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DuPont Circuit & Packaging Materials and IQLP to develop high-speed circuit technology

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.


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