March 4: Chiplets and 3D Heterogenous Integration
This panel of experts will discuss the challenges of advanced packaging technologies such as Chiplets and 3D Heterogenous Integration including integration, stacking, signal integrity and thermal concerns. The group will discuss simulation, testing and performance advantages of these approaches.
August 26: Digital Twins and AI
This panel of experts will discuss the benefits and challenges of developing digital twin models along with how AI is being used to assist in modeling and design of RF and microwave circuits.