Blogs

Hindle

Pat Hindle, MWJ Editor

Giving Back to Our Communities

Microsemi leads by its actions

We don’t talk very much about local community service and high quality company culture as a technical magazine. I was lucky enough to be invited to a Microsemi reception yesterday afternoon where they showed their commitment to the local Lawrence and Lowell community at their manufacturing facility in Lawrence, MA.


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RF Power Semiconductor Market Trends

From Yole Développement

Yole Développement just released a comprehensive report on the RF power device market and here are the highlights from their article. They expect the market to recover in coming years due to increasing demand for telecom base station upgrades and small cell implementations. Overall market revenue could potentially increase 75% by the end of 2022, posting a CAGR of 9.8% from 2016-2022.


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RichardMumford

Richard Mumford, MWJ International Editor

Gary Lerude

Gary Lerude, MWJ Technical Editor

Weekly Report

For the week ending August 18, 2017
A weekly summary of company, product, market and technology news for busy people.
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Weekly Report

For the week ending August 11, 2017
A weekly summary of company, product, market and technology news for busy people.
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Weekly Report

For the week ending August 4, 2017
A weekly summary of company, product, market and technology news for busy people.
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Janine Sullivan Love

Janine Sullivan Love, Events Director and Contributing Editor

MWJ Editors Lead Expert Panels on 5G at EDI CON CHINA

Panelists set to debate the latest in 5G technologies and RF PA design
This is the fifth year for EDI CON CHINA, and intrepid Microwave Journal editors, Patrick Hindle and Gary Lerude, will be leading panels addressing the evolution of wireless infrastructure networks from LTE to 5G. (Lerude will also be leading a panel on the range of market applications for GaN,during a workshop sponsored by Richardson RFPD on Wednesday afternoon at 14:50.)
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Profiles in Innovation: Tom Sikina, Raytheon Co.

Innovation is a major focal point at EDI CON USA 2016, which will bring together industry leaders to discuss creative ways to address today’s engineering challenges in RF, microwave, and high-speed digital design. Tom Sikina, principal engineering fellow at Raytheon Co. will be giving the plenary keynote this year, “Innovation in Phased Arrays; Past, Present, and Future” on Tuesday, September 20th. In advance of Tom’s talk, I thought it might be interesting to get to know him better, so I asked him to help kick off our Profiles in Innovation series.


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5G

5G

Is millimeter wave technology future of wireless communications?

In the age of digitalization, high-speed communication is on higher priority for all (consumers and enterprises). What if the wireless carriers impose caps on the rapidly growing data traffic and raise prices? What if we run out of airwaves for our striking increase in wireless data usage on our gadgets? So, how are these basic realities – high-speed communication needs, bandwidth shortage, and exploding data on several devices are addressed?


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IoT

Low Power IoT

Open cellular standards will drive ‘massive IoT’ uptake

Several technologies are vying for a slice of the LPWAN sector that will underpin the IoT, but only low power LTE promises to support rapid mass deployment

The Internet of Things (IoT) will require several wireless technologies if it’s to meet its potential. For example, Bluetooth low energy or IEEE 802.15.4 are good choices for battery-powered sensors sending data to the Cloud via a building’s Local Area Network (LAN). But for sensors that are constantly moving, or are remote from a LAN, short-range wireless technologies run into problems.


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Kimery

5G and Beyond - National Instruments

Putting 5G to the Test

As the 3GPP standardization body moves toward finalizing the first 5G specifications in December of this year, several challenges lie ahead on the road to making 5G the transformative catalyst industry experts have been predicting. Perhaps overlooked in the 5G excitement are the daunting challenges instrumentation companies face to meet the commercialization timelines.


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Bringing 5G PAWR to the People

White House OSTP and NSF Bridge the Gap Between Academia and Industry in Wireless Communications Research

Last July, the White House Office of Science and Technology (OSTP) and the National Science Foundation (NSF) along with 26 founding companies announced their intention to build four testbeds in locations across the United States. Learn more about these efforts in this posting.


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Brent Dietz

Brent's Musings

Beating the Summer Heat

Feel like it's too hot this summer? Well, we're not the only ones sensitive to the heat. Qorvo's Brent Dietz reminds us that RF systems can become temperamental when they get too hot and often require special technologies to keep running as advertised.


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Survive the Wave of 5G Hype

How to surf the 5G wave in Hawaii

The waves surrounding Hawaii next week may be dwarfed by the tsunami of hype about 5G expounded at the International Microwave Symposium. Worried that you might get swept out to sea, Qorvo's Brent Dietz offers this cautionary perspective.


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Leger

Jaime Leger

Welcome to EDI CON USA!

The first-ever Electronic Design Innovation Conference (EDI CON USA), sponsored by Microwave Journal, is just about here! For those planning to attend the show at the Hynes Convention Center in the heart of Boston, between the technical conference sessions and the exhibition hall you can expect a lot of industry presence and activities to fill your time. Boston Awaits You!


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Make The New Year One To Remember

It is that time of year, at the start of a new year, to take stock of our time: our past, present, and future. Without becoming too philosophical, the break that many individuals and their companies take during the year-end holidays and into the New Year gives most people pause to think about their lives, whether they are goal-oriented or simply trying to figure out where they are in life and in their professions.


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rog_blog

ROG Blog

The Role of PCB Materials in Printed-Circuit Impedance

Printed circuits for high-speed and high-frequency applications rely on fine-featured transmission lines for signal transmission. Ideally, the loss through these transmission lines is minimal, and this requires an electrical impedance that is consistent and without interruptions, and with a value most appropriate for the types of signals to be transferred through the circuit. However, a number of factors can affect the impedance of a PCB, including the physical and electrical characteristics of the circuit and circuit material, but by reviewing and better understanding these variables, their effects can be minimized.


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Finish Makes a Difference in Final PCB Performance

The impact of final surface finish on circuit loss will depend not only on the type of surface finish but on the thickness of the substrate material and the type of transmission-line technology, such as microstrip or grounded coplanar waveguide (GCPW). This posting will describe some of the effects of various finishes.


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Keysight logo-129 px

Keysight: expert to expert