Software/EDA Channel

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Anritsu Co. introduces TD-SCDMA signaling test capability for its industry-leading Rapid Test Designer (RTD) solution. The new software enables chipset and mobile device makers to reliably and cost-efficiently test their implementation of the 3G mobile communications standard used by China Mobile®, the world’s largest mobile network operator.

AWR, the innovation leader in high-frequency EDA software, has finalized the agendas and opened registration for the summer AWR Design Forums (ADF) 2013 being held in Seoul, Korea on Monday, July 8th and Tokyo, Japan on Friday, July 12th.

EMSCAN announced the release of a new RFX2 and RFxpert software release 4.0 to address MIMO testing. This improved RFX2 has the capability of calculating pattern correlation and envelope correlation in multi-antenna systems.

AWR Corp., the innovation leader in high-frequency EDA software and Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter-wave devices, announce the availability of Version 10.1 of the Modelithics COMPLETE Library of passive and active device models for AWR’s Microwave Office® high-frequency design software.

Mini-Circuits and Modelithics Inc. are working together to develop high-accuracy linear and non-linear models for selected surface-mount products. The latest offering includes three new X-Parameter* amplifier models for Mini-Circuits PHA-1+, GVA-62+ and GVA-63+ products.

Agilent Technologies Inc. introduced the latest addition to its repeater model library for quickly and accurately solving the challenge posed by signal distortion in the multigigabit-per-second regime.

Nuhertz Technologies has provided the capability to optimize synthesized filter circuits with the use of Modelithics® component models, along with Nuhertz filter design software. The Modelithics CLR Library available for AWR Corp.’s Microwave Office® provides the designer access to a huge library of proven-accuracy measurement- based highly scalable equivalent circuit models. 

Agilent Technologies Inc. announced the latest release of Electromagnetic Professional (EMPro), its 3-D electromagnetic simulation software.

Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed CAD/CAE design software, has joined the ODB++ Solutions Alliance as a demonstration of its continued support for unified CAD/CAM vendor file formats. For over 15 years, Intercept’s Pantheon PCB layout software has offered a variety of manufacturing file formats for its user base, and Intercept remains committed to continuing to support both legacy and new file formats.

Sonnet Software Inc. announces a new product, Blink™, which is an easy-to-use EDA environment for the analysis of on chip passive devices such as spiral inductors and MIM capacitors.

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Poor de-embedding can lead to both passivity and causality errors. In addition, high fixture loss may affect the accuracy and repeatability of de-embedding. Achieving accurate measurements at these higher frequencies offers the advantage of improved ability to locate discontinuities, impedance changes, and crosstalk issues.