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The Design Challenges of RF SIPs and Multi Chip Modules

RF SiP and MCMs integrate CMOS integrated circuits (ICs) for digital circuits and GaAs or SiGe devices for RF and microwave circuits with soft-board laminates and LTCC packages. Software used to design these complex circuits must seamlessly bring together synthesis, simulation, and verification solutions via a single interface ensure optimum component design and placement in each technology.
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