Master Bond Inc.

Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical.

EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The epoxy is formulated with a specialty filler with a particle size ranging from 5 to 30 microns.

Master Bond EP3HT-LO is a heat cured epoxy with unlimited working life that passes ASTM E595 for NASA low outgassing. 

Master Bond EP114 is a low outgassing, heat cured adhesive that is used for underfill, coating, impregnating and porosity sealing applications.

Master Bond Supreme 11AOHTMed is a two component, non-cytotoxic adhesive featuring thermal conductivity and electrical insulation.

Master Bond EP17HTS-DA is silver filled, electrically conductive die attach adhesive that withstands high temperatures. 

Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured silicone. 

Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation.

Master Bond EP3HT-LO is a single component, heat cured epoxy, with reliable electrical insulation.

Master Bond EP5TC-80 is a low outgassing adhesive with high thermal conductivity and electrical insulation.