IMS2026 in Boston, held June 7–12, was a standout event and one of the most engaging editions of the Microwave show in recent memory. Set against the backdrop of the Seaport District, the venue brought a fresh, modern energy that matched the pace and momentum of innovation on the show floor.

Across the week, several clear themes came into focus. AI infrastructure was front and center, with companies showcasing new high-speed connectivity solutions designed to support next-generation data centers and increasingly complex compute environments. At the same time, there was strong momentum in RF test and measurement, particularly solutions enabling emerging applications in AI, quantum computing, satellite communications and future 6G networks.

Defense and aerospace technologies continued to be a cornerstone of the show, with meaningful advances in direct RF architectures, MMIC design and high-frequency components. Taken together, the product announcements reflected an industry that is not only evolving quickly, but doing so with a strong sense of collaboration and shared momentum across commercial, space and defense ecosystems.

Against this backdrop, many leading companies brought forward exciting new product introductions and portfolio enhancements at IMS2026, underscoring both the breadth of innovation and the energy driving the industry forward. The following section takes a closer look at some of the key announcements and highlights from the show floor.

Check out our photo gallery from the event here and our video gallery here.

Aaronia 

At its booth 23045 in Hall A, Aaronia AG showcased the latest innovations in high-frequency measurement technology, featuring state-of-the-art test and measurement equipment and accessories, to the more than 8,000 expected visitors from over 55 countries.

In addition to the USB-based real-time spectrum analyzers of the SPECTRAN® series—flexible, customizable, and extremely powerful solutions—Aaronia, as a full-range supplier, showcased RF expertise made in Germany with its high-end accessory line.

Altera

At IMS 2026, Altera announced its next-generation Agilex® 9 Direct RF-Series SoC FPGA, designed to address growing demands for RF bandwidth, flexibility and real-time processing across aerospace, defense and advanced communications systems. 

Key highlights include: 

• 40% increase in compute capability per square millimeter compared to the previous generation 
• 45% greater logic and DSP density than the previous generation 
• Integrated RF, compute, and memory resources in a single platform 
• Designed for advanced radar, electronic warfare, beamforming and wideband signal processing applications 
• Support for next-generation DDR5 and LPDDR5 memory technologies 

Altum RF 

At Booth #22020,  Altum RF company leaders were in the booth to answer questions about specific products, future plans and their decades of experience designing and delivering RF, microwave and mmWave semiconductors. With over 40+ GaAs and GaN MMICs from X-band to over 100 GHz, Altum RF featured several products at IMS, including new components for satcom, telecommunication (with E-band), radar, and test and measurement markets. Highlights included Altum RF’s E-band family of power amplifiers and LNAs support today’s demanding mmWave telecom and SATCOM applications by offering high output power and gain for longer-range links. The E-band PAs include an on-chip integrated power detector.

Product highlights:

• ARF1221Q2: 6 - 18 GHz LNA, 1 dB NF, QFN package
• ARF1224Q2:  DC -18 GHz LNA, 1.6 dB NF at 10 GHz, QFN package
• ARF1219Q2: 17.7 – 21.2 GHz LNA, 1.4 dB NF, QFN package
• ARF1120Q3: 15 – 24 GHz Driver Amplifier, 22 dBm Output P1dB, QFN package
• ARF1121Q3: 27 – 31 GHz Driver Amplifier, 22 dBm Output P1dB, QFN package 
• ARF1018: 71-79 GHz E-band Power Amplifier, 1.8 W Psat, Bare Die
• ARF1019: 81-86 GHz E-band Power Amplifier, 1.6 W Psat, Bare Die
• ARF1206:  71-86 GHz Low Noise Amplifier, 2.5-3.5 dB NF from 71-86 GHz, Bare Die.

Amphenol Microwave

Times Microwave Systems, SV Microwave, Micro-Coax, Q Microwave, XMA Corp. and Amphenol Printed Circuits converged at IMS, exhibiting together for the first time under the Amphenol Microwave banner. Visitors could find Amphenol Microwave at Booth #16054 in a 20 x 40 ft. island where all six business units were available to help engineers explore the full RF signal chain, enter to win a drone and catch a must-attend technical workshop in Room 154.

Beyond the booth, six of the industry’s sharpest RF minds came together on the IMS2026 workshop stage, and the topic could not be timelier: "Next-Generation RF Components: Strategies to Minimize Loss, Noise & Distortion" took place Thursday, June 11 from 1:30 p.m. – 3:10 p.m. in Room #154. This panel discussion presented one technical expert from each business unit for a deep dive into the strategies and component-level innovations that drive down loss, noise and distortion in today’s most demanding RF systems.

Analog Devices

 At the Analog Devices' booth, visitors explored how ADI was unlocking physical intelligence across increasingly complex RF environments, helping teams move faster from concept to deployment with confidence.

Across a broad set of live demonstrations, attendees learned more about wideband direct RF sampling, phased array beamforming, spectrum sensing, precision clocking, signal conditioning,  low noise power, and more. Together, these capabilities show how tightly integrated signal chains capture and translate complex real world signals into actionable insight.

ADI solutions are designed for system level integration, helping engineers push performance, efficiency, and scalability further. They address critical challenges, from maintaining phase coherence in dense multi channel systems to enabling frequency agility in dynamic spectrum environments, while laying the groundwork for emerging 6G concepts like integrated sensing and communication.

Anatech Electronics

At IMS2026, Anatech Electronics exhibited a range of RF and microwave components, including cavity and ceramic filters, lumped-element designs, duplexers, and multiplexers. The portfolio supports applications requiring defined bandwidth, low insertion loss, and high isolation across commercial, aerospace, and defense systems. Custom assemblies integrating multiple functions were also presented, reflecting ongoing demand for application-specific RF solutions.

Anristu

At IMS2026, attendees were able to see live demonstrations of the Tensor VNA, speak directly with Anritsu application experts and learn how the platform helps reduce measurement uncertainty, improve productivity and shorten development cycles.

The Tensor VNA represents a major advancement in RF and microwave network analysis, delivering modern, scalable architecture designed to support the most complete and demanding measurements like amplifiers, filters, frequency convertors (mixers – single stage and multistage), opto-electronics and other advanced VNA measurements.

Tensor VNA can support high frequencies from 54 to 220 GHz with Anritsu's small compact mmWave modules and at the same time perform waveguide banded measurements with most third-party vendors for higher frequencies up to 1.1 THz.

ATEK MIDAS

ATEK MIDAS showcased significant momentum at IMS with the introduction of 12 new products, drawing strong customer engagement and interest through live demonstrations. Highlights included advanced GaN-on-SiC power amplifiers and switches, high-IP2 LNAs engineered for superior linearity and low-distortion performance, and next-generation digitally tunable and switched MMIC filters—innovations that are already generating notable industry attention.

IMS also marked the launch of ATEK America LLC, reinforcing the company’s commitment to enhanced sales coverage and dedicated product support across North America.

To explore these innovations in more detail, visit the newly redesigned website at https://www.atekmidas.com and download the June 2026 Selection Guide.

CML Micro

Visitors to Booth #21082 had the opportunity to engage with CML Micro’s executive leadership, engineering, product management, sales and marketing teams to discuss emerging market requirements, system-level design challenges and next-generation RF application development. Throughout the event, Rob Smith, Product Line Director, hosted live demonstrations of CML Micro’s MMA-445933H-55 amplifier, highlighting its industry-leading linearity performance for demanding communications and high-reliability applications. 

CML Micro’s presence at this year’s event reinforced the company’s deep system level expertise in delivering high-performance RF and mmWave solutions, including RF gain blocks, GaAs/GaN power amplifiers, low noise amplifiers, ultra-linear amplifiers, synthesisers, modulators/demodulators and IF & RF transceivers. Its comprehensive portfolio enables engineers to simplify integration and accelerate development across demanding communications, mission-critical and high-reliability RF applications.

In addition to its established product portfolio, CML Micro provided visitors with an exclusive preview of four upcoming products, cementing the company’s continued investment in advanced RF technology. Scheduled for commercial release over the coming months, these new solutions further bolster the company’s growing RF and mmWave roadmap:

• CMX90A002 – a new compact RF amplifier optimised for maximum efficiency at a wide range of bias voltages from 1.9V to 4.5V and designed to simplify integration for IoT, smart metering and other high-volume, low-power applications.
• MMG-004030 – a high-performance distributed GaN amplifier delivering true wideband operation from below 1 MHz to 40 GHz, with significantly increased output power for instrumentation, electronic warfare and test applications.
• CMX90A301S5 – a next-generation compact linear GaN power amplifier with 10W of saturated output power optimised for MANET radios, mesh networking and advanced military communications systems.
• MWT-11F89 – a new SOT-89 packaged, high-linearity GaAs FET   with 1.5W output power, supporting long lifecycle aerospace and defence applications in one of the RF industry’s most popular, space-saving footprint.

Supporting applications ranging from military and tactical communications to broadband wireless infrastructure, satellite communications, industrial systems and advanced RF design, the solutions on display highlighted CML Micro’s position as a trusted partner for high-performance, mission-critical and mmWave system development.

Coilcraft

Our friends at Coilcraft displayed their broad range of wirewound RF and microwave-frequency inductors for commercial, industrial, automotive, military and space environments. They also showcased their new DFC7045 Series low-profile common mode chokes, 1210ETH Series common mode choke for automotive Ethernet applications, CMA Family automotive-grade common mode chokes, as well as their SLV Family power inductors for TLVR and AExxxPGA Family critical-grade power inductors.

ConductRF

Attendees could meet with the ConductRF team at Booth #16095 and explore their unique capability to deliver rapidly tailored flexible, semi-flexible, handformable and semi-rigid RF cable assembly solutions. Live, personalized demonstrations of their MAESTRO RF Cable Composer were provided. The company recently announced the launch of their new True VNA Precision Test Cables family offering high performance, ruggedized, flexible solutions operating to 120 GHz. They also shared their latest achievements in delivering extra-long length D38999 multi-signal harnesses and the latest capabilities of their engineering-driven MAESTRO™ RF Cable Composer.

Copper Mountain Technologies

Copper Mountain Technologies has their new patent-pending BFx-02 Frequency Extension Base in their booth at IMS. The BFx-02 streamlines and reduces the cost of mmWave S-parameter measurements. By replacing the need for a full-featured VNA in frequency extender setups, the BFx-02 delivers a unique, lower-cost approach to mmWave testing. The BFx-02 Frequency Extension Base can be paired with any frequency extender to anchor frequency extension setups.

Corry Micronics

At IMS 2026 in Boston, Corry Micronics highlighted its portfolio of high-performance RF and microwave solutions designed for aerospace, defense, medical, and test applications. The company showcased advanced RF filters, amplifiers, switches, and switch matrices engineered for demanding environments and mission-critical systems. Corry emphasized both commercial off-the-shelf (COTS) products and custom-engineered solutions, demonstrating its ability to deliver reliable, high-frequency components with strong performance, flexibility, and rapid development support for complex customer requirements.

CPI

CPI offers microwave products for radar, electronic warfare, industrial and scientific applications. While at IMS2026, CPI showcased several of its products and solutions centered around receiver protectors, limiters, integrated microwave assemblies, spark gaps, magnetrons, solid state power amplifiers, instrumentation amplifiers, transmitters, microwave power modules and power supplies. CPI enjoyed interacting with customers looking for solutions from CPI, meeting existing and new vendors as well as fostering new relationships.

Element Six (E6)

At IMS, Element Six's (E6) Thomas Obeloer was available to speak about chemical vapor deposition (CVD) synthetic diamond heat spreaders that deliver superior thermal management, enabling enhanced system performance, stability and device longevity. 

E6 is driving real momentum across the semiconductor ecosystem. Built for a world beyond thermal bottlenecks, its CVD solutions enable higher power levels and faster processes: 

• WSC^TM - Wafer single crystal diamond heat-spreaders to reduce cooling requirements in high‑powered devices 
• Cu-Diamond - a new high-performance copper-diamond composite for demanding thermal management applications 
• Diafilm^TM TM - CVD diamond for semiconductor thermal management solutions 
• ELSC^TM Series - Electronic grade diamond for detector and quantum technologies. 

Elite RF

Elite RF showcased its broad portfolio of RF amplifier modules and systems at Booth #16025 during IMS. The company is among the few U.S.-based manufacturers with the capability to develop RF power systems up to 200 kW and is actively collaborating with defense industry system integrators on high-power system programs. These developments over the past year have positioned the company at the forefront of advanced RF technology.

The new capabilities are designed to meet the increasing demands of 5G infrastructure, radar systems, satellite communications and electronic warfare applications requiring higher power density, wider bandwidths and long-term operational reliability.

Emerson 

Emerson launched its new, cost-effective NI Core VST, which combines a vector signal analyzer and a vector signal generator into a single instrument for calibrated RF measurements. The company also highlighted its recent NI CHESS platform for high-fidelity RF channel emulation and its NI USRP X420, a new software defined radio product for emerging research.

The new Core VST instruments — including the PXIe-5841 and PXIe-5820 — deliver calibrated, synchronized RF measurements in a modular platform optimized for speed, automation and ease of use. By combining high-performance RF capability with a more accessible price point, the enhanced NI VST portfolio now enables more engineering teams to adopt advanced measurement techniques earlier in development and then scale them up through production with consistency and efficiency.

The PXIe-5841 features 200-megahertz instantaneous bandwidth and a fixed FPGA configuration, providing a streamlined option for fast, repeatable measurements. Alongside the PXIe-5820, these instruments integrate with the NI RFmx measurement software to deliver validated results in a simple, interactive environment that supports more efficient workflows from signal generation through analysis.

Also on display was the the NI Channel Emulator System Software (CHESS) platform at the 2026 Space Symposium conference in Colorado, introducing a new software‑defined approach that enables aerospace and defense teams to validate mission‑critical RF links entirely in the lab — without the cost, risk or logistics of traditional field testing.

NI CHESS is a high‑fidelity RF channel emulation platform that works with NI PXI Vector Signal Transceiver (VST) hardware to recreate realistic, dynamic RF environments in real time. Purpose‑built for aerospace, satellite and defense communication systems, the platform allows engineers to test complex ground‑to‑orbit, ground‑to‑air and airborne links under controlled, repeatable conditions.

Attendees could also see a demonstration of the NI USRP X420, a software defined radio (SDR) designed to meet the demanding requirements of advanced radar systems, satellite communications and emerging 6G research.

The X420 expands the NI Universal Software Radio Peripheral (USRP) product line with frequency coverage up to 20 gigahertz. This opens access to higher-frequency spectrum including FR3, Ku, and X bands, supporting advanced applications such as multi-channel radar, non-terrestrial networks (NTN), and integrated sensing and communications (ISAC).

Enplas

Enplas lens antennas are compact, thin, high-gain RF lenses designed to efficiently focus and direct electromagnetic waves. Compared to conventional lenses, they can be made 1/2 to 1/3 thinner while achieving a gain of approximately 20 dBi. It enhances signal propagation, extending transmission range and improving sensing performance, providing a simple yet effective way to boost overall RF system efficiency. It has been confirmed to be compatible with wireless communication modules from several major suppliers. Operating in the mmWave and terahertz bands from 60 to 300 GHz, they are ideal for advanced applications such as 6G communications and high frequency sensing, and are intended for use in devices such as smartphones, robot arms, security systems and more.

Erzia

ERZIA showcased its latest high-performance RF and microwave solutions, including New Space commercial off-the-shelf (COTS) amplifiers. Highlights included space-qualified high-power amplifiers (HPAs) and low-noise amplifiers (LNAs) designed for LEO, MEO and lunar missions, along with integrated microwave assemblies such as custom subsystems, up/down converters, beamformers and filter banks. ERZIA also highlighted a recent milestone—the delivery of 216 New Space RF amplifiers for a LEO constellation program.

Falcomm

Falcomm has developed GaNdalph.ai: a tool for automatic power amplifier design in GlobalFoundries RFGaN1 process. GaNdalph.ai achieves a 20,000× reduction in design cycle time — from three months to five minutes — while matching the performance of senior RF architects with 15+ years of experience. Compared to junior-level baselines, automated outputs demonstrate 15–30% improvement in power-added efficiency. The framework generalizes across components including LNAs and ADCs, establishing a scalable foundation model for next-generation RF front-end design.

Filtronic

At IMS 2026 in Boston, Filtronic showcased its portfolio of advanced RF, microwave and mmWave technologies. The company highlighted solutions for aerospace, defense, telecommunications and space applications, including solid-state power amplifiers (SSPAs), DIFI-enabled RF digitization technology and high-frequency communications modules.

Finwave Semiconductor 

Finwave Semiconductor announced eight new high-power RF switches to deliver expanded power handling, higher frequency operation and ultra-low insertion loss to meet stringent SWaP-C requirements for modern aerospace and defense systems. These switches, which combine the performance advantages of GaN with the scalability and cost efficiencies of high-volume silicon manufacturing, were unveiled at IMS2026.

FMAX Technologies, Inc.

FMAX Technologies, Inc. showcased its next-generation 90 GHz sample-and-hold and time-domain reflectometry integrated circuits. FMAX’s upcoming 90 GHz devices leverage extensive in-house expertise with the Cadence EMX 2.5D electromagnetic solver, a key tool used across the RF-to-mmWave design community for high-accuracy electromagnetic modeling. Cadence highlights EMX as part of its advanced RF design suite showcased at IMS2026, underscoring its relevance for next-generation mmWave IC development. Attendees were invited to visit Booth #11047 to meet the engineering team and discuss sampling plans for Q4 2026.  

Guerrilla RF, Inc.

On display was Guerrilla RF's GRF5847 linear power amplifier (PA) module. As Guerrilla RF's flagship PA solution for the 4.4 GHz to 5.2 GHz band, the GRF5847 combines fully integrated 50-Ohm input and output matching with exceptional output power, efficiency and linearity in a compact surface-mount package.

Fabricated on a new InGaP HBT process and packaged in a compact 2.5 x 3.0 mm LAMM-12 package, the GRF5847 requires no external input or output matching components, enabling engineers to achieve best-in-class PA performance while minimizing board area, bill-of-materials cost, and overall design complexity.

Guerrilla RF also announced an expanded focus on the fast-growing Tactical Radio market. Backed by a broad portfolio that ranges from low noise small-signal devices to high-power RF amplifiers, Guerrilla RF now offers more than 60 high performance RFIC solutions designed to strengthen communications links by enabling highly sensitive receivers and efficient, high-power transmit paths that protect link margin and maintain mission-critical connectivity.

Covering a broad range of frequencies commonly deployed across tactical communications architectures, Guerrilla RF's portfolio supports applications that span the VHF, UHF, L-, S- and C-Band spectrums. These solutions are designed to address the demanding requirements of modern military communications networks, including the following mission-critical radios which operate within contested environments:

• Handheld / Personal Radios (walkie-talkies)
• Manpack Radios
• Vehicle-Mounted Tactical Radios (VMTRs)
• Airborne Radios
• MUOS Satcom Terminals
• Maritime / Shipboard Radios.

HYPERLABS 

HYPERLABS exhibited at booth 16019, where the company introduced its new TDR11100 Time Domain Reflectometer alongside its expanding portfolio of 0.8 mm components supporting operation up to 145 GHz. Designed to meet the increasing demands of RF and high speed interconnect environments, the TDR11100 delivers precise time-domain analysis for signal integrity characterization in ultrahigh-bandwidth systems. Attendees were invited to experience live, in-booth demonstrations showcasing these capabilities in real world measurement scenarios. 

Also featured at IMS was HYPERLABS’ 8800 Series of ultra-broadband components, including DC Blocks, Attenuators, and a Balun, each utilizing 0.8 mm connectors and validated for performance up to 145 GHz. First previewed earlier this year, these components have already gained strong industry recognition for enabling accurate measurement and validation beyond 110 GHz. 

Indium Corporation

At IMS2026, booth 21054, among its featured products, Indium Corporation showcased:

• AuLTRA^® 75 is an off-eutectic AuSn preform solution (75 Au/25 Sn) designed to improve intermetallic reliability in applications using a die with a thick gold plating, such as a GaN die used for high frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA^® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA^® product line also comes in 78 Au/22 Sn and 79 Au/21 Sn compositions.
• AuLTRA® DA0001 offers the new gold standard—the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
  • Highly accurate thickness control
  • Precise edge quality
  • Optimized cleanliness
  • Default waffle pack method
  • Available for gold-based alloys.

Additionally, Indium Corporation featured the following gold-based die-attach solutions:

• AuLTRA^® ThInFORMS^® are 0.00035"-thick (0.00889 mm or 8.89 μm) 80 Au/20 Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA^® ThInFORMS^® help combat common issues such as shorting and poor thermal transfer.
• AuLTRA® Fine Ribbon is the company’s Indalloy^®182 fine-grade precision ribbon for high volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance, along with long continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process, resulting in a high-quality end product and a lower cost of ownership.
• AuLTRA^® 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste, optimized to handle the elevated processing temperatures of gold-based alloys. Perfect for high-power LED module array assemblies, it ensures consistent and repeatable printing performance, featuring a long stencil life and excellent tack. Along with consistently meeting printing and reflow demands, AuLTRA^® 3.2 delivers superb wetting and low voiding.
• AuLTRA^® 5.1 is a no-clean AuSn solder paste, specifically formulated to endure the higher temperatures required by Au-based alloys. Ideal for high-power LED module array assemblies, this formulation provides a broad processing window and consistent print definition, even for ultra-fine pitches. Additionally, AuLTRA^® 5.1 excels in wetting performance and void minimization, while meeting rigorous printing and reflow standards.

Insulated Wire

IW showed their extreme low loss cables and assemblies, Re-Flex — the ultimate hand-formable cable and high RF power coaxial cables. IW products meet the requirements of a wide range of applications such as aerospace, space, medical, defense and telecommunications. Of note at the exhibition was the 1 mm cable assemblies using their series of precision low loss coaxial cables, engineered for superior performance in high-frequency applications and operating seamlessly up to 110 GHz. This series stands out for its advanced material and design choices, making it a premier solution for applications requiring high precision and minimal signal loss. Visitors to the IW booth were also be able to collect four new product brochures.

Integra Technologies

Attendees were invited to visit Integra at Booth #21029 to experience the latest breakthroughs in high-power RF technology. Extending its lead in high performance RF power, Integra showcased two of its latest industry first products: 10 kW 150 V HV GaN/SiC transistor operating at UHF and a10 kW 150 V HV GaN/SiC transistor operating at UHF L-Band — new performance standards that redefine what is possible for solid-state vacuum electron device replacements and other applications.

Integra's booth also featured its latest generation of RF pallets — solutions engineered to solve the most demanding RF high-power challenges across UHF, L-band, S-band, C-band and beyond. These plug-and-play pallet platforms reduce design time and accelerate time-to-market, making them the go-to choice for OEMs designing high performance radar, scientific, avionics, industrial, air traffic control, medical systems and high-power microwave/directed energy systems.

Rounding out the exhibit, Integra highlighted its HV GaN/SiC pallet-amplifiers with integrated digital control — an advanced platform that puts intelligent monitoring, control and protection capabilities directly in the hands of system designers. By combining the power density of HV GaN/SiC technology with digital control interfaces, these pallet-amplifiers unlock a new level of integration, efficiency and operational flexibility for demanding microwave system applications.

International Manufacturing Services, Inc. 

International Manufacturing Services, Inc. (IMS) exhibited with a variety of its high frequency components ideal for use in broad temperature ranges. Showing component solutions such as miniature resistors and temperature-variable attenuators (TVAs), IMS welcomed visitors to Booth #12059 with advice and guidance on how to achieve stable high-frequency performance over wide operating temperature ranges. 

Among their product lines on display, the TFI chip resistor series has been extended to 67 GHz, available in compact 0201 and 0402 packages for use in the densest PCBs and circuit assemblies. And for attenuation that remains consistent across wide temperature ranges, IMS’s thin-film TVAs provide carefully designed attenuation versus temperature from -40°C to +125°C to help balance the amplitude versus-frequency responses of high frequency systems over wide operating-temperature ranges and adverse operating conditions.  

Visitors could learn more about the TVAs by visiting the booth or by attending a MicroApps presentation by IMS Applications Engineering Manager, Wes Laquerre: “Demystifying N: Improving Temperature-Variable Attenuation Selection by Modeling Temperature Reduction.” The technical presentation explored how TVAs can stabilize electronic performance even in challenging aerospace, maritime, and terrestrial systems operating to 20 GHz and higher.  

Junkosha 

At this year's IMS event, Junkosha launched a new product, its MWX009 Microwave/mmWave Coaxial Cable Assembly. The MWX009 has been developed to support broader probe system applications as the industry transitions toward higher-frequency testing infrastructure. This new solution is expected to address growing market demand for advanced probe system measurements using 0.5 mm and 0.8 mm connector interfaces.

The demand for data bandwidth is driving communication research into the D-band. With this, systems require specialized D-band probe stations and vector network analyzers (VNAs) to characterize channel behaviors and antenna modules at what are extreme frequencies. As such, engineers are increasingly requiring cable solutions that maintain signal integrity for higher-frequency probe setups beyond the current industry norm of approximately 145 GHz, that can reliably provide accurate measurement for testing and validation.

The MWX009 is positioned as a response to this shift, supporting emerging 0.5 mm and 0.8 mm interface requirements and enabling operation up to 190 GHz for 0.5 mm and up to 167 GHz for 0.8 mm.

K-PA Inc.

K-PA Inc. (Korea Power Amplifier Innovator), a specialized RF semiconductor company, exhibited at Booth #24016, K-PA introduced its latest X-Band Gallium Nitride (GaN) Monolithic Microwave Integrated Circuit (MMIC) portfolio, headlined by its revolutionary integrated single-chip front-end module designed to redefine active electronically scanned array radar architectures. 

Alongside this breakthrough innovation, K-PA will showcase its fully production-ready high-power amplifiers and introduce its official Custom GaN MMIC Design Service, offering global defense and aerospace OEMs a unique combination of cutting-edge tech, secure volume supply and flexible tailoring. 

Keysight Technologies

At IMS2026 booth #19035, Keysight featured three interactive solution zones:

Simulate Cutting-Edge RF Designs

Design faster, explore more, and optimize RF systems earlier in the workflow.

Featured demonstrations include:

• Transform RF Designs with AI – Demonstrates how AI-driven workflows automate RF design tasks, accelerate optimization, and improve design reuse across complex RF systems.
• Accelerate Quantum Design – Showcases unified quantum circuit, EM, and system simulations that streamlines superconducting qubit development and reduces costly test iterations.

Emulate Real-World RF Environments

Create realistic RF environments to uncover issues before deployment.

Featured demonstrations include:

• Turn Signal Complexity into Clarity – Demonstrates how advanced signal analysis accelerates spurious searches, spectral analysis, and MIMO evaluation in congested RF environments.
• Master High-Performance Signal Analysis – Showcases how wideband signal analysis enables high-speed validation of emerging V-band, satellite, and 6G waveforms.
• Unlock Sub THz Device Characterization up to 250 GHz – Demonstrates sub-THz (250 GHz) four port differential measurements for precise AI hardware characterization in a single sweep.

Validate Complex RF Systems

Verify performance with confidence across increasingly complex RF architectures.

Featured demonstrations include:

• Generate High-Fidelity Signal Generation – Demonstrates ultra-low phase noise and fast-switching signal generation for advanced 5G, 6G, NTN, and radar applications.
• Push PNT Systems to Their Limits – Features realistic PNT emulation that validates GNSS and complementary PNT systems under complex real-world conditions.

Keysight also demonstrated a new capability within its RF Circuit Simulation Professional software which enables engineers to capture their design process on an executable whiteboard. It replicates the engineer’s decision process, capturing simulations, optimizations, decision trees, and design parameters built on prior analyses. Each step generates editable Python code that can be saved, shared, and redeployed across Keysight Advanced Design System (ADS), Cadence Virtuoso and Synopsys Custom Compiler environments. 

KRATOS General Microwave

KRATOS General Microwave’s SGA/SGN Series SSPAs offer GaAs/GaN technology reliability that can be customized to meet specific pulse or CW output powers. The product line supports both X-Band and Ku-Band applications with bandwidths up to 10 percent and offers peak power outputs up to 400 W. Designed for demanding defense, aerospace and satellite communication applications. General Microwave SSPAs have excellent power efficiency with demonstrated field-proven performance and reliability. General Microwave’s vertical integration process affords flexible layouts and architectures to meet individual specifications for electrical, mechanical and environmental parameters.

KYOCERA AVX

KYOCERA AVX exhibited at IMS2026 at booth #16075, showcasing a variety of capacitors, couplers, filters, antennas, inductors and resistive products engineered for high-frequency, ultra-low-loss, and high-density performance in 5G, 6G, and IoT applications and stable, high-reliability, mission-critical performance in aerospace, defense, radar and satcom applications.

KYOCERA AVX IMS2026 Exhibit highlights included:

• RF and microwave capacitors designed and manufactured for optimal performance in RF (3 kHz – 1 GHz), microwave (1–300 GHz), optical, and high-RF-power applications extending throughout the consumer, commercial, industrial, telecommunications, automotive, military, aerospace, space, and medical industries — including the newly expanded range of 550/560 Series ultra-broadband capacitors, which are built to satisfy surging cross-market demand for high-speed, high-bandwidth optical communication systems
• Thin-film directional couplers, like the DB0402 3 dB 90-degree hybrid couplers, that leverage advanced multilayer technology to deliver elite high-frequency performance — including low insertion loss, high isolation, seamless signal distribution, and superior directivity — in a rugged, ultra-compact footprint and support reliable automatic assembly
• EMI, lowpass, highpass, bandpass and feedthrough filters engineered to unlock superior performance across RF and microwave frequencies in applications with demanding precision, size, and reliability criteria — including BP1206 and BP2816 Series Thin-Film Band-Pass Filters, which deliver highly repeatable and reliable RF performance in a wide range of high-power telecommunications, military, aerospace, medical, and consumer electronics applications with crowded PCBs
• Antennas optimized to facilitate wireless connectivity in a wide variety of applications extending throughout the automotive, industrial, IoT, consumer, medical, transportation, and networking industries — including high-reliability standard and ultra-small chip antennas rigorously tested to AEC-Q200 requirements, such as the A-Series all-in-one (LTE, GNSS, and NTN) embedded automotive broadband antennas and 2.4 GHz automotive corner chip antennas.
• RF and microwave inductors engineered to deliver optimal efficiency, precise impedance control, and superior space savings, reliability, signal integrity, and low-loss performance in critical high-frequency telecommunications, aerospace, defense, and high-speed data systems
• Attenuators, resistors, and terminations designed to optimize circuit performance, improve energy efficiency, and exhibit exceptional accuracy, stability and reliability in a wide range of industrial, automotive, consumer electronics, and medical applications.

MathWorks 

MathWorks highlighted a digital twin capability at the IMS. The capability integrates validated RF hardware models from global semiconductor leader Analog Devices, Inc. (ADI) into system‑ and mission‑level simulation, enabling earlier design and verification of complex radar and satellite communication systems.

ADI’s RF and phased-array product portfolios support system-level design and verification of complex radar and satellite communication systems. Building on longstanding technical work together, integration with ADI products enables engineers to assess architectural trade-offs and performance earlier in the design cycle, before the hardware configuration is finalized.

Through their joint efforts, MathWorks and ADI enable RF digital twins that combine hardware models with system-level simulation, allowing engineers to analyze end-to-end behavior and understand how RF impairments affect higher-level outcomes, such as detection performance or link reliability.

MathWorks highlighted its collaboration with ADI during a technical workshop and a joint RF Systems Pavilion demonstration with Leonardo. The workshop, “Reconfigurable Wideband Phased Arrays for mmWave: System Design and Verification Across Radar and Wireless Domains,” demonstrated how measurement and behavioral modeling techniques connect hardware prototypes with digital twins to evaluate architectural trade-offs and performance-optimization strategies for 5G/6G links and active electronically scanned array radar systems. Attendees could also visit the RF Systems Pavilion, booth 20088, to see “Modeling the Future: RF Systems Powered by Simulation” that ran throughout the exhibition with continuously looping simulation content and daily live sessions—an opportunity to engage directly with experts from MathWorks, ADI, and Leonardo as well as learn how digital twins enable earlier system- and mission-level verification before committing to hardware. 

MathWorks Technical Marketing Manager, RF & Mixed Signal, Giorgia Zucchelli delivered a technical keynote on Tuesday, June 9, “RF Digital Twins: Trading-off Fidelity and Performance Across Models, Simulation Tools, and Hardware Measurements.” The presentation discussed methodologies for characterizing beamformers, front-end modules and other RF components through both measurement and simulation. Zucchelli demonstrated techniques for validating model accuracy in system-level design contexts, using a highly programmable wideband mmWave beamformer as a practical example, with a focus on end-to-end design and simulation for radar applications.

MECA Electronics

At IMS2026, MECA Electronics celebrated its 65th year of offering solutions for the ever-changing RF/microwave industry’s needs. Highlighting their Hi-Rel “ML Series” process for COTS+, the latest 2 to 8 GHz Wilkinson power dividers in addition to the broad lineup of passive coaxial products developed over the last sixty-five years. Offering products ranging from commercial to modified COTS and fully custom solutions.  

MegaPhase 

MegaPhase Phase3™ Space Cables deliver exceptional RF and microwave performance for demanding space applications up to 67 GHz. Engineered to withstand extreme environmental conditions, these cables feature phase-stable performance, low outgassing characteristics (TML ≤ 1 percent, CVCM ≤ 0.1 percent) and multipaction-free operation in vacuum environments. Qualified to meet ESCC 3408 space standards, Phase3 cables incorporate vented connectors and rugged mechanical construction for mission-critical reliability. With shielding effectiveness of -110 dB minimum, operating temperatures from -65°C to +200°C and multiple cable sizes available, Phase3 provides the performance, durability, and consistency required for today's advanced satellite and spaceborne systems.

Menlo Micro

Menlo Microsystems Inc. announced a broadband RF switching platform that covers DC to 70 GHz which extends switching performance into the bandwidths required for silicon photonics high-frequency test systems, where traditional switching technologies face significant performance limitations. The core of the new MM5800 platform is a high-performance SPDT micro-mechanical switch based on Menlo Micro’s Ideal Switch® technology, designed for microwave and millimeter-wave applications requiring low loss, high linearity, and high-power operation. 

Microchip Technology

In Booth #1907, Microchip exhibited with demos showcasing their RF/MW solutions across the signal chain including power management and timing:

• Global Navigation Satellite System Disciplined Oscillator (GNSSDO) provide ultra-low phase noise performance in applications like radar, test & measurement
• Embedded Atomic Clock
• GaN on SiC Monolithic Microwave Integrated Circuits (MMIC) Power Amplifiers
• Voltage-Controlled SAW Oscillators (VCSOs).

Microchip also announced the release of the TimePictra^® 12 platform, a major software upgrade to its synchronization management software designed to help critical infrastructure operators manage advanced timing architectures with greater visibility, automation and control. The new version delivers a redesigned graphical user interface (GUI), expanded automation capabilities and enhanced support for the latest high‑accuracy timing technologies.

As telecom, power, transportation, data center and other critical infrastructure networks evolve, operators are increasingly deploying more sophisticated synchronization architectures to improve resilience, reduce dependence on GNSS and maintain precise clock alignment across distributed environments. The TimePictra 12 platform addresses these requirements with enhanced capabilities for managing high-accuracy time transfer (HA-TT) connections, monitoring GNSS observables using Microchip’s BlueSky™ technology and maintaining clock alignment using SkyWire™ technology.

Microsembly

Microsembly exhibited at Booth 11015 this year. Engineers, program managers and procurement leaders were invited to the booth to connect with Microsembly's team and explore how the company supports RF and microwave hardware programs across commercial, defense, medical, industrial and research applications.

MilliBox

MilliBox introduced the Fast Synchronized Trigger (FST) feature for its GIM04 and GIM05 modular positioner series. FST accelerates the capture of 3D antenna radiation patterns. FST is demonstrated at IMS in the most compelling OTA setup. The setup shown consists of MilliBox MBX32CTR Compact Antenna Test Range (CATR) with the positioner GIM04F-300EV equipped with FST; the new Copper Mountain Technologies Frequency Extension Base BFx-02 and a pair of the new Virginia Diodes VNAX TxRx WR-10 frequency extenders for W-band in their M2 form factor ideal for 3D OTA captures. This demonstration shows an accelerated live capture of an AUT operating from 75 to 110 GHz.

MilliBox demonstrated the usage of MBX32R with fixed, moving and simulated radar targets illustrating practical radar performance testing scenarios. This setup consisted of MBX32 compact benchtop anechoic chamber with WLL09 instrumented wall, GIM04H-300X, 3 Axis antenna positioner, stationary trihedral corner reflectors and Eravant STR-793-12-D1 77 GHz radar target simulator. This demonstration highlighted the versatility and modularity of MilliBox Radar Test Systems for everyday radar characterization and tuning in mmWave and sub-THz domain.

MilliBox showcased its best value MBX02K antenna test system when used in broadband configuration using the Anritsu ME7838 VectorStar VNA operating from 14 GHz to 110 GHz measuring a dual ridge antenna from Eravant. This demonstrated the versatility of MilliBox system for a wide variety of frequencies and applications. The system collects 97 3D radiation patterns in a single sweep covering an unprecedented 97 GHz spectrum at once.

MilliBox also cooperated with Cornes RF Engineering to create an economical CATR solution for Ka-Band and V-Band. This original system uses the best of both company technologies to create a highly innovative solution for daily antenna radiation pattern capture.

This product was featured in a live demonstration in Cornes RF Engineering booth 11057 during IMS.

Mini-Circuits

Visitors to Booth 19054 experienced live demonstrations highlighting how Mini-Circuits is extending its RF, microwave and millimeter-wave expertise into some of the industry’s fastest-growing and most technically demanding applications, including quantum computing, satellite communications and automotive systems.

One of the featured demonstrations at the Mini-Circuits exhibit was a fully functional S-band up-converter system built entirely with Mini-Circuits MMICs and supporting components. The system build incorporates a first look at the company’s inaugural GaN MMIC amplifier design, scheduled for release later this year. The display will also unveil a new 1×1 mm QFN-style SMT package, the smallest footprint form factor available for plastic-encapsulated MMIC devices of its kind currently available on the commercial market.

The demonstration highlighted Mini-Circuits’ continued investment in expanding its monolithic microwave integrated circuit portfolio and delivering higher-performance solutions for demanding RF and microwave applications.

As quantum computing research advances from laboratory experimentation toward practical implementation, Mini-Circuits continues to expand its portfolio of RF and microwave components and technologies designed to support quantum systems. IMS attendees had an opportunity to learn about the company’s growing solution set for quantum computing applications and review recent research efforts focused on enabling practical quantum architectures.

Building on the recent introduction of more than 70 AEC-Q200-qualified products, Mini-Circuits highlighted its expanding portfolio of components designed to meet the performance and reliability requirements of automotive applications. These solutions leverage decades of expertise in RF and microwave technology while supporting emerging opportunities in connected, autonomous, and advanced electronic vehicle systems.

The Mini-Circuits exhibit also featured:

• Live measurements of advanced uCeramIQ® technologies, including high-rejection filter designs and substrate integrated waveguide (SIW) filters implemented on LTCC platforms, ultra-wideband balun transformers, high-power directional couplers and a new family of fixed attenuators designed for cryogenic operating environments.
• Hands-on demonstrations of the company’s latest portable power sensors and signal generators, including a preview of redesigned GUI software designed to improve efficiency and functionality for test engineers and operators.

In addition to its technology demonstrations, Mini-Circuits once again hosted its popular IMS Photo Booth, a longstanding tradition and gathering place for engineers, customers, partners and industry colleagues attending the symposium.

mmWave Test Solutions

mmWave Test Solutions introduced the OMNI3, a high-level motion engine and command interpreter engineered from the ground up for antenna positioning. As an evolution of the current controller, the OMNI3 adds significant functionality while keeping automation programming straightforward. There is no SDK, API or PC-OS-Python latency involved — just high-level ASCII commands over Serial-over-USB, compatible with Python, LabVIEW, C#, MATLAB or a plain terminal. The non-blocking architecture runs asynchronous, synchronous and continuous motion together. Axes can run alone, together, or coordinated to start and land in sync, while the controller deterministically handles all timing for measurement accuracy.

Mouser Electronics, Inc.

Mouser representatives were at Booth #18017 to discuss top technologies, new ideas, trends and RF solutions. Engineers could find inspiration for their next project with the newest products on display from Mouser's vast line card of over 1,200 manufacturer brands. Attendees can also discover the distributor's informative eBooks and technical resource hub. Visitors to the booth can sign up for Mouser's newsletters and new product emails, which provide exclusive technical information to support projects and help achieve a speed-to-market advantage. Patrons can also try their luck at Mouser's Forbidden Places game for a chance to win an exciting prize. 

Narda-MITEQ

The Narda-MITEQ team announced the release of several new products and product enhancements unveiled this week at IMS2026. These additions further expand the company's portfolio of high-performance RF and microwave solutions specifically focused on the exciting markets of space and cryogenic related activity. For those who attended IMS, thank you for visiting the Narda-MITEQ booth and spending time with the team to learn more about these new products and capabilities. As part of its continued efforts to meet the requirements of new and emerging demand, these passive and active component new product introductions demonstrate Narda-MITEQ's commitment to delivering innovative solutions backed by proven manufacturing capacity and production readiness.

Northrop Grumman

Northrop Grumman has built a new Gallium Nitride (GaN) chip that sets a new standard of performance for military and commercial use. The chip fully leverages the W-Band spectrum, a range of very fast radio waves that help microchips send and receive more detailed information. Developed and market-ready in under six months, this breakthrough lets military radar systems send secure data wirelessly and quickly through satellites, while also supporting the next generation of 5G/6G connectivity.

The chip acts like a tiny, superefficient “brain” that strengthens wireless signals—making them clearer and faster—providing the military with secure communications and letting everyday devices enjoy quicker, more reliable connections. Its compact and low-cost design replaces bulky, power-hungry gear and helps keep the country ahead in next-generation wireless technology.

Nuvotronics

Nuvotronics demonstrated advanced RF and mmWave technologies designed for next-generation communications, radar and electronic warfare applications. Featured products include RF filters, multiplexers, switched filter banks, couplers, wideband antennas, RF packages and crossovers operating across the 1–100 GHz spectrum. The company also highlighted StrataWorks™, its online RF filter design platform, and Integrated Multi-Function Solutions that streamline development and support rapid transition to production.

Pickering Interfaces 

Pickering Interfaces showcased its broad portfolio of RF and microwave signal switching solutions at IMS. Visitors to booth 14104 saw how Pickering’s COTS, configurable and turnkey switching platforms support scalable RF and microwave test systems for applications ranging from aerospace and defense to communications, semiconductor and automotive test.

Pickering will also demonstrate its Microwave Switch Design Tool, part of the company’s recently released Test System Architect graphical toolset. The free online tool enables engineers to graphically design, configure and simulate RF and microwave switching systems, specify components such as relays, attenuators, connectors and cables and share designs with colleagues or Pickering engineers for evaluation before manufacturing.

At IMS, Pickering will highlight its RF & microwave switching solutions, including:

• Standard COTS RF & microwave switching solutions – PXI and PXIe modules with bandwidths up to 110 GHz, including SPDT, transfer, multiplexer and matrix options, supported by PXI, PXIe and LXI/USB chassis.
• Flexible RFIU switch platforms – User-specified microwave switching solutions available in PXI and LXI formats, supporting high-performance microwave relays up to 110 GHz at 50 Ω impedance and up to 2.5 GHz at 75 Ω impedance, with a range of front-panel connector options.
• Turnkey RFIU switch & signal routing subsystems – Custom LXI microwave switch subsystems designed to meet unique test requirements while supporting long-term system compatibility.
• Test system design software – Pickering’s Microwave Switch Design Tool, part of Test System Architect, which enables engineers to design, simulate and model flexible PXI and LXI microwave switching systems.

Piconics

Piconics just wrapped up participation in the 2026 IEEE International Microwave Symposium (IMS2026), one of the world's premier events for RF, microwave, and millimeter-wave technologies. With industry leaders, researchers, engineers, and innovators from around the globe Piconics showcased its extensive range of high-performance inductors, RF coils, chokes, and custom magnetic components for aerospace, defense, telecommunications, medical, and industrial applications. The event provided valuable opportunities to engage with customers, partners, and industry professionals, discuss emerging technology trends, and demonstrated the company's commitment to delivering reliable, high-quality solutions for advanced electronic and communication systems.

Pico Technology

Pico Technology announced the new PicoScope 5000E Series oscilloscopes, a new family of compact, USB-C oscilloscopes for engineers. Addressing the need to measure sensitive, low-amplitude signals and move quickly between analog, digital and mixed-signal debugging. The PicoScope 5000E Series delivers true 16-bit resolution with bandwidths up to 200 MHz, sample rates of 2.5 GSPS and 1 GS capture memory. The PicoScope 5000E Plus Series models add a switchable 8-bit high-speed mode with bandwidths up to 500 MHz, sampling rate of 5 GSPS and 2 GS of deep memory, giving engineers the advantage of a high-resolution precision oscilloscope and a faster 500 MHz debug oscilloscope in one portable instrument.

The PicoScope 5000E Series oscilloscopes are available as 4-channel or 4 + 16 channel mixed-signal oscilloscope (MSO) variants. The standard PicoScope 5000E Series is available in 60, 100 and 200 MHz bandwidth models. The Plus models expand this offering, available in 60/200 MHz, 100/350 MHz and 200/500 MHz models (reflecting their dual 16-bit/8-bit bandwidth capabilities, respectively).  

Planar Monolithics (PMI)

At IMS 2026, PMI showcased its extensive portfolio of RF, microwave, and millimeter-wave components and subsystems for defense, aerospace, electronic warfare, and communications applications. The company highlighted high-performance frequency converters, synthesizers, amplifiers, switches, integrated microwave assemblies, and other solutions designed for demanding mission environments. PMI emphasized its capability to provide both standard and custom-engineered products, supporting customers with advanced design expertise, rapid development, and reliable manufacturing for complex RF systems operating across a wide range of frequencies.  

pSemi 

pSemi showcased their latest RF innovations engineered to deliver the performance, reliability and efficiency required for today’s most advanced applications in booth 17090. 

Visitors to the booth explored solutions for: 

• Mobility & Cable Broadband 
• General Purpose RF Switches 
• Wireless Connectivity 
• Test & Measurement 
• LMR & Satcom 
• Broadband Switches 
• High Power RF Switches 
• Wireless Infrastructure. 

Q-Tech Corporation 

Q-Tech announced the launch of its next-generation QT25HF Lamb Wave Oscillator (LWO) and QT25VHF Voltage-Controlled Lamb Wave Oscillator (VCLWO), which are purpose-built to deliver high stability and ultra-low phase noise at radio frequencies from 400 MHz to 1.3 GHz. Engineered to outperform typical SAW-resonator solutions, the new QT25 LMO family provides tighter frequency stability across temperature, enabling designers to push high frequency performance and reliability in severe environment aerospace, defense, and industrial applications in a compact drop-in package. Compared with typical SAW stabilities of 250 ppm over -40°C to +85°C, the QT25 LMOs offer an order of magnitude better frequency stability dramatically improving system performance.

Product highlights include:

• Frequency range: 400 MHz to 1.3 GHz, optimized for low phase-noise high-frequency applications with the temperature stability of crystal oscillators
• QT25HF LWO stability: ±50ppm over -55°C to +125°C, as tight as ±20 ppm over −20°C to +70°C, operates in demanding environments
• Noise performance: Phase noise floor of -168 dBc/Hz supports cleaner spectral purity and lower jitter in sensitive RF chains
• The calculated integrated RMS jitter for a 500 MHz SAW or LWO based on their published phase noise is 8.08 femtoseconds
• Precision design: Provides great stability at much higher frequencies than standard crystal oscillators, making it ideal for applications where size, efficiency and thermal robustness are critical.

QML Inc.

For more than 50 years, QML Inc. has been a global leader in precious metal refining and reclamation, supporting high-performance industries with critical material recovery solutions. QML recovers gold, silver, platinum, palladium, rhodium, iridium, and ruthenium from complex components and advanced manufacturing byproducts.

From its secure, environmentally responsible facility in North Smithfield, RI, QML delivers precise, reliable recovery programs tailored to the demands of RF, microwave, semiconductor, and electronics applications.

Qorvo

At the center of Qorvo’s IMS presence, in booth 20036, were six live, in-booth demonstrations, marking the return of hands-on system demonstrations that showcase innovation across mmWave and Wi-Fi connectivity, SATCOM beamforming, IoT long-range amplification, 5G FWA, advanced filtering and spectrum control and GaN-based radar systems. Qorvo also highlighted its Elite360℠ Foundry & Services, a comprehensive offering that combines trusted U.S.-based manufacturing, advanced RF semiconductor technologies, packaging expertise and space product screening to support mission-critical applications.

Qorvo played an active role across IMS and the RFIC Symposium, including:

• Multiple technical paper presentations across beamforming, GaN, filtering and system integration
• A featured SATCOM & NTN workshop, addressing next-generation satellite communications
• Partnered demonstrations across the show floor, highlighting real-world system integration.

Qorvo’s new QPC6144 is a SP4T wideband switch that delivers greater than 65 dB isolation in a single device was showcased at IMS. Complementing this capability, the QPC6122 (SP2T) and QPC6188 (SP4T) provide wideband absorptive switching across 50 MHz to 10 GHz, enabling a single platform approach to RF routing. These devices reduce component count and simplify design while maintaining low insertion loss and strong linearity across wide bandwidths for calibration paths, general signal routing and multi-band operation.

Qorvo also showcased a new portfolio of silicon-on-insulator (SOI) RF switches and digital step attenuators designed for defense, aerospace and infrastructure customers. This new portfolio simplifies RF system design, reduces BOM complexity and accelerates integration in wideband systems. These new solutions address growing system demands for broader frequency coverage, agile signal routing and simplified integration — without the complexity of legacy GaAs-based RF control component approaches or multi-vendor RF control chains. 

Qorvo introduced an X-Band radar front-end solution, the QPF5012, that enables defense system designers to achieve higher performance without increasing size, weight or prime power. Designed for modern phased array and multifunction sensors, the solution combines transmit power, efficiency and receive sensitivity in a single compact module, addressing key challenges in next-generation radar design.

RapidRF

RapidRF featured its Circuit Studio AI-native design environment, powered by HeaviMind, an RF-intuition AI that enables a pipeline-based automated RFIC development flow. Transparent, interactive, and engineer-controlled from spec to tapeout-ready GDSII output. Circuit Studio is continuously evolving: future releases will let engineers define custom automation routines for any circuit type, including VCOs, switches, and beyond.

Reactel

Attendees could stop by booth 15018 to speak with the Reactel team, including Engineering Manager Ray Hashemi and Business Development Engineer Jim Assurian, author of the well-read Maryland Filter Guy blog. While visiting with the Reactel team, attendees could pick up the new Short Form Catalog for an overview of their extensive filter portfolio. Bandpass, lowpass, highpass and notch filters are available in an array of topologies such as tubular, LC, cavity, waveguide, ceramic and suspended substrate. Application-specific multiplexer and multifunction assemblies are available as well.

Remtec

During IMS 2026 in Boston, Mass., Remtec (Booth # 22078), showcased innovative and advanced printed circuit ceramic substrates and microelectronic assembly solutions for high-performance electrical and electronic applications. The company highlighted its expertise in Alumina, BeO, and Aluminum Nitride ceramic technologies, which provide strong thermal management, reliability, and electrical performance in demanding environments. Remtec presented its proprietary Plated Copped on Thick Film (PCTF®) technology, designed for RF, microwave, and power electronics applications serving aerospace, defense, telecommunication, and industrial power industries worldwide.

RLC Electronics

IMS2026 in Boston was a great success for RLC Electronics! RLC showed off several Quantum Computing items including tubular lowpass filters and highpass filters, as well as their 12-way filter block. RLC continues to expand its portfolio of coaxial filters designed to support quantum systems. The company also showed off its full arsenal of Electromechanical switches, ranging from SPDT to SP12T and DC to 65 GHz, all designed and made in the USA. RLC enjoyed reconnecting with customers, suppliers, competitors, and friends from across the RF and microwave industry. Throughout the show, visitors stopped by the RLC booth to learn more about our electromechanical switches, filters, and the broad range of passive components RLC supplies. 

Rohde & Schwarz

This year at the IMS2026, the Rohde & Schwarz team showcased at booth #14035 the company’s latest innovations. In addition, Rohde & Schwarz showcased updates for its R&S FSWP, the industry reference for phase noise testing. Besides a frequency range extension up to 56 GHz, the phase noise analyzer’s capabilities have been expanded for additive and residual phase noise measurements and the support of external high-end sources as local oscillators.

The R&S ZNB3000 was also in the focus at the company’s booth. The VNA family set a new benchmark for general purpose vector network analyzers by combining high measurement speed and precision with exceptional RF performance with frequencies ranging from 9 kHz to 54 GHz. Now, the R&S ZNB3000 provides an economical solution for applications that extend to waveguide banded frequency ranges up to 330 GHz, combined with the respective mmWave converters like the R&S ZCxxx, as well as third party converters.

The newly released R&S BBA300 broadband solid-state amplifiers deliver up to 90 W in frequencies ranging from 380 MHz up to 18 GHz in a single 4U instrument. The R&S BBA300-DE500 and R&S BBA300-DE1000 models now cover power requirements of 500 W and 1,000 W over a frequency range from 1 to 6 GHz without band switching.

This year, Rohde & Schwarz built on its popular 2025 IMS solution partner passport challenge with the 2026 VNA Applications Passport. Participants learned about the many applications of their versatile VNAs by visiting some of their many solution partner booths.

Sage Instruments 

In Booth 11083, Sage Instruments presented new SDR topology that provides unparallel spectrum analyzer performance, full decode and IQ capture. 

Samtec 

In their booth, Samtec showcased the new Bulls Eye® BE130 high-performance coaxial cable assembly for test and measurement up to 130 GHz. The BE130 assembly is equipped with Samtec Nitrowave LL130 RF coaxial cable that is optimized for stability during flexure, keeping measurements accurate during test setups. Samtec also included demos featuring its proprietary glass core technology (GCT) that is used to create advanced RF solutions, including launches, RF components, and filters, to address next-generation connectivity challenges up to 170 GHz.

San-tron

San-Tron was in booth #20016 and has been manufacturing coaxial connectors for over 70 years. The company showcased its new generation of Field Replaceable Connectors which are designed as “outside‑the‑box” interconnects that mount directly to the PCB via replaceable flange hardware, enabling connector removal and replacement without inducing mechanical stress or delamination risk to the PCB substrate. Other products on display were a new line of Connectorized Packages along with a family of products designed specifically for the Quantum Computing industry.

Smiths Interconnect

Smiths Interconnect provides high-reliability connectivity products and solutions serving segments of aerospace and defense, medical, semiconductor test and industrial markets. It designs and manufactures electronic components, microwave, optical and RF products and multi-functional assemblies that connect, protect and control critical applications. They showcased three live demonstrations at IMS, a six-section surface mount S-band ceramic filter, a surface mount K2TVA Thermopad® and a subminiature push-on connector, EZiCoax.

Spectrum Control 

At IMS 2026, Spectrum Control brought its Innovate+, Adapt+, Deliver+ theme to life with three announcements focused on helping engineers reduce RF system complexity, accelerate validation, and move faster from design concept to deployable hardware. The company introduced dual-channel 18 GHz to 40 GHz mmWave block converter RF+ SiPs that integrate conversion, filtering, gain control, power regulation, RF detection, temperature monitoring, and digital control in compact surface-mount packages. It also expanded its Filtered Connector Express™ family with configurable D-Sub filtered connectors, enabling engineers to specify pin by pin EMI filtering directly into the connector while reducing lead times by 50%. In addition, Spectrum Control launched the Weinschel™ 8401-16E 16x16 Butler Matrix, a compact passive beamforming network for Wi-Fi 6E, Wi-Fi 7, advanced MIMO, and high-channel-count RF validation.

Together, these IMS announcements reflect Spectrum Control’s Specifications+ approach: Innovate+ through highly integrated RF, microwave, and EMI solutions; Adapt+ through configurable and application-specific designs that align with customer architectures; and Deliver+ through production-ready platforms designed to reduce integration risk, supply-chain complexity, and development timelines. From mmWave frequency conversion and filtered interconnects to deterministic beamforming for next-generation wireless test, Spectrum Control is helping customers design, engineer, and build the systems that connect and protect our world.

StratEdge 

StratEdge showcased its complete line including post-fired ceramic packages, lower-cost molded ceramic packages and gold-plated mounting tabs for extremely demanding GaAs and GaN devices. The post-fired ceramic semiconductor packages operate from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and efficient operation. The company was available to discuss molded ceramic package options for RF and microwave applications up to 18 GHz. StratEdge's molded ceramic packages provide designers with a broad range of high-reliability options for defense, aerospace and other harsh-environment applications.

Tabs sold by StratEdge include copper composites and copper-molybdenum-copper laminate materials. For GaN chip manufacturers, die-on-tab eliminates potential die attach mistakes made by customers that reduce chip’s performance and/or reliability. Die-on-tab is perfect for chip-on-board (COB) applications because organic boards cannot withstand the eutectic die attach temperature.

Synopsys

Synopsys, NASA and Keysight jointly presented the NASA Glenn Research Center Emulation and Modeling (GEM) Testbed at IMS2026’s RF Systems Pavillion (booth 20088). It’s a hardware-in-the-loop RF validation platform that brings realistic lunar surface cellular network testing into the lab.  

The result: real hardware operating over realistic lunar surface RF channels—without field testing. By essentially plugging synthetic data from a very powerful digital twin into hardware, NASA can simulate and listen to end-to-end network performance for lunar systems operation.

As a part of the demo, visitors were able to experience what a phone call would sound like on the moon.

Synopsys' 5G/6G and Space Program Director, Shawn Carpenter, was on the other end of the line. He’s among Synopsys’ RF wizards who helped NASA run their lunar comms simulations millions of times faster with simulation, digital mission engineering and true-to-reality moon topography.

TagoreTech

TagoreTech showcased the latest innovations driving high-performance connectivity and next-generation wireless solutions. TagoreTech GaN RF switches — integrated modern RF switching to replace PIN diodes. Legacy PIN-diode solutions — developed in the Apollo era — still power many RF switches today. They require complex bias networks, many passive components, and high-voltage generation and controllers (up to 200 V), adding size, power and test complexity.

TagoreTech RF GaN switches offer a modern integrated RF solution with a minimal number of components and 1000x smaller power consumption. GaN is a wide-bandgap semiconductor that enables higher voltages, greater power density and greater efficiency than silicon-based devices — ideal for compact, high-power RF switching.

Teledyne HiRel Semiconductors

Teledyne HiRel Semiconductors announced the TDLNA0840SEP, a space-screened, ultra-low-power, wideband low-noise amplifier designed to support the growing demands of satellite constellations in low Earth orbit and medium Earth orbit, spaceborne communications and advanced RF front-end architectures. 

Teledyne Storm Microwave 

Teledyne Storm Microwave was at booth #19076. Those who stopped by the booth could see their cables and connectors tested live with a LeCroy analyzer — a Teledyne collab, all on the show floor.

Teledyne Storm Microwave's FlatPhase™ proprietary foamed fluoropolymer dielectric eliminates typical PTFE phase change — delivering a flatter, more stable phase response across temperature extremes, humidity, and the harshest operating environments.

Teledyne brings together world-class RF microwave, and semiconductor expertise under one roof. Attendees could find these business units on the IMS show floor:

Teledyne Technologies

Teledyne Technologies Inc. brought together a wide range of RF and microwave products and capabilities, including high-performance semiconductors, components, modules and interconnects, signal and power switching, and thermal imaging, at the International Microwave Symposium, June 9-11, in Boston. Visitors to Booth 19076 saw how Teledyne's integrated portfolio addresses the full signal chain across communications, radar, and electronic warfare. 

Live Demonstrations

• TSA-220060 3U VPX Multichannel Converter: Dual wideband transceivers with 0.5–20 GHz coverage and integrated local oscillator generation
• Non-Uniform Sampling (NUS) via the EV10AS940 12.8 GSps ADC: Real-time signal detection and demodulation with reduced data throughput, even at low signal-to-noise ratio
• High-Performance Cables, Connectors, and Board-Mount Interconnects: Demonstrated with the WavePulser® 40iX Interconnect Analyzer for real-time signal integrity insight up to 40 GHz
• Real-Time Thermal Imaging: Full-field temperature mapping for rapid identification of overheating components, electrical shorts, and thermal stress points.

The booth also featured Teledyne's broader portfolio of RF and microwave technologies, including space and defense components, precision switching and interconnect solutions, rapid prototyping and advanced sensing technologies.

Texas Instruments

Texas Instruments demonstrated its latest radio-frequency (RF) innovations at IMS2026, showcasing technologies that set new benchmarks for low phase noise, high signal-to-noise ratio, and optimized size, weight, power and cost (SWaP-C) across aerospace and defense, test and measurement, wireless infrastructure, and satellite communications applications. Highlights included a 64 GSPS direct RF sampling transceiver operating up to 40 GHz, the industry's lowest phase-noise 25 GHz RF direct digital synthesizer, and a fully integrated RF synthesizer covering 1 MHz to 26 GHz. Additional demonstrations featured 1 ns glitch detection for high-speed telemetry, an active 2x2 GPS antenna array, and a high-density wideband transceiver solution extending through Ku-band. TI also showcased RF system bias controllers, an integrated high-efficiency power amplifier controller for PA modules, crest factor reduction (CFR) and digital predistortion (DPD) integration for multiband small cells and femtocells, direct-RF solutions for SATCOM and NB-IoT applications, and wideband direct-RF architectures designed for distributed antenna systems (DAS) and next-generation wireless infrastructure.

United Monolithic Semiconductors

United Monolithic Semiconductors (UMS) featured its CHA2353-99F, a three-stage monolithic low noise amplifier, producing 24 dB linear gain with 30 dB Adjustable Gain Control (AGC) and 3.5 dB noise figure in the frequency band 46 to 52 GHz. It includes ESD protections on each RF access and DC pads.

This amplifier is designed for a wide range of applications, from commercial to space communication systems. It is manufactured with a GaAS pHEMT process successfully evaluated for Space and is available in bare die.

Vaunix 

Vaunix exhibited at IMS Booth #16017. Attendees could explore their latest innovations in compact Lab Brick test devices and fully integrated rack-mount Handover Test Systems — all designed to simplify your testing process and boost your product performance. Their growing lineup includes cost-effective, portable solutions, including digital attenuators, signal generators, RF switches, phase shifters and more. The Digital Attenuator Hand Over Test Systems can help you build a reliable, scalable microwave test bench.  Attendees could stop by and pick up their 2026 Product Guide, with several new products.

Wenzel Associates

Wenzel Associates introduced the QuadPod, a revolutionary frequency reference that redefines what's possible in ultra-low phase noise performance. By housing four individually phase-locked Golden OCXOs in a single, vibration-isolated enclosure, the QuadPod delivers unprecedented spectral purity across applications demanding the absolute best stability.  

A 500 MHz demonstration unit achieved phase noise of -103 dBc/Hz at the 10 Hz offset, cascading to -130 at 100 Hz, -153 at 1k, -168 at 10k, -171 at 100k, -183 at 1 MHz, and -184 dBc/Hz at frequency offsets ≥10 MHz—performance that sets new industry benchmarks.

But the real innovation lies in flexibility. Each Golden OCXO operates independently, or users can combine all four through intelligent mixing schemes to reach GHz-level frequencies. Because phase noise from each oscillator remains uncorrelated above the sub-1 Hz PLL bandwidth, combined noise power increases by 3 dB rather than 6 dB—a decisive advantage over conventional approaches.

 The vibration-isolated housing ensures low-frequency dampening that preserves performance in demanding environments. For applications requiring single-output elegance, Wenzel's GMXO line delivers this same uncompromising excellence.

WIN Semiconductors  

Attendees got to learn about WIN Semiconductors Corp's entire GaN, GaAs and InP technology portfolio at booth# 23048 during IMS. WIN also announced the successful qualification of NP12-0B for 40 V operation. This 0.12 μm gate-length GaN-on-SiC technology integrates multiple transistor improvements providing high ruggedness when operated in deep-saturation/high-compression pulsed and CW conditions. These enhancements proved so effective that NP12-0B has now satisfied qualification testing for reliable 40V operation of power amplifier, T/R switch and single-chip front-end MMICs.

NP12-0B is a rugged, versatile platform and provides the unique set of capabilities of high output power, low insertion loss switching and low noise figure, expanding the performance envelope of this platform. Enabling high performance amplifiers, output transistors tuned for maximum power at 18 GHz and 40 V provide 7.9 W/mm Psat, 13.3 dB gain and 42 percent PAE. When tuned for maximum PAE, the same power cell exhibits 6.1 W/mm Psat, with 14.6 dB gain and 55 percent PAE at 18 GHz. When used in a switch configuration, common-gate devices show insertion loss below 0.4 dB, power handling greater than 42 dBm, with sub 20 nS switching speed using a 40 V control voltage.Adding to its power capabilities, NP12-0B also provides excellent noise figure with typical Fmin of 1 dB with 10 dB associated gain at 20 GHz. The comprehensive set of performance capabilities and reliable 40V operation greatly expands the trade-space for high performance front-end products used in next generation radio access networks, satellite communications and radar systems.

The NP12-0B platform has been in production since 2024 and is available with the Enhanced Moisture Ruggedness option which provides excellent humidity resistance for use in plastic packaging. The updated 40 V Process Design Kit (PDK) supporting PA, switch and LNA designs will be available for customer download in Q2 2026.

WIPL-D 

WIPL-D develops advanced full-wave 3D electromagnetic simulation software based on the Method of Moments with higher-order basis functions, delivering exceptional accuracy and computational efficiency for complex EM problems. Attendees had the opportunity to meet the WIPL-D team for live demonstrations and technical discussions on advanced EM simulation workflows and practical engineering applications.

Wupatec 

Wupatec and Mitsubishi Electric presented a joint live demonstration at IMS, focused on FR3 measurement workflows for 5G-Advanced and 6G applications. The setup combined Mitsubishi Electric’s GaN Doherty Power Amplifier module with Wupatec’s RFSoC-based measurement platform and FR3 Extension Board. It demonstrated how an RFSoC platform can be extended beyond its native 7 GHz range to support FR3 signal generation, acquisition, characterization and digital linearization.

What was seen live:

• FR3 wideband signal generation
• RF acquisition and characterization
• GaN PA testing workflow
• DPD / CFR integration
• FSoC-based measurement platform

The live demo took place at Dassault Systèmes' booth #14046.

X-Microwave

At IMS 2026, X-Microwave highlighted its modular RF and microwave prototyping platform, designed to accelerate the design, simulation, testing, and deployment of high-frequency systems. The company showcased its X-MWblocks ecosystem, integrated microwave assemblies (IMAs), OpenVPX prototyping solutions, and rapid-development tools that enable engineers to quickly evaluate and integrate RF components. X-Microwave emphasized reducing development time and risk by providing flexible, reconfigurable hardware platforms that support applications across aerospace, defense, communications, test, and advanced research markets.