Qualcomm Inc. and TDK Corp. announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), automotive applications, connected computing, and more. The business being transferred constitutes a part of the TDK SAW Business Group activities.
TDK Corp. and Tronics Microsystems SA jointly announced that TDK’s wholly-owned subsidiary EPCOS AG, a leading manufacturer of electronic components, modules and systems based in Munich, Germany, and Tronics have signed a tender offer agreement pursuant to which EPCOS will launch a public tender offer for all publicly-held shares of Tronics for EUR 13.20 per share.
TDK Corp. presents the P27 series of EPCOS NTC inrush current limiters (ICLs) with a nominal disk diameter of 27 mm and lead spacing of 7.5 mm, thus extending the portfolio of large NTC ICLs for industrial electronics applications.
TDK Corp. announces the new EPCOS duplexer for LTE Band 1, which at 60 dB features very high isolation for both the Tx and Rx paths. Based on SAW technology, the B8651duplexer has a miniature footprint of just 1.8 mm x 1.4 mm.