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Industry News

Teledyne LeCroy introduces a new USB 3.1 end-to-end test suite

Teledyne LeCroy introduces the QPHY-USB3.1-Tx-Rx package for automated USB 3.1 transmitter (Tx) and receiver (Rx) compliance testing, characterization, and debug, creating a unique and comprehensive USB 3.1 test suite. With the new test package, USB 3.1 testing can be performed on both Gen1 (5 Gb/s) and Gen2 (10 Gb/s) devices under test according to the latest USB 3.1 specifications.


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Qorvo ups optical bandwidth with new GaAs process technology

Qorvo, Inc., a leading provider of RF solutions for mobile, infrastructure and aerospace/defense applications, announced a new gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT) process technology that provides higher gain/bandwidth and lower power consumption than competing semiconductor processes. 


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