GLOBALFOUNDRIES (GF) and Soitec announced that they have signed multiple long-term supply agreements for 300 mm silicon-on-insulator (SOI) wafers to secure the high-volume supply to meet the growing demand from GF customers for its differentiated RF-SOI, fully-depleted-SOI (FD-SOI) and silicon photonics technology platforms.

Infineon Technologies AG and Cypress Semiconductor Corp. announced that the companies have signed a definitive agreement under which Infineon will acquire Cypress for US$23.85 per share in cash, corresponding to an enterprise value of €9 billion. 

NXP Semiconductors N.V. announced that its wholly owned subsidiary has entered into a definitive agreement with Marvell, under which NXP will acquire Marvell’s Wireless Connectivity portfolio in an all-cash, asset transaction valued at $1.76 billion.

Spending on RF power semiconductors (for < 4 GHz and > 3 W) continued to grow in 2018, surpassing the $1.5 billion mark, found ABI Research.

As part of the French Nano 2022 public-private program, UMS and several French partners will develop “smart RF solutions,” new integration technologies for systems in package (SiP).

GLOBALFOUNDRIES (GF) announced that the company’s mobile-optimized 8SW RF SOI technology platform has delivered more than a billion dollars of client design win revenue since its launch in September 2017.

Soitec and Shanghai Simgui Technology Co. Ltd. jointly announced an enhanced partnership and an increase in annual production capacity of 200 mm SOI wafers from 180,000 to 360,000 at Simgui's manufacturing facility in Shanghai, China, to better serve the growing global market for RF-SOI in mobile and Power-SOI products.

Targeting power electronics applications, pure-play semiconductor foundry Sanan Integrated Circuit Company has released a 6-inch SiC process to its foundry services portfolio, following full process qualification for commercial release.