Antenova Ltd has added a high performing 5G SMD design to its array of 5G antennas, the Lepida SR4L054 is a wideband antenna in SMD form, designed to achieve high efficiency and performance right across the spectrum from 600 MHz to 3800 MHz.  

Microchip Technology Inc. announced it has filled this gap with its MCP37Dx1-80 family, the company’s second pipelined ADC offering and first to combine 80 MSPS in a choice of 12-, 14- and 16-bit resolutions, integrated digital features and qualification to a higher temperature range, including Automotive Electronics Council Q100. 

Atlanta Micro has released AM3129, an analog voltage-tunable notch filter bank covering the 1.0 to 6.0 GHz frequency range.

Infinite Electronics, Inc. has announced the promotion of Jason Koshy to global vice president of sales. In this role, Koshy will lead all Infinite sales teams.

Through their flagship SKY66430-11, Skyworks is powering new devices in the rapidly emerging 5G Massive Internet of Things (IoT) market.

Keysight Technologies, Inc. announced the first 256 GSa/s arbitrary waveform generator (AWG), Keysight's M8199A, with 65 GHz analog bandwidth in a compact two-slot AXIe module.

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the grand opening of its 150 mm (6-inch) RF Gallium Nitride (GaN) fab in Chandler, Arizona, the most advanced fab dedicated to 5G RF power amplifiers in the United States. The new internal factory combines NXP’s expertise as the industry leader in RF power and its high-volume manufacturing know-how, resulting in streamlined innovation that supports the expansion of 5G base stations and advanced communication infrastructure in the industrial, aerospace and defense markets.

Cinch Connectivity Solutions, a Bel group company, announced the Johnson 1.85 mm, 2.4 mm and 2.9 2mm Screw-on Low Profile End Launch Connectors.

Palomar Technologies announced the availability of their new Palomar 8100 Wire Bonder. The new 8100 wire bonder is a fully automated, thermosonic high speed ball-and-stitch wire bonder capable of ball bumping and customized looping profiles.