Element Six and University of Warwick will join forces to shape the technology of the future as part of the eight Prosperity Partnerships announced in support of the government’s ambitious new Innovation Strategy.
GlobalFoundries announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years, including immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity.
X-FAB Silicon Foundries SE released a reference design kit for Tanner™ analog/mixed-signal software from the EDA segment of Siemens Digital Industries Software, providing full coverage of the flow to design and simulate analog and mixed-signal ICs.
Strategic collaboration and licensing agreement to develop new GaN technology will enable future wireless networks
May 19, 2021
Raytheon Technologies will license its proprietary GaN on Si technology and technical expertise to GLOBALFOUNDRIES, which will develop the new GaN on Si semiconductor at its Fab 9 facility in Burlington, Vt.
Keysight Technologies, Inc. announced that Semipower Electronic Technology has selected Keysight’s power device testing solutions to accelerate and promote the development of next-generation semiconductors.
SweGaN AB announced it is partnering with Ferdinand-Braun-Institut (FBH) and University of Bristol in a European Space Agency (ESA) project “Kassiopeia” that includes a focus on SweGaN’s QuanFINE® GaN-on-SiC epitaxial materials.
The RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple report provides insights into technology and cost data for RF front-end modules and a selection of components found in 18 smartphones from the Apple iPhone since 2016.
Electromagnetic (EM) simulation is an indispensable tool for characterizing the on-chip passive structures found in radio-frequency integrated circuit (RFIC) designs. However, when it comes to full-chip analysis, the diversity of structure geometries and scale pose a significant challenge for any single EM simulation technology. Successful characterization of an RFIC generally requires three different types of simulators: parasitic extraction, planar EM, and full (arbitrary) 3D solvers.
This paper explains the pulsed RF operation of Microsemi pulsed GaN HEMT RF power transistors using as an example the 1011GN-700ELM 1030 MHz Mode-S Enhanced Message Length (ELM) avionics device. General descriptions are presented detailing both the pulsed gate bias operation and the bias sequencing operation of the pulser circuit used on the Microsemi evaluation test fixtures.
This paper explains the pulsed RF operation of Microsemi pulsed GaN HEMT RF power transistors using as an example the 1011GN-700ELM 1030 MHz Mode-S Enhanced Message Length (ELM) avionics device. General descriptions are presented detailing both the pulsed gate bias operation and the bias sequencing operation of the “pulser” circuit used on the Microsemi evaluation test fixtures.
Dual-polarity supplies are commonly needed to operate
electronics such as op amps, drivers, or sensors,
but there is rarely a dual-polarity supply available at
the point of load. The LTCÃÂ®3260 is an inverting charge
pump (inductorless) DC/DC converter with dual low
noise LDO regulators that can produce positive and
negative supplies from a single wide input (4.5V to
32V) power source. It can switch between high efficiency
Burst ModeÃÂ® operation and low noise constant
frequency mode, making it attractive for both portable
and noise-sensitive applications.
Ever-increasing demands for faster product launch times, higher performance, lower part counts and reduced costs create RF system design challenges. This paper focuses on how the latest gallium nitride (GaN) products, specifically discrete transistors, amplifiers and switches, offer design engineers enhanced flexibility and performance options by reducing RF board space and system prime power requirements.
A system that utilizes OFDM/OFDMA, such as the E-UTRA (LTE) downlink or the IEEE 802.11a/g and the IEEE 802.16 physical
layers, transmits OFDM symbols, each comprising a number of modulated sub-carriers carrying data or pilot symbols, with
inter-subcarrier spacing being equal to or an integer multiple of a fixed frequency. The channel bandwidth (B) is determined by
the number of 'occupied' (modulated) subcarriers and the subcarrier spacing.
There are several options for the architecture of the transmit signal path. The factors that impact transmit signal elements are introduced, followed by a discussion of the different architectures. Figure 1 shows a direct conversion architecture for an initial point of reference only. Section 6 of 3GPP TS 25.105 describes the transmit signal requirements used throughout this discussion.
The next frequency frontier is the millimeter wave (mm-wave) band, which occupies the 30 GHz to 300 GHz spectrum (wavelengths from 10 to 1 mm). Emerging applications now span radio astronomy, communication, imaging, space research, and homeland security, and are starting to seriously populate this vast spectrum resourse. Market forecast and limited available spectrum suggest that attractive growth is just over the horizon so explorers are naturally migrating to stake their claim in this next frontier.