ARTICLES

Cadence

Advances in EM Analysis and Design Flows for RF System Development

RF/mixed signal PCB systems and heterogeneous SiP technologies are increasingly susceptible to delayed product development turnaround times due to higher frequencies and component densities. This paper overviews the Cadence design platforms that provide seamlessly integrated EM and multiphysics/thermal simulation with the capacity to solve large-scale design and integration problems across IC, package, and board.


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