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Software/EDA Channel

Software/EDA related topics

ARTICLES

ANSYS to present info session on new 3D EM encrypted component models at IMS

ANSYS, a global leader in engineering simulation software, will host a special information session at the IEEE MTT-S  International Microwave Symposium (IMS2015) in room 102 BC of the Phoenix convention center on Thursday, May 21. The one hour session entitled, “Leveraging Protected IP with Encrypted 3D HFSS Components for Next Generation Wireless Design & Integration” will highlight a new patent pending capability for sharing high-fidelity electrical models used in high-frequency circuit and system simulations.


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Mentor Graphics' affordable, high-tech design solutions for independent engineers

Mentor Graphics Corp. announced the delivery of three new PADS® family products starting at unprecedented pricing of five thousand dollars to address the advancing needs of the independent engineer. The new PADS family provides for the wide spectrum of electronics complexity by combining ease of learning and use, characteristic of previous market-leading PADS products, with high-productivity design and analysis technologies and unprecedented price-performance value.


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National Instruments to showcase NI AWR software during IMS2015

NI (formerly AWR Corp.), will showcase NI AWR software throughout the International Microwave Symposium 2015 (IMS2015) in a number of ways. A preview of V12 NI AWR Design Environment™ software, including new load-pull and antenna features, as well as ease of use, speed enhancements and third-party integration flows, will be on display inside NI booth #2431. IMS2015 runs from May 17-22 in Phoenix.


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COMSOL releases COMSOL Multiphysics version 5.1

Software/EDA

COMSOL, the leading provider of multiphysics modeling and simulation software, announced the release of the COMSOL Multiphysics® software version 5.1, the first and only integrated simulation environment for building multiphysics models and for creating and sharing easy-to-use simulation apps.


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EVENTS

Training/User Meetings

COMSOL Training Courses

Training/User Meetings

FEKO events calender

Training/User Meetings

CST Workshops and Trainings

CST
CST Workshops and Trainings

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Training/User Meetings

ANSYS Global Events

DOCUMENTS AND FILES

Discover a Streamlined Path to Record and Playback

RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.

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