This year marks the first that we are running two EDI CON conferences: EDI CON China on April 19-21 in Beijing and the new EDI CON USA on September 20-22 in Boston, MA. Both conferences include an exhibition, keynotes, technical conference sessions, workshops, networking, and training opportunities.

EDI CON is an industry event where practicing engineers come together to network, see the latest new products, and gather ideas on how to solve the design challenges facing them right now. Attendees interact with their peers to discuss tangible, usable products, technologies, and methodologies that they can put into practice the moment they hear about them. 

This year’s EDI CON China is right around the corner, and the technical conference schedule is live Topics span the RF, microwave, and high-speed digital spheres from modeling to implementation and test, covering subjects such as antennas, 5G, amplifiers, radar, EMC/EMI, signal integrity, ultra-low power designs, materials, connectors, and the IoT.

I’ve just joined the EDI CON/Microwave Journal team, and I’m looking forward to April’s event in China, which will be co-located with the China Radar Industry Association Conference and the EMC China Conference/Exhibition.  Here’s just one example of the great learning opportunities that await us in China: Dr. Eli Brookner, formerly a principal engineering fellow at Raytheon, will be teaching a 2-hour course on Wednesday afternoon at EDI CON China on the advancements in phased-array and MIMO radars. It promises to be an engaging session.

For EDI CON USA, we are currently collecting abstracts  for technical sessions (a great opportunity for engineers to share their latest work and design tips) and putting together relevant, timely training sessions and challenging design contests for attendees. There’s still an opportunity to join us on the exhibit floor as well, though spaces are filling up fast.

If you will be at EDI CON China, please stop me to say hello. I’m looking forward to working with you.