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NMIC Introduces Industry’s First Aluminum Diamond Heat Spreader Material for GaN Devices

Nano Materials International Corp. (NMIC) introduced the first commercial device-level solution for dissipating the heat generated by high density semiconductor devices, such as gallium nitride (GaN) RF power transistors. When used as a heat spreader integrated with a device, NMIC’s new aluminum diamond metal matrix composites (MMCs), have demonstrated...
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