Articles by SUSS MicroTec

SUSS MicroTec and Cornell NanoScale Science & Technology Facility (CNF), a university nanofab based in North America, have formed a strategic collaboration. Cornell staff will perform research using SUSS lithography equipment, including enhanced contact aligner tool sets and a Gamma spray coater. The research and development facilities at CNF,...

SUSS MicroTec , a supplier of equipment and process solutions for the semiconductor industry, has received orders for multiple 300 mm lithography systems from Amkor Technology Inc. , a supplier of innovative packaging solutions. The equipment package includes MA300 Gen2 mask aligner systems and ACS300 Gen2 wafer processing clusters...

SUSS MicroTec has sold its Test Systems Division, located in Sacka near Dresden, Germany, together with other related assets to Cascade Microtech Inc. , a leader in the precise electrical measurement and test of integrated circuits. The purchase price for the SUSS MicroTec Test Systems GmbH, which is subject...

SUSS MicroTec is engaging with one of the world's leading research institutes, the Industrial Technology Research Institute (ITRI) in Taiwan, on the development of 3D integration technologies. The Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI, will implement the 300 mm lithography cluster...

IMEC will use SUSS MicroTec 's XBC300 production wafer bonder platform to develop 200 and 300 mm permanent metallic interconnect bonding, as well as temporary bonding and debonding solutions for its 3D-stacked interconnect and 3D wafer level packaging technology. This universal platform can support a wide range of materials...

SUSS MicroTec , a supplier of process and test solutions for microstructuring applications in semiconductor and related markets, has announced a new structure for sales in Asia based in Singapore. The restructuring establishes the sales office in Bangkok, Thailand, which administers sales and service for lithography and wafer bonder...

3M and SUSS MicroTec have agreed to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultra-thin wafers required for 3-D packaging. As part of this non-exclusive agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell...

SUSS MicroTec Test Systems has received purchase orders for test equipment that will enable the development of next-generation integrated circuits, including CMOS transistor scaling to the 16 nm node and beyond and the investigation of the reliability characteristics of high-k dielectrics. The partnership with SEMATECH , a global consortium...

MST.factory dortmund , a renowned center of competence for micro and nanotechnology based in Germany, has purchased the CB8 High Performance Wafer Bonder from SUSS MicroTec , a supplier of innovative process and testing solutions. The CB8 semi-automated 200 mm wafer bonder is being used by MST.factory dortmund to...

SUSS MicroTec and Surface Technology Systems , two leading providers of process and test solutions for the semiconductor industry are hosting an advanced technology roadshow in five major cities in Asia from October 29 to November 7. The series of one-day events is building on the success of the...