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Substrate Attach Design Guidelines for Bonding Alumina to Aluminum

Guidelines for two adhesives to determine the minimum bond line thickness required for a given substrate size to withstand thermal cycling effects
Substrate Attach Design Guidelines for Bonding Alumina to Aluminum In an effort to achieve higher density microelectronic packages, various ceramic substrate packaging techniques are being introduced. For instance, one of these techniques eliminates the need for a carrier so that a substrate is bonded directly to a housing. The...
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