Mentor Graphics Corp. announced a comprehensive product-creation platform based on PADS® PCB software that enables individual engineers and small teams to solve the engineering challenges involved in creating today’s electronic products.
Mentor Graphics Corp. announced its newest HyperLynx® release which integrates signal and power integrity analysis, 3D-electromagnetic solving, and fast rule checking into a single unified environment.
Mentor Graphics Corp. announced new PADS® 3D tool capabilities plus major usability enhancements to the PADS flow for printed circuit board (PCB) design. The new technology provides visualization, placement, and design rule checking in 3D, minimizing iterations with mechanical and manufacturing teams. Schematic design and layout enhancements improve usability across the flow for increased user productivity.
Mentor Graphics Corp. announced the delivery of three new PADS® family products starting at unprecedented pricing of five thousand dollars to address the advancing needs of the independent engineer. The new PADS family provides for the wide spectrum of electronics complexity by combining ease of learning and use, characteristic of previous market-leading PADS products, with high-productivity design and analysis technologies and unprecedented price-performance value.
Mentor Graphics Corp. announced its newest version of the HyperLynx® Signal Integrity/Power Integrity (SI/PI) product for high-speed printed circuit board (PCB) designs. The HyperLynx product addresses high-speed systems design problems throughout the design flow—starting at the earliest architectural stages through post-layout verification.
Mentor Graphics Corp., released the Xpedition Systems Designer for multi-board systems connectivity. The product captures the hardware description of multi-board systems, from logical system definition to individual PCBs and automates multi-level system design synchronization processes.
Mentor Graphics Corp. announced its Xpedition™ Path Finder product suite, providing designers with the ability to assemble and optimize complex electronic systems, and thereby enabling improved design, increased chip performance, and cost efficiency. This product, the newest addition to the Mentor Graphics® Xpedition platform, supports a methodology that leverages layout data from the IC and board design teams to guide and automate IC package selection and optimization.