ARTICLES

Cornell and SUSS MicroTec Collaborate on Nano Research

SUSS MicroTec and Cornell NanoScale Science & Technology Facility (CNF), a university nanofab based in North America, have formed a strategic collaboration. Cornell staff will perform research using SUSS lithography equipment, including enhanced contact aligner tool sets and a Gamma spray coater. The research and development facilities at CNF,...
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Amkor Technology Installs Systems from SUSS MicroTec

SUSS MicroTec , a supplier of equipment and process solutions for the semiconductor industry, has received orders for multiple 300 mm lithography systems from Amkor Technology Inc. , a supplier of innovative packaging solutions. The equipment package includes MA300 Gen2 mask aligner systems and ACS300 Gen2 wafer processing clusters...
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SUSS MicroTec AG Sells Test Systems Division

SUSS MicroTec has sold its Test Systems Division, located in Sacka near Dresden, Germany, together with other related assets to Cascade Microtech Inc. , a leader in the precise electrical measurement and test of integrated circuits. The purchase price for the SUSS MicroTec Test Systems GmbH, which is subject...
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SUSS MicroTec Cooperates with Taiwan’s ITRI on 3D Research

SUSS MicroTec is engaging with one of the world's leading research institutes, the Industrial Technology Research Institute (ITRI) in Taiwan, on the development of 3D integration technologies. The Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI, will implement the 300 mm lithography cluster...
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SUSS MicroTec Unveils New Sales Structure in Asia

SUSS MicroTec , a supplier of process and test solutions for microstructuring applications in semiconductor and related markets, has announced a new structure for sales in Asia based in Singapore. The restructuring establishes the sales office in Bangkok, Thailand, which administers sales and service for lithography and wafer bonder...
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SUSS and 3M Form 3-D Packaging Bond

3M and SUSS MicroTec have agreed to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultra-thin wafers required for 3-D packaging. As part of this non-exclusive agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell...
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SUSS MicroTec Test Systems Chosen for Laboratory

SUSS MicroTec Test Systems has received purchase orders for test equipment that will enable the development of next-generation integrated circuits, including CMOS transistor scaling to the 16 nm node and beyond and the investigation of the reliability characteristics of high-k dielectrics. The partnership with SEMATECH , a global consortium...
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MST.factory Selects SUSS Wafer Bonder

MST.factory dortmund , a renowned center of competence for micro and nanotechnology based in Germany, has purchased the CB8 High Performance Wafer Bonder from SUSS MicroTec , a supplier of innovative process and testing solutions. The CB8 semi-automated 200 mm wafer bonder is being used by MST.factory dortmund to...
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