For transmit/receive (T/R) modules, it is imperative to use an architecture that meets all requirements with the most cost-effective technology. This white paper overviews various solid-state semiconductor technologies for T/R module development and describes a design methodology that includes the modeling/analysis of a T/R module.
RF modules offer a large amount of functionality in a small space, but they can be an engineering challenge for development teams. When combining multiple integrated circuits (ICs) into a single package, it is necessary to model the electrical behavior of many different technologies, such as interconnects (transmission lines) and embedded distributed components, as well as RF, analog, and digital components.
A phased-array antenna is made up of multiple individual radiating elements (antennas), each fed with an RF signal controlled through phase shifters in such a way that the radio waves from the separate antennas are added together to increase the radiation.
Power amplifiers (PAs) are responsible for increasing the strength of a signal with minimal added distortion. By providing enough signal strength to overcome over-the-air losses, PAs play a vital role in the RF/microwave front end of any communication system.
Power amplifier (PA) performance under small- and large-signal operating conditions is contingent upon the output impedance match (load). As a result, PA designers must determine the ideal output load for system-driven amplifier requirements such as output power at a given saturated power (compression point), efficiency, and/or linearity.
New active electronically-scanned arrays (AESAs) are being used for radar systems in satellites and unmanned aerial vehicles. As these systems are deployed in new and novel ways, size and performance requirements are becoming critical and are being addressed through innovative architectures and system capabilities. This white paper examines these technology trends and presents several examples where advances in NI AWR Design Environment are supporting next-generation AESA and phased-array radar development.
The latest release of NI AWR Design Environment, V13, will be on display at the Electronic Design Innovation Conference (EDI CON) 2017, being held
in Shanghai, China on April 25-27. In addition to software demonstrations within NI Booth #311, the NI AWR software product portfolio will be featured in one 40-minute workshop and two 20-minute technical sessions. NI AWR software activities during EDI CON include:
WIPL-D d.o.o., a Serbian developer of commercial electromagnetic (EM) software, has become a key alliance partner and original equipment manufacturer (OEM) supplying its technology for use within NI AWR software, specifically AntSyn™ antenna synthesis and optimization module.
Mitsubishi Electric Corp. has developed a new methodology to improve testing for electromagnetic compatibility (EMC) of its DIATONE automotive navigation/audio systems using NI AWR Design Environment, specifically Microwave Office circuit design software and AXIEM 3D electromagnetic (EM) simulation.
NI, the provider of platform-based systems that enable engineers and scientists to solve the world's greatest engineering challenges, announced that its Board of Directors has elected Alex Davern, age 49, to serve as Chief Executive Officer and President of National Instruments, effective January 1, 2017.