Amphenol Printed Circuits (APC) will once again be bringing examples of their printed-circuit-board (PCB) design and manufacturing skills to the RF/microwave industry’s major annual technology event, 2026 IEEE MTT-S International Microwave Symposium (IMS), June 9–11, at the Thomas M. Menino Convention & Exhibition Center in Boston.

Exhibiting as part of Booth #16054, APC will offer visitors detailed views of high performance PCBs, including ruggedized RF/microwave applications and high speed-digital (HSD) circuits.

APC will provide examples of high-performance PCBs for terrestrial, maritime and space applications, fashioned with its flex, rigid and rigid flex circuit materials. Boards cover a wide range of applications, from tiny surface-mount-technology (SMT) assemblies supporting reduced size, weight and power (SWaP) requirements to special large-format projects. One of these larger assemblies is over 40 inches in length but features tightly amplitude- and phase-matched channels to support the most demanding radar and satellite requirements.

Colby Hobart, APC’s RF Applications engineer, will be at Booth #16054 to update visitors about APC’s advanced circuit materials and technologies. As Hobart explains: “Most engineers are searching for ways to make things smaller, such as for reduced SWaP. But we have also had design and manufacturing inquiries for PCBs headed in the opposite direction. We will be showing examples of large-format PCB assemblies based on advanced materials that meet challenging amplitude and phase specs as required for radars, satellites and other systems with densely populated PCBs.”

Hobart will participate in an industry workshop scheduled for Thursday June 11, 1:30-3:10 pm Room 154 –  “Next-Generation RF Components: Strategies to Minimize Loss, Noise, and Distortion,” joining five fellow technology experts from different Amphenol business units. Learn more about APC at the 2026 MTT-S or by visiting www.amphenol-apc.com.