Impedance Matching Methods for Additively Manufactured Integrated SMA-to-Waveguide Transitions March 12, 2021 R. Dahle, State University of New York, New Paltz, New York, USA and P. Laforge, University of Regina, Regina, SK, Canada No Comments
The Dual-Drive Power Amplifier: The Next Frontier in Power AmplificationBy Sanghoon Lee, James Kaney and Edgar Garay, Falcomm, Atlanta, Ga.Subscribe
Chipless RF Identification Tags with Microstrip Patch ResonatorsBy Kawther Mekki and Ali Gharsallah, University of Tunis El Manar, Tunis, Tunisia, Omrane Necibi, University of Jouf, Jouf, Saudi Arabia, and Hugo Dinis and Paulo Mendes, University of Minho, Braga, Portugal
InP + CMOS Heterogeneous Integration for The Next Generation of WirelessBy Nadine Collaert and Michael Peeters, imec, Leuven, Belgium
