Finmeccanica Security & Information Systems Division has signed a contract to replace the old air traffic control radars at 12 major Canadian airports including Toronto, Montreal, Ottawa, Vancouver and Calgary.
Efficient Power Conversion (EPC) announced that its CEO Alex Lidow was selected as the recipient of the 2015 SEMI Award for North America for the innovation of power device technology, enabling the commercialization of GaN. Dr. Lidow was honored for his work in the area of Process and Technology Integration.
Anritsu Corp. released its new high performance waveguide mixer MA2806A to expand millimeter wave measurement solutions. Connecting the new MA2806A to Anritsu’s signal analyzer MS2830A supports spectrum measurements in the 50 to 75 GHz Band (V-Band) currently used by various millimeter wave sensors, WiGig Gigabit Wireless LAN (802.11ad), and broadcast video camera streaming equipment.
Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.
Keysight Technologies Inc. introduced the Keysight Distinguished University Program; a program designed to identify and acknowledge educational excellence in creating industry-ready engineers. The program provides a strong level of cooperation and support between each participating University and Keysight. The program also creates a process to engage students in industry-related projects based on the latest technologies.
Nokia and Alcatel-Lucent celebrate their first day of combined operations, marking the completion of Nokia's latest transformation and the creation of a global leader in technology and services for an IP connected world.
Communications & Power Industries LLC, Beverly Microwave Division, a major supplier of microwave and millimeter wave components and subsystems, announced it has signed an agreement with C-Wave, a manufacturer’s representative located in Los Angeles, Calif.
Qualcomm Inc. and TDK Corp. announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd.
Rogers Corp.'s Power Electronics Solutions (PES) group plans a strong presence at the upcoming SPIE Photonics West Conference and Exhibition, set for February 13-18, 2016 in San Francisco’s famed Moscone Center.