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Software/EDA Channel

Software/EDA related topics

ARTICLES

Delcross announces Savant™ Version 4.0 software

April 16, 2014

Delcross Technologies announced the Version 4.0 release of its Savant™ software for modeling the installed performance of antennas on electrically large vehicles. Among the many new features in this release are multi-bounce edge-diffraction rays that improve accuracy by modeling antenna interactions with shadowed portions of the platform, an integrated workflow with CST STUDIO SUITE® 2014 for importing full-wave antenna models for hybrid simulation, a new Scene Tree capability to enable articulated geometry assemblies and a new feature for generating parametric CAD models and platform parts.


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Cover Sistemi relies on AWR software to design UWB receiver from concept to final production

April 16, 2014

Cover Sistemi, an Italian electronics developer, used AWR software to design an ultra-wdeband (UWB) receiver from concept to final production in a single pass. Specifications were for a complete design starting from the antenna through to the entire RF/baseband analog chain down to the AD converter.


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National Instruments introduces USRP RIO next-generation wireless prototyping platform

April 16, 2014

National Instruments announced an integrated software defined radio solution for rapidly prototyping high-performance, multichannel wireless communication systems. The NI USRP RIO platform is built on the NI LabVIEW RIO architecture and combines a high-performance 2 x 2 multiple input, multiple output (MIMO) RF transceiver capable of transmitting and receiving signals from 50 MHz to 6 GHz with an open LabVIEW programmable FPGA architecture.


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Modelithics passes 10,000 mark with release of the Modelithics COMPLETE Library Version 11

April 11, 2014

Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter-wave devices, announces the release of The Modelithics COMPLETE Library V11 for Agilent Advanced Design System (ADS). The Modelithics COMPLETE Library offers the industry’s most comprehensive collection of advanced and highly scalable simulation models for passive components and non-linear models for active devices such as diodes, transistors, amplifiers and more. They are engineered to provide extensive design flexibility and reliably accurate design simulation results. 


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Nordic announces major new release of its Bluetooth low energy protocol stack for nRF51 Series

Software/EDA
April 8, 2014

Ultra low power (ULP) RF specialist Nordic Semiconductor ASA announces S110 SoftDevice v7.0, the next major release of its Bluetooth® low energy stack, for the nRF51822 Bluetooth low energy and 2.4GHz proprietary System-on-Chip (SoC) and the nRF51422 ANT™ and ANT/Bluetooth low energy multiprotocol SoCs.


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University of Rome graduate class uses Microwave Office to design a UWB impulse radar system for breath-activity monitoring

April 1, 2014

Sapienza University of Rome Professor Stefano Pisa supervised a graduate research project that used AWR’s Microwave Office® circuit design software to model, analyze, and design ultra wideband (UWB) radars for the novel use of remotely monitoring breath activity.


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Remcom announces update to wireless EM propagation software

Software/EDA
March 28, 2014

Remcom announces a new version of Wireless InSite®, its electromagnetic propagation software for the analysis of wireless communication systems. This version, Release 2.7.1, offers integration with the Geospatial Data Abstraction Library (GDAL), improving import processing and significantly expanding supported file formats.


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CST STUDIO SUITE Version 2014 - updated webinar series

March 18, 2014

Computer Simulation Technology AG (CST) announces a series of webinars to accompany the release of the 2014 version of CST STUDIO SUITE. The webinars will demonstrate the new features and tools available and their application to the areas of microwaves, RF and optical, EDA and EMC/EMI and low frequency simulations.


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Mentor Graphics launches new Xpedition platform to optimize advanced PCB systems design productivity

March 17, 2014

Mentor Graphics Corp. announced the first phase of a new systems design enterprise platform to address today’s printed circuit board (PCB) systems challenges of increased complexity, changing team demographics, and systems-aware design requirements. The Mentor Graphics Xpedition™ platform significantly simplifies and accelerates the development of the industry’s most challenging designs. By combining an intuitive design environment with designer-driven automation, the Xpedition platform addresses the changing responsibilities of designers, including global team-based organizations, so that users can perform at expert levels for optimum productivity. The result is shortened product development cycles, minimized design re-spins, and improved product quality. The first phase of the launch announces new Xpedition PCB layout technology.


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Rohde & Schwarz introduces software option for EMC tests in line with CISPR 35

March 17, 2014

Rohde & Schwarz will release the R&S EMC32-K35 option for its R&S EMC32 EMC test software when the CISPR 35 EMC standard for multimedia equipment is adopted this spring.


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EVENTS

FEKO WEBINAR SERIES 2014

4/2/14

Ranging from mid-March to mid-June, interesting and informative webinars have been assembled. Diverse area of topics will be covered. The webinars will be presented by our knowledgeable team of engineers at FEKO and hosted through 'GoToWebinar'.

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CST Workshops and Trainings

5/1/14

CST
CST Workshops and Trainings

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The Design of a 100 W, X-Band GaN PA Module

5/7/14

Agilent Technologies
Innovations in EDA Webcast Series

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Practical Antenna Design for Advanced Wireless Products

5/15/14

AWR Corp.
Technical Education Webinar Series

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DOCUMENTS AND FILES

RF/Microwave Design for MMICs, MCMs and Hybrid Modules

December 17, 2013
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave Office® design environment for MMICs, MCMs and modules.  Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed. 

RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

June 14, 2013
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.

Understanding and Correctly Predicting Critical Metrics for Wireless RF Links

December 15, 2012
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.

Leverage Circuit Envelope Simulation to Improve

June 1, 2012
Optimizing a PA design for one parameter invariably requires sacrifi cing the performance of another. This delicate balance between performance and effi ciency is not the only conundrum, because designers of 4G PAs must also contend with demands for greater instantaneous bandwidth. As a result, designers of next-generation PAs are relying on simulation more than ever before, and their tasks include frequency domain simulation, time domain simulation, and now circuit envelope simulation.

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