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New High Density RF Interconnect System

A new high density RF interconnect system using an elastomer interface has been developed to enable smaller connection form factors with low loss from DC to 40 GHz. It eliminates the pin and socket contacts and has no moving parts, a low compression ma...
As the size of components, boards and subsystems decreases, the connection interfaces often become a size limiting component so there is a need to reduce their footprint. There is also a need to increase the connection density in many existing systems or boards to get more data or signals...
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