Software/EDA related topics
July 21, 2014
Computer Simulation Technology has announced the availability of Optenni Lab 3.0 through the worldwide CST sales network.
July 10, 2014
Mentor Graphics Corp. announced the acquisition of XS Embedded GmbH (XSe), a technology leader in the creation of automotive system architectures and hardware reference platforms.
July 8, 2014
Tech-X Corp. announces the release of VSim 7, an electromagnetic time-domain three-dimensional solver with particle and plasma simulation capabilities.
July 4, 2014
MAGUS (Pty) Ltd and Computer Simulation Technology AG (CST) have announced the release of Antenna Magus Version 5.0.
July 1, 2014
NI (formerly AWR Corp.) has published a new success story detailing how a University of Alberta, Canada graduate student successfully developed a modified top-of-the-barrier model for graphene field-effect transistors (GFETs) using NI AWR Design Environment™/Microwave Office® circuit design software.
June 25, 2014
Remcom, provider of electromagnetic simulation software and solutions, announces public training in Santa Clara, Calif. on August 11-14, 2014. The course will include two-day product tracks on the most recent releases of XFdtd® and Wireless InSite®. Students may choose to attend one or both product tracks.
June 24, 2014
Altair has completed its acquisition of 100 percent of EM Software & Systems – S.A. (Pty) Ltd and its international distributor offices in the United States, Germany, and China. This development adds the FEKO® solver to the HyperWorks® suite.
June 20, 2014
Agilent Technologies Inc. announced that the Agilent EEsof EDA W1462 SystemVue FPGA Architect now supports on-board FPGA design and simulation with the Agilent M9703A AXIe wideband digital receiver/digitizer.
DOCUMENTS AND FILES
December 17, 2013
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
June 14, 2013
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
December 15, 2012
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
June 1, 2012
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.