EMC/EMI

EMC/EMI (Electromagnetic Compatibility/Electromagnetic Interference) channel

ARTICLES

EDI CON China 2017 Announces Keynote and Panels

EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-27 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the keynote speaker for this year’s event will be Peter Rabbeni, Sr. Director RF BU Product Marketing at GLOBALFOUNDRIES. Rabbeni will bring his significant insights on semiconductor technology to bear on his talk entitled, “Technologies for the Next Wave of Mobile Data.”


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EDI CON USA 2017 Opens Call for Abstracts

RF/Microwave and High-Speed Digital Topics Welcome

EDI CON USA 2017 announces that this year’s call for abstracts (CFA) is now open. The EDI CON USA Technical Advisory Committee, event management team, and this year’s conference chairs, Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. and Istvan Novak, Senior Principal Engineer at Oracle, worked in conjunction to develop the CFA. 

 


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Keysight Technologies Addresses 400G/PAM-4 Test Challenges at DesignCon 2017

Keysight Technologies Inc. announced it will exhibit its latest high-speed digital solutions at DesignCon 2017, Booth 725, Santa Clara Convention Center, Feb. 1-2. Keysight's technical experts and application engineers will demonstrate the most advanced design and test solutions, developed for solving today's most difficult high-speed digital measurement challenges. Keysight is proud to be the host sponsor of DesignCon 2017.


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EDI CON USA Announces 2017 Conference Chairs

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team announced this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.


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Signal Integrity Journal Launches With Seven Industry Leading Sponsors

Signal Integrity Journal, a new sister publication to Microwave Journal covering signal integrity, power integrity and EMC/EMI related topics, has secured seven sponsors to start the new year. The Platinum Level sponsorships are sold out for 2017 with industry leaders Rohde & Schwarz, Anritsu, Mentor Graphics and CST filling the top sponsorship level. Joining them are Cadence and Samtec at the Gold Level and Passives Plus at the Silver Level.


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efabless Unveils Online Community to Reimagine Chip Design

efabless Corp., an open-innovation, hardware creation platform,  became the first online marketplace for community-developed, customized intellectual property (IP) and integrated circuits (ICs), allowing hardware system innovators to turn ideas into marketable products. Initially focused on analog and mixed-signal design for customized ICs, efabless addresses all of the steps required to cost effectively take an electronics specification to prototype.


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ART-Fi Announces All-In-One SAR System Validation Kit

ART-Fi's new the Power Monitoring Kit (PMK) solves some longstanding issues in SAR labs. It features advanced technologies usually found on more expensive RF validation and verification system combinations. Once setup, the customer inputs the expected power — any power, any frequency — and validates automatically. 


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DOCUMENTS AND FILES

EMC/EMI Applications in FEKO

Electromagnetic Compatibility (EMC) has become a key and sensitive topic for OEM’s and suppliers in many industries. Not only is it important to ensure electromagnetic problems will not occur when integrating components and devices in a system, but also to fulfil the related EMC regulations. FEKO is used for EMC to simulate problems related to Electromagnetic Interferences (EMI) and Electromagnetic Susceptibility or Immunity (EMS).