Infotonics, a collaborative, world-class Center of Excellence in photonics and microsystems, has selected SUSS MicroTec’s ABC200 wafer bonding cluster tool and FC150 automated device bonder as strategic investments in its MEMS packaging laboratory.

With corporate partners such as Corning, Eastman Kodak and Xerox, as well as relationships with over 20 universities, Infotonics has played a central role in groundbreaking work to benefit the biomedical and communications industries.

Its core competencies include the design, simulation, fabrication, packaging, test and metrology for MEMS and MOEMS devices, and by investing in the SUSS bonding systems the company aims to keep at the forefront of development.

The SUSS ABC200 is a flexible modular cluster tool design that can integrate several process modules including wafer cleaning, plasma activation, precision wafer alignment, wafer bonding and in-situ post-bond metrology all in a single system.

The SUSS FC150 automated device bonder incorporates a bi-directional microscope and high-precision mechanical stages to translate and rotate the parts during alignment. It is said to offer best-in-class ± 1 μm post-bond accuracy and a wide range of process capabilities to assemble MEMS and optoelectronic devices.

“With its corporate and university partnerships and technology transfer initiatives, Infotonics is in a unique position to promote MEMS and MOEMS technology transfer to industry,” said Michael Kipp, president, Wafer Bonder Division, SUSS MicroTec. “We are delighted to partner with them in their important work.”