In this paper we summarize measured receive antenna performance for a commercially available 32-element phased array demonstrator. The demonstrator is configured for hybrid beamforming with eight elements per subarray and four digital channels. The test setup and calibration steps are explained sequentially along with the measured calibration accuracy achieved. Three-dimensional radiation patterns of the antenna array are shown for various electronically steered beam positions including amplitude tapering.
Analog Devices, Inc and Keysight Technologies, Inc. announced their collaboration to advance the adoption of phased array technology to realizing ubiquitous connectivity and sensing by simplifying development stages associated with creating satellite communication, radar and phased array systems.
Analog Devices, Inc. (ADI) introduced a mmWave 5G front-end chipset that addresses required frequency bands enabling designers to reduce complexity and bring smaller and more versatile radios to market faster.
This article will explore some of the challenges associated with pcb footprint design of Land Grid Array (LGA) packages that are widely used in phased array systems, and will offer guidance and recommendations for best pcb assembly results.
Over the past several decades, wireless system channel counts and bandwidths have steadily increased. The driving factors for these modern telecommunication, radar, and instrumentation systems are their data rate and overall system performance requirements. However, these requirements have also increased power envelopes and system complexities, making power density and component level features more important.
The excellent phase noise exhibited in ADI’s latest generation of high speed DACs enables size, weight, power/performance, and cost benefits in next-generation low phase noise, fast hopping agile RF/microwave synthesizers.
Is RF engineering a form of black magic? This article analyzes the challenges faced in the development of ADH519S, an 18 GHz to 31 GHz low noise amplifier (LNA), for the aerospace market. The die used in the product development for space was originally released to the commercial industry in the LC4 package.