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ARTICLES

Airstrip(TM) — an Innovative Transmission Line Technology in Support of Hi-Rel Space Qualified Packaging

Mechanical integration of microwave components often becomes the last step while addressing manufacturing considerations for system-level designs. In many cases, the electrical design is analyzed, boards built, designs reverified, then mechanical engineers fit everything into the final package. This paper shows how component manufacturers can help solve system-level packaging problems using Airstrip technology.


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How GaN is Changing the SATCOM RF Front-End

Solid-state technologies such as gallium nitride (GaN) are transforming satellite communications (satcom). GaN’s advantages of high RF power, low DC power consumption, high reliability and smaller size (which reduces system weight) are opening new markets and revolutionizing the RF front-end (RFFE) in existing satcom applications.


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DOCUMENTS AND FILES

Achieving First-Spin Success in LTCC Components with Advanced Material Simulation Models

Since the advent of Network Synthesis Theory at the turn of the last century, filter designers have been developing ever more sophisticated solutions to translate polynomial transfer functions into working, physical components.

7 Reasons You’re Paying Too Much for Your Spectrum Analyzer

With PC-based spectrum analyzers becoming mainstream, maintaining the status quo begs the question: Why let big, expensive spectrum analyzers of the past limit your test capabilities and capacity?

Mitigating 5G Interference Signals in the C-Band

With the rollout of 5G infrastructure, the 5G interference signals will be powerful enough to saturate the sensitive C-band satellite receiving systems, causing a potential for total loss of service. To eliminate or control any electromagnetic interference one must focus on three major fronts -the transmitter, the medium of propagation and the receiver.

Measuring the TRUE NOISE FLOOR of a Cross Correlation Analyzer

This paper outlines how crucial it is to measure and understand the actual noise floor of a phase noise analyzer with a known level of confidence in your data versus relying on calculated noise floor approximations.

Characterizing Active Phased Array Antennas

This application note aims to explain test procedures and give recommendations towards characterization of the relevant parameters for active phased array antennas and their passive subsystem, as often used in applications for Mobile Communication and RADAR.

Airstrip(TM) — an Innovative Transmission Line Technology in Support of Hi-Rel Space Qualified Packaging

Mechanical integration of microwave components often becomes the last step while addressing manufacturing considerations for system-level designs. In many cases, the electrical design is analyzed, boards built, designs reverified, then mechanical engineers fit everything into the final package. This paper shows how component manufacturers can help solve system-level packaging problems using Airstrip technology.

How GaN is Changing the SATCOM RF Front-End

Solid-state technologies such as gallium nitride (GaN) are transforming satellite communications (satcom). GaN’s advantages of high RF power, low DC power consumption, high reliability and smaller size (which reduces system weight) are opening new markets and revolutionizing the RF front-end (RFFE) in existing satcom applications.

The Amplitude Resolution of Digitizers and How it Affects Measurement

Amplitude resolution is a key specification for digitizers. How is this specification matched to the measurement requirement? What are the technical tradeoffs involved in the selection of digitizer amplitude resolution? Having made such a selection what can be done to improve the resolution of the acquired data? Find the answers!

Now Available Online: DesignCon 2019 Keysight Education Forum (KEF) Sessions

Watch all 8 KEF sessions from the convenience of your desk. Get complimentary access to the materials that made KEF a huge success. See what the industry's leading experts presented and learn about the latest challenges and solutions in high-speed digital technology.

Real-Time Digital Down-Conversion with Equalization

Quality digital down conversion (DDC) is challenging with high-speed time-interleaved analog-to-digital converters (TIADC) due to frequency response mismatches of sub-ADC slices, which cause spurious components. This paper describes a novel method for real-time DDC with slice mismatch equalization.
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