- Buyers Guide
Mark Andrews is a writer, photographer, video producer and marketing consultant. He is AMC Solutions’ managing director and chief photographer. He began leading communications industry retail and B2B campaigns in 1993; his efforts enabled wireless operators to achieve full service commercialization across the Midwest, Mid-South and Pacific Northwest. He has led strategic and tactical communications planning, creative development, advertising, retail POS/tradeshows and customer retention design for a variety of companies including TriQuint, Cibernet, Sawtek, CenturyLink and Cellulink.Read More
IMS 2014 hits Tampa Bay on June 1-6, 2014, and I bet you will be there. One of the largest industry events, the show is a must visit. This year it will be my 23rd IMS – wow! If you’d ask: what has changed over the last 20 years? I believe the show today is more personal. With social media becoming commonplace in our industry, we’re more connected and we can build stronger relationships without borders.
MDL experts cover the waveguide and microwave technologies that are impacting the industry. From military radar systems to satellite communications, this blog will discuss the unique challenges engineers face within the microwave and RF fields. We will also examine current and emerging applications that rely upon waveguide technology including UAVs and advanced medical equipment.Read More
Rotary joints based on rigid waveguide can provide high-performance, dependable connections in many commercial and military RF/microwave systems. But matching the right waveguide rotary joint to a particular application can call for a bit of “rotary joint know-how” beyond simply selecting proper waveguide sizes. These are precision components that can help keep high-frequency signals connected under a variety of conditions, and are available in different waveguide sizes as well as compact, coaxial versions as needed.
Waveguide is a technology uniquely synonymous with high-frequency RF/microwave electronics. Described simply, it is a form of hollow conductive metal tube that carries energy from one point to another. For RF/microwave use, it handles electromagnetic (EM) energy; forms of waveguide have also been used to carry acoustical and optical energy. Waveguide can be used to fashion a wide range of RF/microwave and even millimeter-wave components, including transmission lines, couplers, power dividers, and filters.
Richard applies his technical background as an engineer and journalist for various engineering magazines to his position as international editor. Serving as MWJ’s liaison to the international microwave community, Richard files his monthly international report and contributed articles from our London office.Read More
The flavour of the third Microwave & RF Show that took place at the CNIT, Paris on 19 and 20 March was as French as foie gras and crème brûlée. The focus of the event was very much on the local RF, Microwaves, Wireless and Fibre optics community.
The European RF and microwave industry is demonstrating its support for EDI CON 2014 at every opportunity, from the conference sessions, workshop presentations and the showcasing of the latest innovations on the show floor.
David Vye is responsible for Microwave Journal's editorial content, article review and special industry reporting. Prior to joining the Journal, Mr. Vye was a product-marketing manager with Ansoft Corporation, responsible for high frequency circuit/system design tools and technical marketing communications. He previously worked for Raytheon Research Division and Advanced Device Center as a Sr. Design Engineer, responsible for PHEMT, HBT and MESFET characterization and modeling as well as MMIC design and test. David also worked at M/A-COM's Advanced Semiconductor Operations developing automated test systems and active device modeling methods for GaAs FETs. He is a 1984 graduate of the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.Read More
The RF/microwave semiconductor market is poised to undergo some major shifts in the not too distant future with recent news of mergers between leading GaAs-based integrated device manufacturers, RFMD and TriQuint, CMOS-based RF front-ends for multi-mode, multi-band mobile devices from Peregrine and Qualcomm and the continued success in commercializing GaN by a number of vendors. As GaN and CMOS semiconductor processes continue to improve performance and reduce costs, market share will undoubtedly shift between players.
Last night my family and I watched the updated version of Carl Sagan’s television series “Cosmos” with new host Neil Tyson. Coupled with the national excitement over the Apollo moon missions, the original show was an amazing television experience that encouraged a generation of young people in the 1960’s and 70’s to pursue careers in science and related fields.
Join industry and research leaders from around the world to discuss the future of RF and wireless design and test at NIWeek Aug 4-7 in Austin, TX. Topics include wireless technologies, 5G communications technologies, advanced testing techniques, trends in microwave design, RF characterization, high volume test, and wireless communications design.
In the first half of the year, MACOM has acquired Nitronex, Avago has acquired LSI, RFMD and TriQuint are merging, Cobham is acquiring Aeroflex, and most recently announced, Analog Devices is acquiring Hittite. My head is spinning with all of this consolidation, not to mention several other smaller acquisitions that happened during this period. What is going on in the RF industry? An industry that has been mostly made up of smaller to medium sized companies seems to be going large with all of these organizations turning into multi-billion dollar companies.
As IMS 2014 in Tampa wraps up, the powering the waves theme was very present starting with the kickoff reception party on Monday featuring a water skiing show staring general chair Larry Dunleavy. Larry and his team did an excellent job of running the event and the Tampa Convention center is a nice venue with close proximity to the session rooms and exhibition (not to mention it is right on the water with a great view).
The printed-circuit-board (PCB) material plays a major role in how microstrip transmission lines perform their duties in RF and microwave circuits, and it can be helpful to understand how certain PCB material characteristics contribute to the ways that microstrip transmission lines and their coupled features perform in these different high-frequency components.
Designing high-frequency microwave circuits and, with increasing frequency, millimeter-wave frequencies require for the most part laying out carefully conceived transmission lines to carry those high-frequency signals across a printed-circuit board (PCB). Of course, if the task of fabricating the PCB was simply a matter of adding circuit elements, such as resistors, capacitors, and inductors, to create the necessary frequency-domain/time-domain response for the PCB, it might go somewhat easier. But every PCB with high-frequency transmission lines must also manage any number of circuit discontinuities and junctions. Since these and similar discontinuities can be found on all but the simplest of RF/microwave circuits, the question is “How can the effects of these discontinuities be minimized through the thoughtful choice of PCB material?”
RF/microwave power applied to a printed-circuit board (PCB) will generate heat. A key to designing a practical circuit on a given PCB material is to understand how different circuit material properties can impact the heating patterns on an RF/microwave PCB, and to work within the limits of a high-frequency circuit material.
The Tek Talk blog features contributions from a collection of RF and microwave test and measurement experts at Tektronix. The focus is on providing tips and strategies to help RF designers and engineers perform measurements more effectively, whether they are engaged in WLAN, radar and electronic warfare, EMI conformance testing or spectrum management.Read More
As the spectrum becomes more and more crowded, detecting sources of interference is tougher than ever and only becoming more challenging. Therefore it’s critical that spectrum managers are well-equipped to perform accurate spectrum measurements and quickly chase down interference signals. Here are 10 tips that will help anyone working in the spectrum management field improve off-air spectrum test and measurement.
Wireless communications industry veteran Justin Panzer brings his insights to this edition of the Tek Talk blog. He has more than 19 years of industry experience, including 10 years in test and measurement working on everything from commercial handset testing to mil/gov RF. He is currently business development director for the Sources & Analyzers Product Line at Tektronix. He holds a Bachelor of Science from Drexel University and an MBA from Auburn University.
Ubiquity of wireless communications is adding an RF component to electronics designs that haven’t historically been wireless enabled. More complex chip, board and embedded systems designs that incorporate communications technologies into everything from PCs to automobiles are changing the impact of RF on the world's R&D engineers. Designers today need the tools to get the most out of unfamiliar technologies.
Brian Hendren, Senior RF and Microwave Applications Engineer, Tektronix Component Solutions takes over the Tek Talk blog and discusses prototyping for success:
In this day and age manufacturers are trying to drive costs out of every aspect of the production flow, and RF and microwave is no exception. That means that every process step gets closely scrutinized. Specifically,“test” is one of the operations constantly under evaluation to understand the bare minimum needed to verify performance. That approach is understandable because test is likely one of the most time consuming steps in the production flow, particularly when you include system set up time.
Judy Warner is currently the Director of Sales and Marketing for Transline Technology, Inc. in Anaheim, CA. Judy has been in the Printed Circuit Board industry for nearly two decades. Her career began with Details, Inc. (later to become DDi). She was a Top-Producing Sales Professional for 10 years for Electroetch Circuits (later to become Tyco, then TTM). She has also spent several years as an Independent Sales Representative including time as the owner of her own Rep firm, Outsource Solutions.Read More
If you were fortunate enough to attend IMS 2014 in Tampa, I hope the packing guidelines in my last post were helpful. But, whether you made or not, I thought you might enjoy nosing through my metaphorical “backpack,” once again, to see what memories and lessons I brought back from my whirlwind week to Florida. (Warning: This backpack is huge, untidy, and bulging at the seams!)
Not a single year of the MTT-IMS show goes by where I don’t feel completely inundated going in and overwhelmed coming out. It reminds me of feasting at a massive buffet in which I must pace myself, plan ahead and choose wisely. The only thing that saves me is careful packing—and I don’t mean my toothbrush and dental floss!
Well, it’s that time of year again, when many of us turn our attention toward the MTTS-IMS show. Besides all the technical sessions and New Product Introductions that many of us look forward to, the rare opportunity to see one another face-to-face is highly anticipated. Our mass convergence on Tampa this year will be no exception. While the Microwave universe is a comparatively small one, we are spread widely across the country and globe. For this reason, we eagerly await the chance to meet up at the IMS show year after year.
Sherry Hess is vice president of marketing at AWR, bringing with her more than 15 years of EDA experience in domestic and international sales, marketing, support, and managerial expertise. For the majority of her career Sherry served in various positions at Ansoft Corporation including director of European operations and later as vice president of marketing. Before joining Ansoft, Sherry spent two years with Intel Corporation, where she worked in the ASIC Group and developed relationships with companies such as Bell Northern Research and Northern Telecom. Sherry holds a BSEE and an MBA from Carnegie Mellon University in Pittsburgh, Pennsylvania, USA. www.awrcorp.com.Read More
I recently agreed to co-chair the IEEE MTT-S Women in Engineering (WIE) / Women in Microwaves (WIM) organization. I have long been an advocate for advancing the cause of women in the world of RF and microwave engineering, actually back to my college days at Carnegie Mellon University (CMU) when I was one of only eight women in my EE graduating class of 110. Things have not improved much since then with women representing only 10 percent of the engineers in the U.S. today. Asia and Europe fair far better with approximately 40 percent and 20 percent respectively.
A few months ago, I heard a news program on NPR about the Khan Academyand how it was started accidentally by Mr. Khan to help his niece with her math homework. Since he lived far away from her, he captured his helpful hints via YouTube and shared via the Internet. One thing led to another and now Khan has found himself the creator of something big.
A collective blog from the experts in measurement and design, discussing the latest tools for circuit-level modeling through system verification for General RF/uW, 4G Communications, and Aerospace/Defense applications. Learn about these applications and the EDA simulation software, test and measurement equipment and techniques behind state-of-the-art RF, microwave and high speed design.Read More
With over 25 years of new product introduction, manufacturing and support experience, Duane Lowenstein, Business Development Manager, Americas
Agilent Technologies, has assisted many Fortune 500 companies in improving their business results by assisting in the implementation of leading-edge operations theory and processes improvements using Agilent’s hardware, software and solutions.
Currently Duane is engaging with customers to deliver Manufacturing Process Consulting (MPC), Test Process Consulting (TPA), Instrument Migration Planning Services (IMPS), Cost of Test solutions (COT) and, Test simulation and Diagnostic Software (FD). His experience has spanned many industries including computer, wireless, automotive, aerospace and defense, as well as commercial electronics. His focus on measurable results has led customers to dramatic reductions in the cost of test, test time, reduction in work- in-progress and increasing yields while growing the Agilent presence in the account.
Eric Taylor is Vice President of Customer Experience and Quality at Agilent Technologies. He joined the company in 1992 at the former Colorado Springs Division. He held a variety of positions before being promoted to product support manager in the Electronic Measurements Division in 1997, where he worked on several cross-EMG processes, such as out-of-box defects. Over the next four years, he held several division marketing positions, including sales and business development manager for the Measurement Products Unit, and division marketing manager for the former Basic, Emerging, System Test (BEST) Division.
Todd Cutler is General Manager at Agilent Technologies’ EEsof organization, responsible for worldwide Marketing, Services, and the ESL Business. Agilent’s EEsof EDA is the industry leader in high-frequency design software. The division’s revenue places it in the top 5 EDA companies.
During Todd’s 30-year career, he helped found the EDA division, which began in 1986 as the computer aided engineering group within Hewlett Packard’s Test and Measurement group. In 1998, Cutler later left H-P to be CEO of Eagleware Corporation, the EDA company that pioneered the affordable Genesys RF and microwave design software. In 2005, he joined Agilent Technologies following its acquisition of Eagleware. Todd earned a BEE from Georgia Tech and an MSEE from Stanford University.
Todd gives us a few of his thoughts as he travels in China.