Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Mitsubishi Electric Corporation is expanding its line of GaN HEMTs to add devices with 70 and 100 W output power at Ku-Band, developed for satellite earth stations. Samples will be available beginning October 1, with full availability by January 1, 2017.
Custom MMIC, a leading developer of performance driven monolithic microwave integrated circuits (MMICs) is pleased to announce attendance at European Microwave Week 2016. Custom MMIC products will be on display with their UK representative, Aspen Electronics, at European Microwave Week (EuMW) in London, October 3-7. Stop by the Aspen Electronics Stand #121 to learn about our advanced, high performance MMIC products covering frequencies from DC-50 GHz including amplifiers, switches, mixers and more.
Antenova is no stranger to requests from its customers to cram its tiny antennas into various M2M and Internet of Things (IoT) applications, from wearable glucose monitoring sensors to SMART watches and even the latest SMART Bluetooth enabled solar-powered bike U-clamp locks from Lattis.
EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, hosted a successful inaugural event in the U.S. on September 20-22 in Boston, Mass.
Integra Technologies Inc. (ITI), a leading designer & manufacturer of high-power RF transistors, pallets and amplifiers, will be presenting two technical papers at EuMW 2016, taking place October 3-7 at the London ExCel in London, UK.
Computer Simulation Technology AG (CST) announces the acquisition of Aurora Software and Testing, SL (AURORASAT), a technology leading provider of tools for the analysis, synthesis and design of passive microwave components.
ARC Technologies of Amesbury Mass., announced a new family of dielectric controlled polymeric materials for injection molding, thermoforming and composite applications. The material includes formulations with a wide variety of electrical properties.