Rogers combines DesignCon presentation with products

Rogers Corp. exhibited and presented a white paper concerning thermal conductivity at the DesignCon 2012 conference and exhibition. DesignCon, held January 31 through February 1, 2012, at the Santa Clara Convention Center, Santa Clara, Calif., is one of the electronic industry’s key meeting places for printed-circuit-board (PCB) designers.
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Rogers To Highlight PCB Materials

Rogers Corp. will display some of its latest laminate materials for high speed digital and high power RF/microwave circuits at the upcoming Del Mar Electronics & Design Show. Representatives from Rogers Advanced Circuit Materials Division will be at Booth 622 to offer guidance on the use of their wide...
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Rogers Debuts LoPro™ Laminates

The Advanced Circuit Materials (ACM) Division of Rogers Corp. introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss. The specially formulated RO4730 LoPro thermoset resin system...
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Rogers to Feature Advanced Circuit Material and Thermal Solutions

Rogers will be showcasing new advanced packaging material and thermal management solutions at the upcoming IMAPS show (November 4-6, Providence, RI). Rogers' Advanced Circuit Materials Division (ACMD) will feature its new RO2808 high frequency circuit material. With a dielectric constant of 7.6, the ceramic-filled PTFE material offers the stability...
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