Remtec's new technologies for metallized ceramic sensors, detectors and analyzers

Remtec Inc. has expanded its process capabilities and developed new techniques to manufacture high performance metallized ceramic sensors in a variety of diverse applications. These include motion/velocity and acceleration systems, electrical measurement (capacitance and resistance), medical monitoring, diagnostic and detection, optical such as light sources, infrared detectors and fiber optics, liquid and gas flow, biosensors, temperature and thermal conductivity as well as wireless sensors.

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Remtec develops new, cost-effective gold tin plating technique

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.

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Remtec Expands DBC Substrate Capabilities

Remtec®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing.

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Remtec Has Developed Innovative Flip Chip Packaging

Remtec , a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors -- MOSFETs and eGAN...
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