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Software/EDA Channel

Software/EDA related topics

ARTICLES

COMSOL releases COMSOL Multiphysics version 5.1

COMSOL, the leading provider of multiphysics modeling and simulation software, announced the release of the COMSOL Multiphysics® software version 5.1, the first and only integrated simulation environment for building multiphysics models and for creating and sharing easy-to-use simulation apps.


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COMSOL opens new office in Moscow, Russia

COMSOL, the leading provider of multiphysics simulation and analysis software, announced the opening of a new office in Moscow, Russia. The new office provides sales and support for the growing community of COMSOL Multiphysics® users in Russia. Services include local sales, technical support, training sessions, and on-site workshops, seminars and customer visits.


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DfR Solutions announces Sherlock 4.0 with powerful new modeling features

DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, announced the release of the most advanced version of Sherlock Automated Design Analysis™ software, version 4.0. The newest version of Sherlock allows users to model complex PCBs and components with exceptional detail, strengthening design decisions, saving significant time and money.


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Keysight’s signal studio software simplifies MESG for A & D applications

Keysight Technologies Inc. announced N7660B Signal Studio for multi-emitter scenario generation (MESG). The software provides aerospace/defense engineers with performance-optimized, Keysight-validated multi-emitter signals that they can download to one or more Keysight N5193A UXG agile signal generators for effective testing of electronic countermeasures (ECM) systems.


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EVENTS

Training/User Meetings

COMSOL Training Courses

Training/User Meetings

FEKO events calender

Training/User Meetings

CST Workshops and Trainings

CST
CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

Webinars

802.11ah, Bluetooth LE, Zigbee and Wi-SUN Test for IoT/M2M

4/23/15

Keysight Logo    Keysight Technologies Webcast

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Webinars

Narrowband Combline Filter Design with ANSYS HFSS

4/23/15


Technical Education Webinar Series

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DOCUMENTS AND FILES

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.

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