The Future of mm-wave Packaging February 13, 2014 Liam Devlin, Plextek RF Integration, Great Chesterford, UK 3 Comments
Artificial Intelligence and Machine Learning Add New Capabilities to Traditional RF EDA ToolsBy Contributions by Altair, ANSYS, Cadence/AWR, Keysight and MathWorksSubscribe
A Microelectromechanical Switch with Metamaterial Contacts, Part III: Reducing StictionBy Shiban K. Koul and Pranav K. Srivastava, C.A.R.E, Indian Institute of Technology, Delhi, India and Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave, N.J., U.S.
RLC Parameter Extraction Using the Transfer MatrixBy Brian Walker, Copper Mountain Technologies, Indianapolis, Ind.
