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Software/EDA Channel

Software/EDA related topics


Modelithics Announces Two New Microwave Global Models for Würth Elektronik Inductor Families

Modelithics Inc. is pleased to announce the availability of two new Microwave Global Models™ for Würth Elektronik inductor families. As part of the Modelithics Vendor Partner (MVP) Program, Würth Elektronik and Modelithics collaborated to develop the advanced-feature models that offer substrate scalability, part value scalability and pad scalability.

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CST STUDIO SUITE 2017-Simulation at Every Scale

CST - Computer Simulation Technology AG (CST) previewed the upcoming version of its flagship electromagnetic (EM) simulation tool, CST STUDIO SUITE® 2017, at European Microwave Week 2016. CST STUDIO SUITE is used by engineers, designers and researchers in market-leading companies in industries including automotive, aerospace, defense, electronics, healthcare and telecommunications. CST’s Complete Technology approach to simulation means that CST STUDIO SUITE offers a range of both general purpose and specialized solvers for EM and multiphysics problems in one user-friendly interface

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Boonton introduces new real-time power sensors

Boonton, a Wireless Telecom Group company, introduced the new RTP4000 series of Real-Time True Average Power sensors. These sensors deliver a dynamic range from -60 to +20 dBm, a frequency range down to 6 kHz and an industry leading measurement rate of 100,000 measurements per second.  Built with Boonton’s Real-Time Power Processing™ technology which eliminates gaps in acquisition and provides zero measurement latency, RTP4000 sensors deliver lightning-fast performance in a compact USB form factor. 

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T-Tech Inc. announces release of IsoPro CNC2PCB software.

T-Tech Inc. the manufacturer of the Quick Circuit rapid prototyping system announces CNC2PCB®. The new software application allows you to output your DXF data, Gerber data, or NC Drill data to computer numerical control programs. By following the EIA RS-274 industry standard, the output from CNC2PCB allows you to fabricate your PCB or chassis on your milling center in your mechanical engineering department.

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Registration open for ADF 2016 Europe/NI AWR user group meeting at EuMW

The agenda has been set and registration opened for the sixth annual combined AWR Design Forum (ADF 2016) and NI AWR Software User Group meeting, being held during European Microwave Week (EuMW 2016) October 4-6 in London. ADF 2016 takes place on October 4 from 12:00 p.m. to 4:00 p.m. in ICC Capital Suite, Room 6 on Level 3.

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Modelithics and IPDiA develop models for 0201M ultra broadband silicon capacitor

Modelithics Inc. and IPDiA, have teamed up to develop Modelithics models for IPDiA’s high performance ultra broadband surface mount silicon capacitor. Modelithics and IPDiA worked closely as part of the Modelithics Vendor Partner (MVP) Program to characterize the 10 nF low profile (100 µm) capacitor (UBSC 935 152 492 510). 

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Training/User Meetings

COMSOL Training Courses

Training/User Meetings

FEKO Short Course

Bothell, WA
United States

Training/User Meetings

CST Workshops and Trainings

CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

FEKO Webinar Series 2015


We have covered some very interesting topics so far this year and the recordings of each is available here.  To keep up to date with our webinars subscribe to our bi-monthly newsletter and updates.

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Overview of FEKO Suite 7.0


Technical Education Webinar Series

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Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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2013 FEKO Webinar Archive


A wide range of topics were covered in this series. The hour long webinars were presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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Co-Simulation With Visual System Simulator and LabVIEW for Enhanced Signal Processing

This NI AWR Design Environment(TM) white paper describes co-simulation capabilities of Visual System Simulator(TM) (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.

Discover a Streamlined Path to Record and Playback

RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.


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