ARTICLES

A Low Loss PTFE-based Bond Ply Material for Multi-layer PCB Applications

Introduction to a high performance, low loss laminate material for microwave telecommunications and high speed digital printed circuit board (PCB) applications
Product Feature A Low Loss PTFE-based Bond Ply Material for Multi-layer PCB Applications Taconic Advanced Dielectric Division Petersburgh, NY Growing needs are developing for pure package high performance, low loss laminate and prepreg materials for microwave telecommunications and high speed digital printed circuit board (PCB) applications. Polytetrafluoroethylene (PTFE), perhaps...
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Organic Ceramic Microwave Substrate Materials

Copper clad substrate material that is formulated to combine the property advantages of fluoropolymer organic chemistry with ceramic elements
PRODUCT FEATURE ORGANIC CERAMIC MICROWAVE SUBSTRATE MATERIALS TACONIC ADVANCED DIELECTRIC DIVISION Petersburgh, NY The ORCER family of copper clad substrate material is formulated to combine the property advantages of fluoropolymer organic chemistry with ceramic elements. The development of this technology has enabled the creation of a wide range of...
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A High Performance, Economical RF/Microwave Substrate

A polytetraflouroethylene-based RF/microwave substrate for high frequency applications
A High Performance, Economical RF/Microwave Substrate Taconic, Advanced Dielectric Division Petersburgh, NY During the past decade, the wireless industry has evolved from a predominantly military-driven market to a cost-conscious, consumer-driven commercial market. At the same time, wireless applications are moving up in the frequency spectrum. For example, personal communications...
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