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Industry News

Microsemi Launches Cost-Effective, High Performance Plastic Packaged PIN Diode Control Devices

Microsemi Corp. announced the availability of a series of new plastic packaged PIN diode control products, leveraging the company's 50-year history supplying PIN diode products for challenging RF power, small-signal switching and receiver power limiting functions. The new devices are cost competitive and provide higher RF functionality, helping defense, aerospace and medical customers reduce BOM costs with low risk and little sacrifice to performance.


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Huawei Honors Qorvo With Partner Awards

Qorvo,® announced it has been awarded Huawei's Best Collaboration Partner Award and Core Partner Award. The awards were accepted by Bob Bruggeworth, president and CEO of Qorvo, during a formal ceremony at Huawei's headquarters in Shenzhen, recognizing Qorvo's contribution as an outstanding supplier of RF solutions to Huawei.


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Analog Devices Acquires Laser Beam Steering Technology from Vescent Photonics

Analog Devices (ADI) announced the acquisition of the solid-state laser beam steering technology from Vescent Photonics Inc.. Vescent's innovative non-mechanical beam steering technology enables more robust integrated LIDAR systems that overcome many of the major drawbacks associated with today's bulky mechanical offerings, such as reliability, size and cost.


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Richardson Electronics and United Silicon Carbide Sign Distribution Agreement

Richardson Electronics Ltd. announced a new distribution agreement with United Silicon Carbide Inc., a leading manufacturer for SiC devices located in Monmouth Junction, New Jersey. This global agreement supports the expansion of USCi’s products to new customers. United Silicon Carbide, inc. is a semiconductor company specializing in the development of high efficiency Silicon Carbide (SiC) devices and customized products with process expertise in Schottky Barrier Diodes and SiC switches.


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Keysight, ASELSAN Sign 5G R&D Strategic Partnership Memorandum of Understanding

Keysight Technologies Inc. and ASELSAN Elektronik Sanayi ve Ticaret A.Ş., Turkey, announced the signing of a memorandum of understanding (MOU) to establish a strategic partnership on research and development of 5G communication technologies. Both parties are committed to working together on 5G enabling technologies—especially on active antenna systems and remote radio heads, as well as prototype verification platform integration and characterization capabilities, with a goal of enhancing future 5G wireless communication innovations.


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