COMSOL, the leading provider of multiphysics modeling and simulation software, announced the release of the COMSOL Multiphysics® software version 5.1, the first and only integrated simulation environment for building multiphysics models and for creating and sharing easy-to-use simulation apps.
Delcross Technologies announces the release of the EMIT (Electromagnetic Interference Toolkit) Version 4 software. EMIT V4.0 combines an analysis engine that is over 100x faster than the previous release, with intuitive new RF system configuration setup and EMI margin result views.
COMSOL, the leading provider of multiphysics simulation and analysis software, announced the opening of a new office in Moscow, Russia. The new office provides sales and support for the growing community of COMSOL Multiphysics® users in Russia. Services include local sales, technical support, training sessions, and on-site workshops, seminars and customer visits.
DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, announced the release of the most advanced version of Sherlock Automated Design Analysis™ software, version 4.0. The newest version of Sherlock allows users to model complex PCBs and components with exceptional detail, strengthening design decisions, saving significant time and money.
Keysight Technologies Inc. announced N7660B Signal Studio for multi-emitter scenario generation (MESG). The software provides aerospace/defense engineers with performance-optimized, Keysight-validated multi-emitter signals that they can download to one or more Keysight N5193A UXG agile signal generators for effective testing of electronic countermeasures (ECM) systems.
Computer Simulation Technology (CST) announces educational seats for CST EMC STUDIO, a simulation tool for electromagnetic compatibility (EMC) analysis, at the 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.
Linear Technology’s SmartMesh IP™ wireless sensor networking products now provide the ability to program industrial Internet of Things (IoT) applications directly on the embedded ARM Cortex-M3, running Micrium’s µC/OS-II real-time operating system.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.