SUSS MicroTec and Surface Technology Systems, two leading providers of process and test solutions for the semiconductor industry are hosting an advanced technology roadshow in five major cities in Asia from October 29 to November 7. The series of one-day events is building on the success of the US roadshow this spring and will provide a comprehensive overview of the latest developments in the field of 3D Integration and Advanced Packaging.

Invited speakers from companies such as Panasonic, IBM and Fraunhofer IZM will discuss the optimization of integrated process solutions in respect to performance and cost. Topics cover applications like plasma-dicing, metal-to-metal wafer-level bonding, electrostatic carriers for thin wafer handling, as well as thin chip integration. SUSS MicroTec and co-host STS will demonstrate leading-edge total process solutions for 3D wafer level packaging by combining the expertise of STS in deep reactive ion etch (DRIE) for via fabrication and SUSS MicroTec in photolithography and wafer bonding.

The roadshow will take place at following dates and locations:

Tokyo, Japan: October, 29
Shanghai, China: October, 31
Seoul, South Korea: November, 3
Hsinchu, Taiwan: November, 5
Singapore: November, 7

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