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Software/EDA Channel

Software/EDA related topics

ARTICLES

Keysight Technologies to demonstrate at CSICS

 Keysight Technologies Inc. announced it will demonstrate its latest RF circuit, system and 3D electromagnetic design and simulation solutions at the Compound Semiconductor IC Symposium (CSICS 2014), Hyatt Regency La Jolla at Aventine, San Diego, California, Oct. 19-22. Keysight EEsof EDA is a silver-level sponsor of the event. 


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Langer's ChipScan-ESA software for measurements with a spectrum analyzer

 The ChipScan-ESA analysis software from Langer EMV-Technik GmbH has been designed for the clear and comparable recording of a spectrum analyzer's measurement curves (system requirements: Windows XP and later). It allows the user to visualize measuring curves quickly and interactively, perform complex analyses and export the curves easily 


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Altium announces Altium Designer 15 to ease high speed PCB design woes

 Altium Ltd., a global leader in electronic design automation, native 3D PCB design systems (Altium Designer) and embedded software development toolkits (TASKING), announced the upcoming release of its professional printed circuit board (PCB) and electronic system level design software, Altium Designer 15. 


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CST STUDIO SUITE 2015 combines synthesis and simulation

Software/EDA

Computer Simulation Technology AG (CST) previewed the upcoming version of its flagship electromagnetic simulation tool, CST STUDIO SUITE® 2015, at European Microwave Week (EuMW) 2014. 


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Anite acquires Xceed Technologies

 Anite, a global leader in wireless network testing technology, announced the acquisition of Xceed Technologies Inc., to meet the growing market requirements for data analysis and post-processing and to further expand its network testing product portfolio.  


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Silicon Labs unveils beta program for Thread software

 Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, introduced the creation of a thread beta program for selected customers and ecosystem partners, enabling them to accelerate their product development plans for IP-based mesh networking. As a founding member of the Thread Group, Silicon Labs has been a major contributor to the definition and development of the new IP-based mesh networking software stack for the Connected Home. 


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CST introduces new filter synthesis tool

Computer Simulation Technology (CST) has added Filter Designer 2D to CST STUDIO SUITE®, allowing the synthesis, electromagnetic simulation, optimization and multiphysics analysis of filters in one single environment


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Tech-X to offer free VSim training

 Tech-X Corp. will be holding a free VSim Training Session in Boulder, Colo. for two days starting October 22 at 9 a.m. A free work day will be available the following day on October 24. 


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Version 11.3 of Modelithics COMPLETE Library for NI AWR Design Environment

Software/EDA

 Modelithics, Inc., announced this year’s major release of the Modelithics COMPLETE Library, version 11.3 for NI AWR Design Environment Microwave Office circuit design software. 


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NI AWR to feature software demos, MicroApps, PA Forum & more at EuMW

 Welcome to NI AWR Booth #103. At the booth, we will be showcasing a wide variety of software demonstrations of our recently released V11 NI AWR Design Environment™, which includes Microwave Office, Analog Office, Visual System Simulator™ (VSS), AXIEM, and Analyst™ for the design of MMICs, RF PCBs, microwave modules, RFICs, communication systems, radar systems, antennas and more. 


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EVENTS

Training/User Meetings

COMSOL Training Courses

Training/User Meetings

FEKO events calender

Training/User Meetings

CST Workshops and Trainings

CST
CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

Trade Shows Training/User Meetings

NIDays 2014

10/15/14

National Instruments      Training/User Meeting

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Webinars

Power Delivery Network (PDN) Analysis

10/30/14

CST
CST 2014 Webinar Series

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Webinars

Simulation for EMC Performance in Modern Electronics

11/6/14

CST
CST 2014 Webinar Series

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DOCUMENTS AND FILES

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.

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