Company Profile

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Microsembly: Supporting You at Every Stage

Thank you for visiting the Microsembly VendorView page within Microwave Journal’s Buyer’s Guide. We’re pleased to be here to offer you end-to-end RF and microwave contract design, assembly, manufacturing, and testing services from our ISO and pending AS9100 certified facility in Merrimack, NH USA. We are an industry expert partner for high-reliability mixed technology RF/microwave assemblies. We support complex, high-frequency modules including Integrated Microwave Assemblies (IMAs), Multi-Chip Modules (MCMs), Sensor Chip Assemblies (SCAs), and System-in-Package (SiP) devices.

  1. Design Engineering & Prototyping Services 

Microsembly provides collaborative design input, layout optimization, and prototyping to transform concepts into testable and manufacturable high frequency products. 

  • Semiconductor & package-level design for manufacturability (DFM) engineering
  • Layout validation, rapid prototyping & feasibility analysis 
  1. Supply Chain & Procurement Services
  • Cost-efficient sourcing & procurement 
  • Lifecycle & obsolescence management
  • Counterfeit detection & prevention 
  1. Contract Manufacturing Services 
  • RF PCB manufacturing for high-frequency signal integrity
  • Wedge & ball wire and ribbon bonding for robust high-frequency connections
  • Epoxy encapsulation to protect and insulate assemblies
  • Coil winding & tacking for integrated inductive components
  • Board installation & subsystem integration
  • RF feedthrough installation & hermetic sealing for extreme environments 
  1. RF & Environmental Testing & Screening Services
  • DC to 110 GHz RF testing (VNAs and Spectrum Analyzer)
  • Custom Automated Test Equipment (ATE) for application-specific evaluations
  • Small- and Large-Signal Performance Testing
  • Environmental Screening & Life-Cycle Testing - incl. temperature cycling, vibration, humidity, and burn-in
  • Fixture De-embedding & Data Logging for precision and traceability
  • Compliance testing to MIL-STD 883-750, MIL-STD-19500, MIL-PRF-38534, MIL-PRF-38535, and more 
  1. Post-production Services:

Microsembly offers repair & refurbishment of returned RF/Microwave units, too, including failure analysis and root cause diagnostics, performance restoration, and requalification.

Microsembly’s manufacturing is backed by a ISO 9001 certified quality system, delivering consistency and control throughout the production lifecycle. 

Technicians and engineers are certified to leading industry standards, including:

  • IPC J-STD-001 Space and Military Addendum - soldering processes
  • IPC-610 - Assembly acceptance
  • MIL-STD-883 / MIL-PRF-38534/35 - microelectronics reliability
  • NASA PEM-INST-001 & EEE-INST-002 space-grade Screening & Qualification

Contact us today and let’s explore how we can support all your RF/microwave contract design, assembly, manufacturing, and testing needs.

 

 

 

Contact Information:


Phone: 603.718.8445

Location:


Microsembly
21 Manchester Street
Merrimack NH 03054
United States

End-to-End Design, Assembly, and High-Frequency Test Expertise

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Microsembly to Showcase Full-Spectrum RF and Microwave Manufacturing Capabilities at IMS 2026

Microsembly specializes in RF and microwave microelectronics assembly, device evaluation, advanced SMT manufacturing, integrated microwave module production, and environmental qualification for aerospace, defense, satellite communications, telecommunications, medical, industrial, and research markets.

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Advanced SMT Repair Services

Microsembly has enhanced their repair and refurbishment capabilities with a focus on Advanced RF SMT Component Repair and Replacement Services. This advanced offering addresses growing customer demand for precision SMT rework and testing.

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State-of-the-Art Automated & Manual Wire and Ribbon Bonding

Microsembly has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility. This investment significantly enhances Microsembly’s fine-pitch interconnect and high-power bonding capabilities.

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End-to-End, US-Based Contract Manufacturing

Microsembly has enhanced their capabilities to support mixed technology Integrated Microwave Assemblies (IMAs) up to 110 GHz. Includes Multi-Chip Modules (MCMs), Sensor Chip Assemblies (SCAs), and System-in-Package (SiP) devices.

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