Richard Chen, Neal Mellen, Makoto Shibata and Masahiro Miyazaki, TDK Corp.

Miniaturization and cost reduction along with ever expanding user functions are important features for modern consumer communication devices as customers demand more data throughput at low cost. System-on-chip (SoC) and system-in-package (SiP) have brought more and more circuits and functions together. For passive circuits, traditional multi-layer printed circuit boards...