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Gold Stud Bumps in Flip-chip Applications

As power requirements and operating frequencies increase, more and more designs will look toward ball bumps as an interconnect solution. While solder has traditionally been the incumbent material for these bumps, its limitations have become manufacturi...
As this article is written, it is estimated that 90 to 98 percent of first-level IC interconnects are made using wire bonding technologies. The remaining connections are primarily bump, or flip-chip connections. This ratio is expected to remain the same for the foreseeable future. In general, it will be...
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