ARTICLES

Extending the Performance and Frequency Envelope for QFN Packaging Technology

“High-performance, millimeter-wave MMIC products” and “cost-effective surface mount lead-frame-based packaging” typically don’t come up in the same conversation, and for good reason. Just two or three years ago, it was difficult to conceive of operating at frequencies above 20 GHz without considering an expensive, open cavity, HTCC package or resorting to more bespoke chip and wire assemblies.


Read More
See More Videos