Cadence

Next-generation electronic systems often demand increased RF power within a smaller footprint to meet demanding performance and size requirements. This paper discusses the impact of operating temperature on RF device performance and presents a thermal analysis solution in which the Cadence Celsius Thermal Solver is integrated with the AWR Design Environment RF/microwave platform.

3D-ICs integrate many dies that are densely packed, which leads to heat generation that causes performance issues. This white paper helps designers understand the cross-fabric thermal challenges introduced by 3D-ICs and explains how the Cadence® Celsius™ Thermal Solver helps designers analyze and develop strategies to mitigate this impact.

This white paper discusses the importance of EM analysis and highlights various Cadence® EM solver technologies for high-frequency system design. Specific application examples showcase the benefits of using these technologies integrated within the Cadence AWR Design Environment® platform, specifically Microwave Office® circuit design software.

The focus of this white paper is on the general challenge of antenna design and simulation as implemented with antenna-in-package (AiP) and antenna-in-module (AiM) advanced packaging technology, as well as the software tools necessary for antenna, antenna array and feed structure, and front-end simulations.

In-car networks and advanced driver-assist systems (ADAS) present many design challenges to engineers. This white paper looks at Cadence® AWR Design Environment® software solutions for RF to millimeter-wave (mmWave) front-end component development that address electronic product development for automotive applications.

Accurate modeling and fast simulation of integrated passives on chips with growing RF content is critical. Read this Cadence white paper to learn how you can get highest-in-class accuracy and 10X faster EM simulation with foundry-certified technology.

RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design. Cadence offers the broadest, most integrated design solution to bring the Intelligent System Design™ strategy to the communication products of the future.

RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design. Cadence offers the broadest, most integrated design solution to bring the Intelligent System Design™ strategy to the communication products of the future.