3M and SUSS MicroTec have agreed to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultra-thin wafers required for 3-D packaging. As part of this non-exclusive agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell XBC300 and CBC300 wafer bonders configured to use 3M’s WSS materials including 3M Liquid UV-Curable Adhesive and Light-To-Heat Conversion coating.
Under the agreement, both companies will work closely to address customer demands for high-performance process solutions that support high-volume manufacturing with a competitive cost of ownership.
3M WSS uses processes and materials for temporary wafer bonding to support wafer thinning and processing of ultra thin wafers for 3-D packaging. The innovative use of a UV-curable adhesive for wafer bonding to glass carriers provides robust wafer support throughout wafer grinding. This is particularly important in the multiple high-temperature cycles required in subsequent wafer processing steps. After processing, 3M’s Light-To-Heat Conversion layer allows low stress, room temperature debonding of the thinned wafer directly to the tape carrier.
Mike Bowman, Marketing Development Manager for 3M Electronics Markets Materials Division, commented, “SUSS MicroTec is a recognized leader in wafer bonding and applications for 3-D and MEMS markets. Working with an industry leader, like SUSS, allows 3M to focus on advanced materials development. The joint efforts of both companies provide 3M customers with improved support, lower overall costs and faster access to more advanced solutions for their demanding 3-D packaging requirements.”
Wilfried Bair, General Manager, Wafer Bonder Division, SUSS MicroTec, added, “This relationship and process offering fits nicely with SUSS MicroTec’s 3-D strategy to provide a flexible and modular bonding platform that can be configured to meet customers’ needs.”