun Chen, Xu Cheng, Xianhu Luo and Xianjin Deng, China Academy of Engineering Physics
XIO Strategies Inc.
Xiongwen Zhao, Elektrobit (EB)
Xiufeng Ren, Zhaojun Zhu, Ke Yang and Yuxin Wang, University of Electronic Science and Technology of China, Chengdu, China
Xiuping Li, Beijing University of Posts and Telecommunications, Beijing, P.R. China; Jianjun Gao, East China Normal University, Shanghai, P.R. China;
Xiuping Li, Beijing University of Posts and Telecommunications, China, Jianjun Gao, Southeast University, Nanjing, China, Georg Boeck, Technische Univ
XL Microwave Inc.
XMA
XMA Corp.
Xpedion Design Systems Inc.
Xpedion Design Systems Inc. and Jazz Semiconductor
Xpeedic Technology, Shanghai, China
Xu Li, Ji-hui Yu, Quan-di Wang and Yong-ming Li
Xu Liang and Chia Yan Wah Michael
Xuanyu Chen, Qi Su, Ting Chen, Linlin Cai, Jiang Luo, Hao Wang,
Xudong Wang, Dawn Wang, Chris Masse and Peter Bacon
Xuhao Zhao, Yongjun Hu, Qiang Zhang, Chengwei Yuan and Jiande Zhang, National University of Defense Technology, China
Xushen Li, Yongpeng Wu and Hairong Zhang, Southern Marine Science and Engineering Guangdong Laboratory, Zhanjiang, China
Y
Y. Pennec, Y. El Hassouani, C. Li, B. Djafari Rouhani, E.H. El Boudouti, H. Larabi, A. Akjouj
Y. Sun, Utrecht T. Tieman, H. Pflung and W. Velthuis
Y. Tkachenko, Y. Zhao, C. Wei and D. Bartle
Y. Vorokhovsky, A. Nikonov, A. Kotyukov and A. Kamochkin, Morion Inc., Russia
Y. Vorokhovsky, A. Nikonov, A. Kotyukov, V. Lyaskovsky, A. Kamochkin and Y. Kolpakov, Morion Inc., Saint Petersburg, Russia
Y. Yang, P. Zampardi, M. Fredriksson, J. Xu, S Chen and G. Zhang, Skyworks Solutions Inc.; J. Sifri, Agilent Technologies / Agilent EEsof EDA
Y.C. Moon, J.R. Lee, S.W. Yun and I.S. Chang
Y.W. Yeap
Y.W. Yeap, E.C. Teh and T.W. Chua
Y.W. Yeap, L.H. Chua and S.H. Tan, Nanyang Technological University
Y.Y. Wei, P. Gale and E. Korolkiewicz
Y.Y. Yang, X.W. Shi, X.H. Wang, X.Q. Chen and D.Z. Chen, Xidian University, Shanxi, China
Yair Shemesh
Yan Christian Venot and Peter Kielhorn, EADS Defence & Security
Yan Dou, Weinan Normal University, Weinan, China and University of Electronic Science and Technology of China, Chengdu, China
Yan Zhou, Beihang University, Beijing, China
Yang Xiao, Lin Li, Gang Liu and Guan-Xing Guo, Zhejiang Sci-Tech University, China
Yang Zhang, Qualcomm Inc.
Yanmin Wang, Shandong University of Science and Technology
Yann Deval, 2010 RFIC General Chair
Yannick Zeller and Tom Beutelspacher, DEV Systemtechnik GmbH
Yanwei Wang, Jianyi Zhou and Wei Hong, Southeast University, Nanjing, PR China
Yao Li, Xiao-Wei Zhu, Ling Tian and Rui-Jia Liu, School of Information Science and Engineering, Southeast University Nanjing, China
Yao Xi, Samsung Electronics
Yao-Huang Kao, Chun-Chieh Chien
Yasin Yousefzadeh and Mohsen Hayati, Razi University, Kermashah, Iran
Yassen Mikhailov, Rohde & Schwarz, Munich, Germany
Yat Sze Choy, Department of Mechanical Engineering, The Hong Kong Polytechnic University, Hong Kong
Yavuz Erol, Department of Electrical and Electronic Engineering Firat University Elazig, Turkiye
Yavuz Erol, Department of Electrical and Electronic Engineering, Firat University, Elazig,Turkey
Ye Yuan, Yong Fan, Ziqiang Yang and Haodong Lin, University of Electronic Science and Technology of China
Yevgeniy A. Tkachenko, Dylan Bartle and Ce-Jun Wei
Yew Hui Liew, Mook Seng Leong and Jurianto Joe
Yezdi Antia, Sam Morrar and Dave Roos, Hughes Network Systems LLC, Germantown, Md.
Yijie Qiu(1,2), Yei Hwan Jung(2), Subin Lee(1,2), Juhwan Lee(2) and Ting-Yen Shih(2);
Yin Zou, Jin Pan and Xinyang Ji, University of Electronic Science and Technology of China
Yingjie Xu, Jingqi Wang and Xiaowei Zhu, Southeast University, Nanjing, China
Yinjin Sun, Xiaowei Zhu and Fan Meng, Southeast University, China
Yitong Xiong and Xiaoping Zeng, Chongqing University, Chongqing, China
YOKOWO Co. Ltd., Tokyo, Japan
Yole Developement
Yong Liao, Institute of Applied Electronics, China Academy of Engineering Physics, Mianyang, China
Yong Liu, Philips Research China; Philips (China) Investment Co. Ltd., Shanghai, China
Yong Zhang and Dafu Lu; University of Electronics Science and Technology of China, Chengdu, China
Yong-Chae Jeong
Yong-Chae Jeong and Sang-Young Yun
Yong-Chae Jeong, Chonbuk National University; Si-Gyun Jeong, Samsung Electronics; Jong-Sik Lim, Korean Intellectual Property Office; and Chul-Dong Kim
Yong-Chae Jeong, Chonbuk National University; Young Kim, Kumoh National Institute of Technology; Chul D. Kim, Sewon Teletech Inc.
Yong-Chae Jeong, Dal Ahn, Chul-Dong Kim, Ik-Soo Chang
Yong-Chae Jeong, Do-Kyeong Hwang and Jong-Sik Lim; Soonchunhyang University, Chonbuk National University and ACE Technology
Yong-Chae Jeong, Young-Jean Song, In-Ju Oh and Chul-Dong Kim
Yong-Qin Liu, Xi’an University of Technology, Xi’an, China, Weinan Normal University, Weinan, China
Yong-Woong Jang
Yong-Woong Jang Keukdong College Chungbuk, Korea Hyun-Chul Go AMC Centurion Korea Co. Ltd. Seoul, Korea
Yong-Woong Jang, Ho-Sub Shin
Yong-Woong Jang, Jeong-Chull Yoon and Ho-Sub Shin
Yong-Woong Jang, Keukdong College
Yong-Woong Jang, Keukdong College; Hyun-Chul Go, Hankook Antenna Co. Ltd.; Sang-Woo Lee, Mokpo Maritime University
Yong-Woong Jang, Keukdong College; Sang Woo Lee, Mokpo National Maritime University
Yong-Woong Jang, Keukdong College; Sang-Woo Lee, Hankook Antenna Co. Ltd.
Yong-Woong Jang, Sang-Woo Lee and Jeong-Hye Kwon
Yong-Woong Jang, Sang-Woo Lee, Jeong-Hye Kwon
Yongin Han and Ihn S. Kim
Yongxi Qian, Roberto Coccioli, Dan Sievenpiper, Vesna Radisic, Eli Yablonovitch and Tatsu Itoh
Yongzhen Gao, ZongXin Tang, Biao Zhang and YunQiu Wu, University of Electronic Science and Technology of China, Chengdu, China
Yongzhong Zhu, Dan Li, Yongjun Xie and Rui Yang, Xidian University
Yongzhong Zhu, Dan Li, Yongjun Xie and Rui Yang, Xidian University, Xian Shaanxi, China
Yorgos Stratakos and Panayotis Betzios, National Technical University
Yoshihisa Amano, Atsushi Yamada, Eiji Suematsu, Hiroya Sato
Young Bin Cho, Kye Suk Jun and Ihn S. Kim, Kyung Hee University; Byung Soo Kim, Shinsung College
Young Kim, Ik-Soo Chang, Yong-Chae Jeong
Young Kim, Ki-Kyung Jeon, Ell-Kou Kim and Byung-Chul Kim, Kumoh National Institute of Technology, Gumi, South Korea
Young Yun
Young Yun and Jang-Hyeon Jeong, Korea Maritime University, Busan, Korea
Young Yun Woo, Youngoo Yang, Jaehyok Yi, Joongjin Nam, Jeonghyeon Cha and Bumman Kim
Young Yun, In-Ho Kang and Ji-Won Jung, Korea Maritime University
Young Yun, Jang-Hyeon Jeong, Hong-Seung Kim and Nak-Won Jang, Korea Maritime and Ocean University, Busan, Korea
Young Yun, Jang-Hyeon Jeong, Hong-Seung Kim and Nak-Won Jang, Korea Maritime University
Young Yun, Korea Maritime University, Busan, Korea
Young Yun, Young-Bae Park, Suk-Youb Kang, In-Ho Kang and Ji-Won Jung, Korea Maritime University Busan, Republic of Korea; Kyu-Ho Park, Korea Electroni
Young-Bae Park, Young Yun, Suk-Youb Kang, In-Ho Kang, Ji-Won Jung and Kyu-Ho Park, Korea Maritime University, Busan, Korea; Kwang-Ho Anh, Korea Electr
Nam-Shin Park, Don-Yong Lee, Byung-Chul Kim, Jung-Hee Won, In-Ho Na, Geon-Ho Jang, Young-Ho Cho, Xu-Guang Wang and Sang-Won Yun, Sogang University, Republic of Korea
Young-Kil Kwag, Korea Aerospace University, Seoul, Republic of Korea
Youngoo Yang, Jaehyok Yi, Joongjin Nam and Bumman Kim
Youngoo Yang, Jaehyok Yi, Young Yun Woo and Bumman Kim
Younkyu Chung, Dal Ahn and Tatsuo Itoh; California Institute of Technology, Soonchunhyang University and University of California
Yu Qian, Keysight Technologies Inc., formerly Agilent Technologies electronic measurement business, Santa Rosa, Calif.
Yu Zhu, Jason Gerber and Qian Cai
Yu Zhu, Kaijun Song, Shunyong Hu and Yong Fan, University of Electronic Science and Technology of China, Chengdu
Yu-Han Chang, Technology Analyst at IDTechEx
Yuan-Kai Chu and Huey-Ru Chuang
Yuan-Kai Chu and Huey-Ru Chuang, National Cheng Kung University
Yuehang Xu, UESTC
Yuehang Xu, University of Electronic Science and Technology of China, Chengdu, China
Yuehang Xu(1), Ruimin Xu(1) and Weigan Lin(1); Justin C. Williams(2),
Yuenie Lau, OML Inc.
Yuhua Qi, Zhao Shen and Rulong He, Naval University of Engineering, Wuhan, China
Yuji Komatsuzaki, Koji Yamanaka and Shintaro Shinjo, Mitsubishi Electric Corporation, Kamakura, Japan
Yuming Zhang, Hongliang Lu and Yimen Zhang, Xidian University, Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices, Xi’an, China
Yuming Zhang, Hongliang Lu and Yimen Zhang, Xidian University, Xi’an, China
Yung-Ming Chiu and Huey-Ru Chuang, Institute of Computer and Communication Engineering, National Cheng Kung University
Yuping Toh
Yuri A. Pashkin, Lancaster University, U.K.
Yuriy Kitaev, Voronezh State University; Aleksey Shulga, Voronezh Institute of Communications
Yuriy Shlepnev, Simberian Inc.
Yusuke Tajima Auriga Measurement Systems LLC Lowell, MA
Yvan Droinet
Z
Z-Communications
Z-Communications Inc., Boulder, Colo.
Z-Communications Inc., Poway, Calif.
Z-Wave Alliance
Z.D. Tan, J.S. Mandeep, S.I.S. Hassan and M.F. Ain School of Electrical and Electronic Engineering, Universiti Sains Malaysi
Z.D. Tan, J.S. Mandeep, S.I.S. Hassan and M.F. Ain, Universiti Sains Malaysia
Z.J. Zhu, C.L. Wei and B.F. Jia, University of Electronic Science and Technology of China, Chengdu, China
Zach Donathan and Mike McCulley, Benchmark
Zacharia Ouardirhi and Tony Gasseling, AMCAD Engineering, Canada
Zadar Labs, San Jose, Calif.
Bill Zalud
Zarko Novicic , Vikram Venkataramanan and Tamara Moskaliuk, Per Vices
Zeland Software Inc.
Zentech Manufacturing, Inc.
Zhancang Wang Nokia; Damon Holmes, Freescale Semiconductor; Mustafa Acar, Robin Wesson and Mark P. van der Heijden, NXP Semiconductors
Zhanyi Qian, Huizhou Wireless Technology Co. Ltd., Huizhou, China
Zhao Hua, Yao Hongfei, Jin Zhi and Liu Xinyu, Institute of Microelectronics, Chinese Academy of Sciences
Zhaolong Li and Xuping Zhang, Nanjing University, Nanjing, P. R. China, Ke Wu and Xiaoping Chen, École Polytechnique de Montreal, Canada
Zhe Chen, Wei Hong, Jianyi Zhou, Jixin Chen and Chen Yu, Southeast University, Nanjing, China
Zhen Li, P.F. Maccarini, O.A. Arabe, V. Stakhursky, W.T. Joines and P.R. Stauffer, Duke University; M. Vogel and D. Crawford, Ansoft Corp.
Zhenfeng Yin, Nanjing Electronic Equipment Research Institute, Nanjing, China
Zheng Haitao, Zhao Guoqiang, Cheng Hang, Yu Liechen, Li Zhangfenga and Li Shiyong, Beijing Institute of Technology, Beijing, China
Zheng Liang Lv and Shuxi Gong, Xidian University; Shiwei Zhao and Xiang Zhang, Shanghai Radio Equipment Research Institute
Zhengbo Jiang, Wei Hong, Nianzu Zhang and Chao Yu, Southeast University, Nanjing, China
Zhi-Hao Zhang, Lin Li, Li-Li Yang, Ting Lang and Xue Cao, Zhejiang Sci-Tech University, Hangzhou, Zhejiang Province, China
Zhiqiang Yu, Jianyi Zhou, Jianing Zhao, Teng Zhao and Wei Hong, Southeast University, Nanjing, China
Zhiqun Cheng, Hangzhou Dianzi University, Hangzhou, China, Chinese Academy of Sciences, Suzhou, China
Zhiqun Cheng, Hangzhou Dianzi University, Hangzhou, China, Suzhou Institute of Nano-Tech and Nano-Bionics, Suzhou, China
Zhiwei Zhang, Chen Li and Guohua Liu, Hangzhou Dianzi University, Hangzhou, China
Zhiwei Zhang, Zhiqun Cheng and Guohua Liu, Hangzhou Dianzi University, Hangzhou, China
Zhong Yin Xiao, Shan Gao, De Chen Ma and Liang Liang Xiang, Shanghai University, Shanghai, China
ZigBee Alliance
Ziptronix
Ziyang Zhao, Zongxi Tang, Yunqiu Wu and Biao Zhang, University of Electronic Science and Technology of China, Chengdu, China
Zoltan J. Cendes, Ansoft Corp.
Zoltan J. Cendes, Ansoft Corporation
Zong Si Wu and Jenq Shiou Leu, National Taiwan University of Science and Technology (NTUST), Department of Electronic and Computer Engineering
Ping Su, Shiwei Zhao, Shanghai Radio Equipment Research Institute, Shanghai, China; Zongxi Tang, University of Electronic Science and Technology of China, Chengdu, China
Zoran Golubicic, Sasa Dragas and Zoran Cvetkovic, TTI Technologías de Telecomunicaciones y de la Informacíon
Zord Gabor Laszlo
Zoubiri Bachir, Division Telecom, Center for Development of Advanced Technologies (CDTA), Algeria
Zoya Popovic, Sébastien Rondineau and Dejan Filipovic, University of Colorado; David Sherrer, Chris Nicholas, Jean-Marc Rollin and Ken Vanhille, Rohm
ZTE
ZTEC Instruments
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