Two full days of technical programming, the EDI CON University, panels, exhibition, networking and show floor presentations covering RF, microwave, signal integrity, power integrity and EMC/EMI await this year’s attendees in sunny Santa Clara, California.
EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.
EDI CON China 2018, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces registration is now open and the technical program is now live at www.ediconchina.com.
This March 20-22, EDI CON China returns to Beijing in the China National Convention Center. Attendees return to EDI CON each year to see the latest products on the exhibition floor and to benefit from its technical conference, made up of peer-reviewed technical sessions as well as workshops, plenary keynote speeches, panels and a short course with industry-leading experts.
This year marks the first that we are running two EDI CON conferences: EDI CON China on April 19-21 in Beijing and the new EDI CON USA on September 20-22 in Boston, MA. Both conferences include an exhibition, keynotes, technical conference sessions, workshops, networking, and training opportunities.