SUSS MicroTec has announced that Microsystems Plaza (MiPlaza), a MEMS and nanotechnology research and development facility and service provider at the HighTech Campus in Eindhoven, the Netherlands, has selected the company’s wafer bonding equipment for the manufacture of MEMS and biomedical devices.

The two systems, consisting of a BA8 bond aligner and an SB8e wafer bonder, will support the aligned 8-inch wafer bond processes at the facility. MiPlaza chose these particular bonders due to their excellent precision bond alignment, and high bonding uniformity for BCB applications with a layer thickness of 1 micron. Also, the system showed excellent bond force control and temperature homogeneity, which is often critical to achieving high bond yields, especially on 8-inch wafers.

"Today's MEMS market requires flexibility, accuracy and reliability in process equipment that enables the fabrication of a wide variety of devices," said Michael Griesinger, account manager for MiPlaza at SUSS MicroTec. "Highly accurate aligned substrate bonding especially plays a significant role throughout the whole MEMS manufacturing process. We are honored that MiPlaza selected SUSS to realize these new and innovative components."