Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS® PE4314, a 75-ohm glitch-less RF digital step attenuator (DSA). This new DSA extends Peregrine’s existing glitch-less DSA portfolio to 75 ohms. The PE4314 is ideal for wired broadband applications in cable/satellite customer premises equipment (CPE) and infrastructure equipment.
Qorvo®, a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, announced that Qorvo's recently launched RFPA55X2 Wi-Fi power amplifier (PA) family is enabling many of today's leading home and business WLAN networking devices.
e2v and Peregrine Semiconductor announce strategic reseller agreement, where e2v will be the worldwide supplier of Peregrine’s high-reliability RF products for the space market. The agreement extends e2v's broad product offering from RF to the back end, including data converters, memory and high-performance data processing.
FormFactor Inc. and Cascade Microtech Inc. announced that they have entered into a definitive agreement under which FormFactor will acquire all outstanding Cascade shares in a cash and stock transaction.
Researchers at HRL Laboratories, LLC, have achieved the first demonstration of gallium nitride (GaN) complementary metal-oxide-semiconductor (CMOS) field-effect-transistor (FET) technology, and in doing so have established that the semiconductor’s superior transistor performance can be harnessed in an integrated circuit.
Qorvo®, a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, announced it has expanded its broad portfolio of Wi-Fi products to include new front end modules (FEMs) designed for wireless broadband home gateways and set-top-boxes. Qorvo is an innovator in highly integrated front end modules for Wi-Fi that combine best-in-class performance with up to 3.2 watts of power savings.
II‐VI Inc., a leader in semiconductor lasers, announced that it signed agreements to acquire EpiWorks Inc. and ANADIGICS Inc. These two businesses that will expand II‐VI's technology platforms and production capacity for semiconductor lasers with a scalable 6‐inch epitaxial growth and wafer fabrication platform.
Efficient Power Conversion (EPC) announced that its CEO Alex Lidow was selected as the recipient of the 2015 SEMI Award for North America for the innovation of power device technology, enabling the commercialization of GaN. Dr. Lidow was honored for his work in the area of Process and Technology Integration.
Qualcomm Inc. and TDK Corp. announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd.