This ROG BLOG is Part One of a two part series introducing the key criteria to consider when selecting a PCB substrate which will minimize circuit losses for 77 GHZ radar PCB antenna applications. First we will discuss components of PCB circuit loss, and then introduce six key material properties critical to developing low loss millimeter wave circuits at 77 GHz.
Advanced automotive electronics systems have relied on the reflections from on-board vehicular radar systems for some time. The vehicular radars are often fabricated on what are known as hybrid multilayer PCBs. These are PCBs formed of different kinds of circuit-board materials, matching the characteristics of the different materials to the needs of the different circuit functions, from DC through 77 GHz. Learn about designing with these new layers to realize better performing circuits at a lower cost.
5G may represent the latest and greatest in wireless technology, but it will be challenging to design and fabricate, starting with the circuit-board materials, because it will operate across many different frequencies, such as 6 GHz and below as well as at millimeter-wave frequencies (typically 30 GHz and above); it will also combine network access from terrestrial base stations and orbiting satellites. But by careful consideration of mechanical and electrical requirements, high-frequency circuit materials can be specified that enable the design and development of 5G PAs no matter the frequency.
Printed circuits for high-speed and high-frequency applications rely on fine-featured transmission lines for signal transmission. Ideally, the loss through these transmission lines is minimal, and this requires an electrical impedance that is consistent and without interruptions, and with a value most appropriate for the types of signals to be transferred through the circuit. However, a number of factors can affect the impedance of a PCB, including the physical and electrical characteristics of the circuit and circuit material, but by reviewing and better understanding these variables, their effects can be minimized.
Rogers Corporation has introduced Kappa™ 438 laminates, glass reinforced thermoset laminates that were developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 laminates. Kappa 438 laminates have a low Z axis CTE and High Tg for improved design flexibility, PTH reliability and automated assembly compatibility, and can be fabricated using standard epoxy/glass (FR-4) processes.
In collaboration with Microwave Journal’s Technical Education Training Series, John Coonrod of Rogers Corp.’s Advanced Connectivity Solutions will present a one-hour webinar on “The Impact of Plated Through Hole Via’s on RF Performance,” on Thursday, April 6, starting at 8 AM PT/11 AM ET.
Rogers Corp. and its Advanced Connectivity Solutions technical team will be presenting the latest developments in printed-circuit-board (PCB) materials for emerging high-frequency applications at the upcoming IPC APEX EXPO 2017 (www.ipcapexexpo.org), February 14-16, 2017 at the San Diego Convention Center.
Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.