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Multi-layer Thin-film MCM-D for the Integration of High Performance Wireless Front-end Systems

A new approach for the integration of high performance wireless front-end systems using multi-chip modules
Technical Feature Multi-layer Thin-film MCM-D for the Integration of High Performance Wireless Front-end Systems Thin-film multi-layer multi-chip module with deposited substrate (MCM-D) technology using the system in a package concept is presented as a viable approach for the integration of high performance wireless front-end systems. Due to the high...
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