JETCOOL Technologies unveiled a new approach to cooling computer processors and other electronics at the 2019 IEEE International Microwave Symposium (IMS2019), winning the MIT spin-off the title of Next Top Startup.
In our latest industry chat, market analyst Earl Lum and I sat down to compare notes about the wireless industry and what caught our attention at #IMS2019. Listen to our conversation on this episode of the Microwave Journal podcast.
pSemi announced the release of UltraCMOS® 13, the next-generation of its proprietary RFSOI process running on GlobalFoundries’ 300 mm wafer fab. UltraCMOS 13 was tailored to improve low noise amplifier (LNA) and power amplifier (PA) performance and enable improved performance from integrated front-end components.
Integra Technologies announced it has been awarded a two-year contract by the U.S. Air Force to accelerate technology and manufacturing readiness of its patented, Thermally-Enhanced GaN/SiC technology.