Amphenol Printed Circuits (APC) will be offering a small but impressive sample of its design, manufacturing and test capabilities in RF printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition. Visitors to booth #1126 in the Moscone Center can see examples of PCBs for commercial and military applications, including high speed-digital (HSD) circuits to 25 Gbps, RF/microwave planar antenna arrays and beamforming networks to 40 GHz and beyond and hybrid combinations of analog, digital and RF/microwave assemblies precision designed, assembled and tested in APC’s facilities in Nashua, N.H., Mesa Ariz., and Nogales Mexico, delivering full turnkey assembles.
Maintaining strong relationships with leading circuit material suppliers and leveraging Amphenol’s vast portfolio of RF connectors and components, Amphenol Printed Circuits has designed and manufactured PCBs and backplanes for commercial and mission-critical military applications for more than 30 years. Based on the latest low-loss rigid, flex and rigid-flex circuit materials and with low-profile copper, these cost-effective circuit solutions serve the most challenging requirements in aerospace/defense, industrial, space and telecommunications applications.