CoMP: The Most Challenging Technology Component in LTE-Advanced 3GPP Release 11 November 13, 2013 Andreas Rossler and Meik Kottkamp, Rohde & Schwarz, Munich, Germany No Comments
Artificial Intelligence and Machine Learning Add New Capabilities to Traditional RF EDA ToolsBy Contributions by Altair, ANSYS, Cadence/AWR, Keysight and MathWorksSubscribe
A Microelectromechanical Switch with Metamaterial Contacts, Part III: Reducing StictionBy Shiban K. Koul and Pranav K. Srivastava, C.A.R.E, Indian Institute of Technology, Delhi, India and Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave, N.J., U.S.
RLC Parameter Extraction Using the Transfer MatrixBy Brian Walker, Copper Mountain Technologies, Indianapolis, Ind.
