Keysight Technologies Inc. introduced N1930B Physical Layer Test System (PLTS) 2015, the latest release of its premier signal integrity test software for designing and validating high-speed digital interconnect.
Remcom announces PinBuilder™ electromagnetic model automation for XFdtd® EM Simulation Software. PinBuilder, which automates the creation of pin-field breakout models for XFdtd simulations, will be available in the software later this year.
Cascade Microtech Inc. announced Velox 2.0, the latest version of their probe station control software. Combining the ease of Nucleus™ with the power of ProberBench™, Velox 2.0 delivers new levels of test and measurement efficiency to accelerate time to job completion.
Featuring silicon RFIC interoperability with Cadence’s Virtuoso, GoldenGate-in-ADS and a host of capabilities intended to increase design efficiency, the Keysight EEsof EDA software,ADS 2015, is changing how silicon RFIC and multi-technology module design is performed.
Keysight Technologies, Inc. announced comprehensive pulsed radar analysis software. The new 89600 VSA software’s pulse analysis option (BHQ) is used in radar and electronic counter measure applications for capturing and analyzing threats and jamming responses.
COMSOL, Inc. announced the release of COMSOL Server™, a new product developed specifically for running applications built with the Application Builder. The Application Builder allows COMSOL Multiphysics® software users to build an intuitive interface around their COMSOL model that can be run by anyone — even those without prior simulation experience.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.