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Software/EDA Channel

Software/EDA related topics


Modelithics' new CLR Library for ANSYS HFSS released

The Modelithics® CLR Library for ANSYS HFSS has just been released and contains over 270 resistor, inductor and capacitor (RLC) component families as Microwave Global Models™.  These models represent nearly 9,000 RLC components from the leading vendors. Modelithics models are measurement-based equivalent circuit models that accurately predict substrate and pad parasitic effects on surface mount components over frequency.

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COMSOL releases latest version of software for creating simulation apps

COMSOL Inc. announced the release of COMSOL Multiphysics® version 5.2 providing the simulation community the only fully integrated environment for creating simulation apps. This version of COMSOL Multiphysics® and COMSOL Server™ simulation software environment delivers new features, improved stability and robustness and faster execution.

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Remcom announces update to Wireless InSite EM Propagation software

Remcom announces a new version of Wireless InSite®, its site-specific radio propagation software for the analysis of wireless communication systems. This version, Release 2.8, supports the import of KMZ and COLLADA geometry files. It also provides several other enhancements, including significant speed improvements to the processing of terrain and city geometry, enabling simulations that include larger or more complex urban scenes.

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Training/User Meetings

COMSOL Training Courses

Training/User Meetings

FEKO Short Course

Bothell, WA
United States

Training/User Meetings

CST Workshops and Trainings

CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

FEKO Webinar Series 2015


We have covered some very interesting topics so far this year and the recordings of each is available here.  To keep up to date with our webinars subscribe to our bi-monthly newsletter and updates.

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Designing X-Band PAs Using SMT Plastic Packaged GaN Transistors


Keysight Logo    Innovations in EDA Webcast

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Trade Shows

DesignCon 2016

Santa Clara Convention Center
Santa Clara, CA
United States

Overview of FEKO Suite 7.0


Technical Education Webinar Series

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Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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Co-Simulation With Visual System Simulator and LabVIEW for Enhanced Signal Processing

This NI AWR Design Environment™ white paper describes co-simulation capabilities of Visual System Simulator™ (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.

Discover a Streamlined Path to Record and Playback

RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.


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