Microsembly has enhanced their repair and refurbishment capabilities with a focus on Advanced RF SMT Component Repair and Replacement Services. This advanced offering addresses growing customer demand for precision SMT rework and testing—especially for Ball Grid Array (BGA) and Quad Flat No-lead (QFN) packages used in mission-critical RF/microwave assemblies.
"With our dedicated repair team at their disposal, customers can confidently outsource their RMA orders and stay focused on new builds," said Phuong “Kent” Dang, President of Microsembly. "Refurbished units are often redeployed better than new, undergoing more rigorous testing and burn-in than standard production units."
Microsembly’s Core SMT Repair Capabilities Include:
SMT Troubleshooting: Root cause analysis with advanced inspection and test tools
Precision Rework: Controlled thermal removal and replacement of SMT components
X-ray Verification: Inspection of BGA/QFN solder joints for voids or shorts
Full MIL-STD RF and Environmental Testing: Ensures reliability under mission conditions
Microsembly’s SMT services are part of a broader suite of component-level repair offerings including epoxy and eutectic die attach repair, ball/wedge/ribbon wire bonding, and full refurbishment services that restore systems to 'like new' condition with enhanced reliability screening.
Certified for Mission-Critical Repairs
ITAR Registered
ISO 9001 Certified
MIL-PRF-38534 & IPC-A-610 Compliant
Explore Microsembly articles: Microsembly Releases Brochure for AVL and Supply Chain Decision-Makers in RF/Microwave Manufacturing and Fabs and Labs: Microsembly.
To learn more or request a quotation, visit www.microsembly.com or call (603) 718-8445.
