Company Profile
Rogers Advanced Connectivity Solutions manufactures quality, high performance laminates. With manufacturing locations in the United States, Belgium and China, we supply proven laminate solutions for high frequency applications in the wireless base station, defense/aerospace, automotive, high-speed digital and advanced chip packaging markets across the globe. We take pride in our innovation to meet the evolving expectations of the electronics industry.
Contact Information:
Phone: (480) 961-1382
Fax: (480) 961-4533
Email: Click here to see email.
Website: http://www.rogerscorp.com
Location:
Rogers Corp.
100 S. Roosevelt Avenue
Chandler AZ 85226
United States
Rogers Corp. announced the latest addition to its RO4000® Series thermoset circuit materials: RO4830™ high-frequency laminates. RO4830 laminates offer 76 to 81 GHz auto radar sensor designers a lower-cost-but-performance-competitive option. Rogers RO4830 laminates have a lower price point and are processed by means of standard epoxy/glass (FR-4) circuit fabrication methods, for lower overall production costs versus PTFE-based circuits.
Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board.
Rogers Corp.’s Power Electronics Solutions (PES) group will be explaining and offering examples of its extended capabilities in applying data matrix codes for its various material-based product solutions at the upcoming PCIM Europe 2016 conference and exhibition. PCIM Europe 2016, one of the top global technical conferences and exhibitions for power electronics technology, is scheduled for May 10-12, 2016 at the Nuremberg Exhibition Centre, Nuremberg, Germany.
Rogers Corp.’s Power Electronics Solutions (PES) group has introduced its latest high-performance cooling material, curamik® CoolPerformance Plus. curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and provide reliable thermal management of high-power laser diodes and other heat-generating optical devices.
Rogers Corp.’s Power Electronics Solutions (PES) group will be showing examples of its latest advances in busbar power management technology at the upcoming APEC 2016 conference and exhibition, to be held March 20-24 at the Long Beach Convention & Entertainment Center in Long Beach, Calif
Rogers Corp., a global leader in engineered materials solutions, announced it has signed a definitive agreement to acquire Arlon, LLC, currently owned by Handy & Harman Ltd., for $157 million, subject to closing and post-closing adjustments. The transaction, which is subject to regulatory clearances, is expected to close in the first half of 2015. 
Rogers Corp.’s Advanced Circuit Materials Division, a global leader in Microwave Printed Circuit Board (PCB) Materials, recently introduced rolled copper cladding options with its RO3003™, RO3035™ and RO3203™ low dielectric constant laminate materials 
Rogers Corp. announced an addition to its RO4000® Series thermoset circuit materials: RO4830™ high-frequency laminates. RO4830 laminates offer 76 to 81 GHz auto radar sensor designers a lower-cost-but-performance-competitive option. Rogers RO4830 laminates have a lower price point and are processed by means of standard epoxy/glass (FR-4) circuit fabrication methods, for lower overall production costs versus PTFE-based circuits.
Rogers Corp. introduces RO4730G3™ UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.These flame-retardant (per UL 94V-0), thermoset laminate materials are an extension of Rogers’ dependable RO4000® circuit materials.
Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics.
Rogers RO4835 high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. RO4360G2 laminates have a tailored high Dk of 6.15 at 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets
Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.
Rogers Corp. advanced circuit materials division launched COOLSPAN® thermally & electrically conductive adhesive (TECA) film providing reliable high temperature performance. COOLSPAN TECA film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.
Rogers Corporation has achieved another technical first with its product line of PORON® urethanes. This unique PORON material enhancement, the Dura-Shape™ option, is a layer of polyester sealed between two layers of PORON foam which will help fabricators produce highly accurate gaskets. This new product is the solution that fabricators have been seeking in terms of improved die cutting for high performance gaskets and seals.
RT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized. It is a lightweight, PTFE-based composite optimized with a unique filler that provides very low density (1.37 gm/cm3).
The Durel Division of Rogers Corporation has announced an addition to its high-performance electroluminescent (EL) lamp driver integrated circuits (ICs) - D392A. The D392A EL lamp driver delivers the programmable output voltages needed to power a wide range of EL lamps, including in portable applications such as cellular telephones, data organizers and PDAs, remote controls, monochrome LCDs, and DFLX™ EL keypad lamps.
The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.
The Advanced Circuit Materials (ACM) Division of Rogers Corporation has introduced RO4360™ laminates, developed for the special requirements of high-frequency amplifier designers. RO4360 laminates feature a dielectric constant of 6.15 and loss of 0.003 at 2.5 GHz. The laminates are based on a ceramic-filled, thermoset resin system reinforced by glass fiber for excellent mechanical stability compared to PTFE woven glass.
The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730™ laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance.
Rogers Corporation will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA, including Theta™ printed circuit materials, ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® LoPro™ circuit board materials.Theta laminates and prepregs are environmentally friendly, high-performance FR-4 materials compatible with lead-free assembly processing.
More cushioning and sealing, less wasted space, enables thinner designs. As handheld devices decrease in size and increase in functionality, achieving the proper balance of sealing and protection with the requirements of an ultra thin application can be an extreme design challenge. To help address this need, Rogers Corporation has specifically engineered the PORON ThinStik family of self-adhesive solutions.
Rogers Advanced Circuit Materials (ACM) Division employees will be at IMAPS Device Packaging 2010, offering information on ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® circuit board materials, including the recently launched RO4360™ laminate (6.15 Dk), which many in the field believe is a very effective cost-down replacement for LTCC (low temperature co-fired ceramic) packaging designs.
Rogers has launched the groundbreaking RO4360 high frequency laminates, the latest addition to the RO4000® product family. RO4360 thermoset laminate materials are specially formulated to meet a Dk of 6.15 and exhibit a low dissipation factor of 0.0038 at 10 GHz. RO4360 laminates possess a Z-axis coefficient of thermal expansion of 30 ppm/°C (CTE) for dependable plated-through-hole (PTH) quality in multilayer circuit and package designs.
Rogers Corporation has developed the perfect prepreg match to its popular RO4360™ laminates: RO4460™ prepregs. Both materials feature consistent dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer amplifiers, antennas, and other high-frequency circuits where space is at a premium.
Rogers Corp.'s RT/duroid® 6035HTC is a high-thermal-conductivity (HTC) laminate material engineered for low loss in high power circuits. The fluoropolymer composite material is ideal for RF and microwave applications in military and high reliability (hi-rel) applications required to handle high power levels, such as power amplifiers. Rogers RT/duroid 6035HTC laminates feature a relative dielectric constant of 3.5 at 10 GHz.
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